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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor interconnection structures and methods of forming the...
- Patent number 12,334,431
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remote plasma based deposition of silicon carbide films using silic...
- Patent number 12,334,332
- Issue date Jun 17, 2025
- Lam Research Corporation
- Bhadri N. Varadarajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor structure and method of making the same
- Patent number 12,334,393
- Issue date Jun 17, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jian Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with adjustment layers and method for fabricat...
- Patent number 12,327,793
- Issue date Jun 10, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory structure including low dielectric constant capping layer
- Patent number 12,328,868
- Issue date Jun 10, 2025
- NANYA TECHNOLOGY CORPORATION
- Jhen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including spacer layer contacting bit line bot...
- Patent number 12,315,766
- Issue date May 27, 2025
- SK hynix Inc.
- Kyung Min Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device with composite passivatio...
- Patent number 12,315,796
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures with deep trench isolation regions for a high-voltage fi...
- Patent number 12,317,557
- Issue date May 27, 2025
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Kyong Jin Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,315,734
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Li-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and manufacturing method thereof
- Patent number 12,315,761
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chung-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with liner structure
- Patent number 12,315,808
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascene structure in forming source/drain contacts
- Patent number 12,310,077
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor interconnection structure against...
- Patent number 12,308,310
- Issue date May 20, 2025
- NANYA TECHNOLOGY CORPORATION
- Sheng-Fu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device structure with fluorine-c...
- Patent number 12,308,290
- Issue date May 20, 2025
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure without barrier layer on bottom surface of via
- Patent number 12,308,282
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tz-Jun Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating semiconductor device
- Patent number 12,308,320
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Sung Jin Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation structure for preventing unintentional merging of epitaxi...
- Patent number 12,300,698
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ta-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact for thermal displacement in a multi-wafer stacked...
- Patent number 12,300,669
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ping-Tzu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glue layer etching for improving device performance and providing c...
- Patent number 12,300,536
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Hao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field effect transistor (FinFET) device structure with protecti...
- Patent number 12,300,538
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal low temperature hermetic dielectric diffusion barriers
- Patent number 12,300,537
- Issue date May 13, 2025
- Intel Corporation
- Sean King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,300,593
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,300,599
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Meng-Pei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with self-aligned vias
- Patent number 12,293,944
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,288,715
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hua Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with source/drain contact
- Patent number 12,288,822
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming method for semiconductor structure and semiconductor structure
- Patent number 12,283,519
- Issue date Apr 22, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chuxian Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manfacturing semiconductor device for reducing partcle-i...
- Patent number 12,278,142
- Issue date Apr 15, 2025
- NANYA TECHNOLOGY CORPORATION
- Li-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and method for forming the same
- Patent number 12,278,176
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming contact features in field-effect transistors
- Patent number 12,272,605
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsiung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250191974
- Publication date Jun 12, 2025
- UNITED MICROELECTRONICS CORP.
- Chia-Chen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...
- Publication number 20250192056
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250192044
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- YING-CHENG CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...
- Publication number 20250192055
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250192043
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- YING-CHENG CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH A POLYSILICON STRUCTURE ABOVE A STAIRC...
- Publication number 20250183196
- Publication date Jun 5, 2025
- Lodestar Licensing Group LLC
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Forming Backside Power Rails
- Publication number 20250185330
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING ACTIVE CONTACTS AND SUPPORT CONTACTS
- Publication number 20250174558
- Publication date May 29, 2025
- Micron Technology, Inc.
- S M Istiaque Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CELL, INTEGRATED CIRCUIT, AND MANUFACTURING METHOD OF MEMORY...
- Publication number 20250176442
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC CAPACITANCE, AND METHOD...
- Publication number 20250167042
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIAS WITH SELECTED GRAIN DISTRIBUTION
- Publication number 20250167046
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies, and Methods of Forming Integrated Assemblies
- Publication number 20250169072
- Publication date May 22, 2025
- Micron Technology, Inc.
- Gordon A. Haller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON COMPOUNDS AND METHODS OF MANUFACTURING INTEGRATED CIRCUIT D...
- Publication number 20250163081
- Publication date May 22, 2025
- DNF CO., LTD.
- Hyunwoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE BLOCKING OF METAL SURFACES USING N-HETEROCYCLIC CARBENES...
- Publication number 20250157855
- Publication date May 15, 2025
- Applied Materials, Inc.
- Bhaskar Jyoti Bhuyan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Forming Multiple TSVs with Different Formation Schemes
- Publication number 20250157889
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Fabricating Thereof
- Publication number 20250159966
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250149452
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- JINSUB KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOTE PLASMA BASED DEPOSITION OF SILICON CARBIDE FILMS USING SILIC...
- Publication number 20250149328
- Publication date May 8, 2025
- LAM RESEARCH CORPORATION
- Bhadri N. VARADARAJAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A FIN AT A S/D REGION AND A SEMICONDUCT...
- Publication number 20250142954
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Cheng Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH LOW CAPACITANCE AND HIGH THERMAL CONDUC...
- Publication number 20250140698
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ILD DEPOSITION FOR FULLY ALIGNED VIA WITH AIRGAP
- Publication number 20250140606
- Publication date May 1, 2025
- Adeia Semiconductor Solutions LLC
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL CONDUCTIVE BARRIER LAYER IN INTERCONNECT STRUCTURE
- Publication number 20250140607
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250132198
- Publication date Apr 24, 2025
- Samsung Electronics Co., LTD
- Yunho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL LINES LOCATED BETWEEN ETCH STOP LAYERS AND SEPARATED BY AIR G...
- Publication number 20250132301
- Publication date Apr 24, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Fumitaka AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD TO IMPROVE FAV RIE PROCESS MARGIN AND ELECTROM...
- Publication number 20250132199
- Publication date Apr 24, 2025
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20250132203
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Song Yi BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES FOR MONITORING PLASMA PROCESS-INDUCED DAMAGES
- Publication number 20250133770
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sze Hang Poon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OLIGOMER FILM FOR BOTTOM-UP GAP FILL PROCESSES
- Publication number 20250125195
- Publication date Apr 17, 2025
- Applied Materials, Inc.
- Feng Q. Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THICKENING LAYER AND METHOD FOR FABRICATI...
- Publication number 20250118664
- Publication date Apr 10, 2025
- NANYA TECHNOLOGY CORPORATION
- CHUN-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MEMORY STRUCTURES FOR THREE-DIMENSIONAL NONVOLAT...
- Publication number 20250118547
- Publication date Apr 10, 2025
- IMEC vzw
- Sana Rachidi
- H01 - BASIC ELECTRIC ELEMENTS

in via holes or trenches

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor interconnection structures and methods of forming the...

Remote plasma based deposition of silicon carbide films using silic...

Semiconductor structure and method of making the same

Semiconductor device with adjustment layers and method for fabricat...

Memory structure including low dielectric constant capping layer

Semiconductor device including spacer layer contacting bit line bot...

Method for preparing semiconductor device with composite passivatio...

Structures with deep trench isolation regions for a high-voltage fi...

Method for manufacturing semiconductor device

Interconnection structure and manufacturing method thereof

Semiconductor device with liner structure

Dual damascene structure in forming source/drain contacts

Method for forming semiconductor interconnection structure against...

Method for preparing semiconductor device structure with fluorine-c...

Interconnect structure without barrier layer on bottom surface of via

Semiconductor device and method for fabricating semiconductor device

Isolation structure for preventing unintentional merging of epitaxi...

Backside contact for thermal displacement in a multi-wafer stacked...

Glue layer etching for improving device performance and providing c...

Fin field effect transistor (FinFET) device structure with protecti...

Conformal low temperature hermetic dielectric diffusion barriers

Semiconductor device and method of manufacture

Method for forming semiconductor structure

Semiconductor device with self-aligned vias

Semiconductor device and manufacturing method thereof

Semiconductor device with source/drain contact

Forming method for semiconductor structure and semiconductor structure

Method for manfacturing semiconductor device for reducing partcle-i...

Integrated circuit structure and method for forming the same

Methods of forming contact features in field-effect transistors

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

MICROELECTRONIC DEVICES WITH A POLYSILICON STRUCTURE ABOVE A STAIRC...

Method Of Forming Backside Power Rails

MICROELECTRONIC DEVICES INCLUDING ACTIVE CONTACTS AND SUPPORT CONTACTS

MEMORY CELL, INTEGRATED CIRCUIT, AND MANUFACTURING METHOD OF MEMORY...

SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC CAPACITANCE, AND METHOD...

VIAS WITH SELECTED GRAIN DISTRIBUTION

Integrated Assemblies, and Methods of Forming Integrated Assemblies

SILICON COMPOUNDS AND METHODS OF MANUFACTURING INTEGRATED CIRCUIT D...

SELECTIVE BLOCKING OF METAL SURFACES USING N-HETEROCYCLIC CARBENES...

Forming Multiple TSVs with Different Formation Schemes

Semiconductor Device and Method of Fabricating Thereof

SEMICONDUCTOR DEVICE

REMOTE PLASMA BASED DEPOSITION OF SILICON CARBIDE FILMS USING SILIC...

SEMICONDUCTOR DEVICE HAVING A FIN AT A S/D REGION AND A SEMICONDUCT...

INTERCONNECT STRUCTURE WITH LOW CAPACITANCE AND HIGH THERMAL CONDUC...

SELECTIVE ILD DEPOSITION FOR FULLY ALIGNED VIA WITH AIRGAP

THERMAL CONDUCTIVE BARRIER LAYER IN INTERCONNECT STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METAL LINES LOCATED BETWEEN ETCH STOP LAYERS AND SEPARATED BY AIR G...

STRUCTURE AND METHOD TO IMPROVE FAV RIE PROCESS MARGIN AND ELECTROM...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES

SEMICONDUCTOR STRUCTURES FOR MONITORING PLASMA PROCESS-INDUCED DAMAGES

OLIGOMER FILM FOR BOTTOM-UP GAP FILL PROCESSES

SEMICONDUCTOR DEVICE WITH THICKENING LAYER AND METHOD FOR FABRICATI...

METHODS OF FORMING MEMORY STRUCTURES FOR THREE-DIMENSIONAL NONVOLAT...