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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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Patents Grantslast 30 patents

Information Patent Grant
Method of making a three-dimensional memory device using composite...
- Patent number 12,261,080
- Issue date Mar 25, 2025
- SanDisk Technologies, Inc.
- Roshan Jayakhar Tirukkonda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,261,083
- Issue date Mar 25, 2025
- United Microelectronics Corp.
- Chia-Chen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with reduced contact resistance and methods of...
- Patent number 12,255,096
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Chiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench isolation structures with varying depths and method of formi...
- Patent number 12,255,200
- Issue date Mar 18, 2025
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Yong Wah See
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cap structure for interconnect dielectrics and methods of fabrication
- Patent number 12,249,577
- Issue date Mar 11, 2025
- Intel Corporation
- Shashi Vyas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with an interconnect structure in a...
- Patent number 12,249,542
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hao Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection structures for bonded wafers
- Patent number 12,243,772
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ssu-Chiang Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing semiconductor...
- Patent number 12,243,779
- Issue date Mar 4, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Shuangshuang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staircase formation in a memory array
- Patent number 12,245,426
- Issue date Mar 4, 2025
- Micron Technology, Inc.
- Alyssa N. Scarbrough
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,230,534
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure having air gap and methods of formin...
- Patent number 12,230,537
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Ya Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming backside power rails
- Patent number 12,224,324
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including active contacts and support conta...
- Patent number 12,224,240
- Issue date Feb 11, 2025
- Micron Technology, Inc.
- S M Istiaque Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device including self-aligned conductive contacts
- Patent number 12,218,008
- Issue date Feb 4, 2025
- Micron Technology, Inc.
- Kar Wui Thong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 12,217,960
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Min-Sung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a Fin at a S/D region and a semiconduct...
- Patent number 12,218,136
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Cheng Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,218,194
- Issue date Feb 4, 2025
- SK Hynix Inc.
- Hae Jung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and manufacturing method thereof, and three...
- Patent number 12,218,032
- Issue date Feb 4, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device
- Patent number 12,218,050
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Hsin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with a polysilicon structure above a stairc...
- Patent number 12,218,081
- Issue date Feb 4, 2025
- Lodestar Licensing Group LLC
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective ILD deposition for fully aligned via with airgap
- Patent number 12,218,003
- Issue date Feb 4, 2025
- Adeia Semiconductor Solutions LLC
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method for fabricating the same
- Patent number 12,211,845
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device comprising contact vo...
- Patent number 12,211,739
- Issue date Jan 28, 2025
- NANYA TECHNOLOGY CORPORATION
- Li-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture for embedded IC chip directly connected to PCB
- Patent number 12,213,258
- Issue date Jan 28, 2025
- AVERATEK CORPORATION
- Haris Basit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cell, integrated circuit, and manufacturing method of memory...
- Patent number 12,213,388
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,211,795
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Jinsub Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure and semiconductor structure
- Patent number 12,205,893
- Issue date Jan 21, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Tianlei Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid method for forming semiconductor interconnect structure
- Patent number 12,205,886
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Kang Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a manufacturing method thereof
- Patent number 12,199,014
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Kyeong Bin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,198,978
- Issue date Jan 14, 2025
- Sumitomo Electric Device Innovations, Inc.
- Shouhei Kitajima
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH-DENSITY THREE-DIMENSIONAL MEMORY DEVICE WITH INTERCONNECTION O...
- Publication number 20250105146
- Publication date Mar 27, 2025
- CHENGDU PBM TECHNOLOGY LTD.
- JACK ZEZHONG PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION OF GRAPHENE ON COBALT-CAPPED COPPER DUAL DAMAS...
- Publication number 20250096036
- Publication date Mar 20, 2025
- LAM RESEARCH CORPORATION
- Asish Parbatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A CONTACT
- Publication number 20250096040
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-ELECTROMAGNETIC INTERFERENCE WAFER STRUCTURE
- Publication number 20250096150
- Publication date Mar 20, 2025
- WALTON ADVANCED ENGINEERING INC.
- Chun Jung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Buried Interconnect Structure
- Publication number 20250096037
- Publication date Mar 20, 2025
- IMEC vzw
- Gaspard Hiblot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20250098211
- Publication date Mar 20, 2025
- Kabushiki Kaisha Toshiba
- Kohei OASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT RESISTANCE REDUCTION FOR TRANSISTORS
- Publication number 20250087491
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jui-Ping Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20250087535
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- HWEI-JAY CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250079315
- Publication date Mar 6, 2025
- WINBOND ELECTRONICS CORP.
- Jian-Ting CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR HIGH STRENGTH DIELECTRIC IN HYBRID BONDING
- Publication number 20250079312
- Publication date Mar 6, 2025
- Applied Materials, Inc.
- Tyler Sherwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING BOTTOM ELECTRODE VIA FOR MEMORY DEVICE
- Publication number 20250079299
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zhen Yu Guan
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250081542
- Publication date Mar 6, 2025
- WINBOND ELECTRONICS CORP.
- Yao-Ting TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING SEMICONDUCTOR DEVICES
- Publication number 20250072096
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Gi Woong SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICES AND ELECTRONIC...
- Publication number 20250069950
- Publication date Feb 27, 2025
- Micron Technology, Inc.
- Raja Kumar Varma Manthena
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR DEVICE INCLUDING A THROUGH-VIA STRU...
- Publication number 20250070029
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Junhyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN INTERCONNECT STRUCTURE HAVING AN AIR GAP AND S...
- Publication number 20250070027
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20250062232
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Chou Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...
- Publication number 20250062233
- Publication date Feb 20, 2025
- SK HYNIX INC.
- So Young YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL DEPOSITION OF SILICON NITRIDE
- Publication number 20250054747
- Publication date Feb 13, 2025
- LAM RESEARCH CORPORATION
- Awnish Gupta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBTRACTIVE METAL PATTERNING AND DAMASCENE-BASED INTERCONNECT
- Publication number 20250046703
- Publication date Feb 6, 2025
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING ISOLATION TRENCH, AND ISOLATION TRENCH
- Publication number 20250040203
- Publication date Jan 30, 2025
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xufeng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA FORMATION TO ENLARGE ELECTROCHEMICAL PLATING...
- Publication number 20250038076
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Ling Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING VIAS WITH DIFFERENT DIMENSIONS AND M...
- Publication number 20250029945
- Publication date Jan 23, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME
- Publication number 20250015185
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR RECTIFIER
- Publication number 20250015199
- Publication date Jan 9, 2025
- DIODES INCORPORATED
- Tao Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE SUPPRESSING LEAKAGE CURRENT...
- Publication number 20250014998
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- JUNGHOO SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES
- Publication number 20250017007
- Publication date Jan 9, 2025
- Micron Technology, Inc.
- Shuangqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SILICON OXYCARBIDE LINER...
- Publication number 20250006640
- Publication date Jan 2, 2025
- SANDISK TECHNOLOGIES LLC
- Ryota SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240429093
- Publication date Dec 26, 2024
- UNITED MICROELECTRONICS CORP.
- Chien-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT LAYER AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240420994
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Ling SU
- H01 - BASIC ELECTRIC ELEMENTS

in via holes or trenches

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of making a three-dimensional memory device using composite...

Semiconductor device and method for fabricating the same

Semiconductor device with reduced contact resistance and methods of...

Trench isolation structures with varying depths and method of formi...

Cap structure for interconnect dielectrics and methods of fabrication

Semiconductor device structure with an interconnect structure in a...

Protection structures for bonded wafers

Semiconductor structure and method for manufacturing semiconductor...

Staircase formation in a memory array

Semiconductor device and method of manufacture

Semiconductor device structure having air gap and methods of formin...

Method of forming backside power rails

Microelectronic devices including active contacts and support conta...

Memory device including self-aligned conductive contacts

Semiconductor devices and methods of manufacture

Semiconductor device having a Fin at a S/D region and a semiconduct...

Semiconductor device and method for fabricating the same

Semiconductor apparatus and manufacturing method thereof, and three...

Manufacturing method for semiconductor device

Microelectronic devices with a polysilicon structure above a stairc...

Selective ILD deposition for fully aligned via with airgap

Semiconductor device and a method for fabricating the same

Method for manufacturing semiconductor device comprising contact vo...

Method of manufacture for embedded IC chip directly connected to PCB

Memory cell, integrated circuit, and manufacturing method of memory...

Semiconductor device

Method for forming semiconductor structure and semiconductor structure

Hybrid method for forming semiconductor interconnect structure

Semiconductor device and a manufacturing method thereof

Method of manufacturing semiconductor device

Patents Applicationslast 30 patents

HIGH-DENSITY THREE-DIMENSIONAL MEMORY DEVICE WITH INTERCONNECTION O...

SELECTIVE DEPOSITION OF GRAPHENE ON COBALT-CAPPED COPPER DUAL DAMAS...

SEMICONDUCTOR DEVICE INCLUDING A CONTACT

ANTI-ELECTROMAGNETIC INTERFERENCE WAFER STRUCTURE

Method for Forming a Buried Interconnect Structure

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

CONTACT RESISTANCE REDUCTION FOR TRANSISTORS

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

METHODS AND STRUCTURES FOR HIGH STRENGTH DIELECTRIC IN HYBRID BONDING

METHOD OF FORMING BOTTOM ELECTRODE VIA FOR MEMORY DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

METHODS OF FABRICATING SEMICONDUCTOR DEVICES

MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICES AND ELECTRONIC...

THREE-DIMENSIONAL SEMICONDUCTOR DEVICE INCLUDING A THROUGH-VIA STRU...

METHOD OF FORMING AN INTERCONNECT STRUCTURE HAVING AN AIR GAP AND S...

CONDUCTIVE FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...

CONFORMAL DEPOSITION OF SILICON NITRIDE

SUBTRACTIVE METAL PATTERNING AND DAMASCENE-BASED INTERCONNECT

METHOD FOR FORMING ISOLATION TRENCH, AND ISOLATION TRENCH

THROUGH-SUBSTRATE VIA FORMATION TO ENLARGE ELECTROCHEMICAL PLATING...

SEMICONDUCTOR STRUCTURE HAVING VIAS WITH DIFFERENT DIMENSIONS AND M...

SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR RECTIFIER

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE SUPPRESSING LEAKAGE CURRENT...

METHODS OF FORMING MICROELECTRONIC DEVICES

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SILICON OXYCARBIDE LINER...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

INTERCONNECT LAYER AND METHOD FOR MANUFACTURING THE SAME