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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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Industries

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of semiconductor structure comprising a gap an...
- Patent number 12,368,074
- Issue date Jul 22, 2025
- CHANGXI MEMORY TECHNOLOGIES, INC.
- Ting Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures for reducing electrical shorts and methods of fo...
- Patent number 12,368,097
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-assembled dielectric on metal rie lines to increase reliability
- Patent number 12,362,231
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal deposition of silicon carbide films using heterogeneous p...
- Patent number 12,359,311
- Issue date Jul 15, 2025
- Lam Research Corporation
- Matthew Scott Weimer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of producing a semiconductor body with a trench, semiconduct...
- Patent number 12,362,230
- Issue date Jul 15, 2025
- ams AG
- Georg Parteder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structures and methods of fabrication thereof
- Patent number 12,362,273
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jun-Nan Nian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-forming embedded diffusion barriers
- Patent number RE50494
- Issue date Jul 15, 2025
- TESSERA LLC
- Cyril Cabral
Information Patent Grant
Method for fabricating inductor module
- Patent number 12,363,921
- Issue date Jul 15, 2025
- United Microelectronics Corporation
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including standard cells and at least one capaci...
- Patent number 12,356,725
- Issue date Jul 8, 2025
- STMicroelectronics (Rousset) SAS
- Abderrezak Marzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 12,354,956
- Issue date Jul 8, 2025
- Tahoe Research, LTD.
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,354,961
- Issue date Jul 8, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Shih-Ping Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure for semiconductor device
- Patent number 12,354,913
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun-Yu Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer features
- Patent number 12,354,959
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Chun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface modification layer for conductive feature formation
- Patent number 12,347,724
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian-Jou Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatment of spin on organic material to improve wet resistance
- Patent number 12,347,727
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tzu-Yang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inter block for recessed contacts and methods forming same
- Patent number 12,349,395
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with material modification and low resistan...
- Patent number 12,347,725
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal A. Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of forming the same
- Patent number 12,347,726
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Ren Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap through at least two metal layers
- Patent number 12,341,058
- Issue date Jun 24, 2025
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Wei-Hui Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up fill dielectric materials for semiconductor structure fab...
- Patent number 12,341,061
- Issue date Jun 24, 2025
- Intel Corporation
- Florian Gstrein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar slab vias for integrated circuit interconnects
- Patent number 12,341,092
- Issue date Jun 24, 2025
- Intel Corporation
- Elijah Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnection structures and methods of forming the...
- Patent number 12,334,431
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remote plasma based deposition of silicon carbide films using silic...
- Patent number 12,334,332
- Issue date Jun 17, 2025
- Lam Research Corporation
- Bhadri N. Varadarajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor structure and method of making the same
- Patent number 12,334,393
- Issue date Jun 17, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jian Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with adjustment layers and method for fabricat...
- Patent number 12,327,793
- Issue date Jun 10, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory structure including low dielectric constant capping layer
- Patent number 12,328,868
- Issue date Jun 10, 2025
- NANYA TECHNOLOGY CORPORATION
- Jhen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including spacer layer contacting bit line bot...
- Patent number 12,315,766
- Issue date May 27, 2025
- SK hynix Inc.
- Kyung Min Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device with composite passivatio...
- Patent number 12,315,796
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures with deep trench isolation regions for a high-voltage fi...
- Patent number 12,317,557
- Issue date May 27, 2025
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Kyong Jin Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with liner structure
- Patent number 12,315,808
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING METAL STRUCTURE HAVING FUNNEL-SHAPED INTERC...
- Publication number 20250239519
- Publication date Jul 24, 2025
- NANYA TECHNOLOGY CORPORATION
- MIN-CHUNG CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING CONTACT FEATURES IN FIELD-EFFECT TRANSISTORS
- Publication number 20250241052
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Hsiung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED CONTACTS
- Publication number 20250239486
- Publication date Jul 24, 2025
- Intel Corporation
- Mark T. BOHR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING SELF-ALIGNED CONDUCTIVE CONTACTS
- Publication number 20250239485
- Publication date Jul 24, 2025
- Micron Technology, Inc.
- Kar Wui Thong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL WIRING OF A SEMICONDUCTOR COMPONENT
- Publication number 20250239489
- Publication date Jul 24, 2025
- Siemens Healthineers AG
- Michael HOSEMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SELF-ALIGNED VIAS
- Publication number 20250239487
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO CARBON LAYER ETCH WITH IMPROVED THROUGHPUT AND PR...
- Publication number 20250232981
- Publication date Jul 17, 2025
- TOKYO ELECTRON LIMITED
- Du Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING INTERCONNECT STRUCTURES
- Publication number 20250233015
- Publication date Jul 17, 2025
- Applied Materials, Inc.
- Bhaskar Jyoti Bhuyan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250233012
- Publication date Jul 17, 2025
- WINBOND ELECTRONICS CORP.
- Hung-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250234607
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Hsuan Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Structure For Semiconductor Device
- Publication number 20250226263
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun-Yu HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH IMPROVED METAL-FILLING QUALITY OF METAL G...
- Publication number 20250226307
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuting CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA REVEAL PROCESSING AND STRUCTURES
- Publication number 20250218903
- Publication date Jul 3, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250218865
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Hua CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING INTERCONNECT STRUCTURES INCLUDING LOW DIELECTRIC...
- Publication number 20250218866
- Publication date Jul 3, 2025
- ASM IP HOLDING B.V.
- Ivo Johannes Raaijmakers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES WITH TRENCH CONTACT SPACER STRUCTURE
- Publication number 20250210510
- Publication date Jun 26, 2025
- Intel Corporation
- Rohan BAMBERY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURE OF A SEMICONDUCTOR DEVICE
- Publication number 20250201627
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- U-Ting Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250191974
- Publication date Jun 12, 2025
- UNITED MICROELECTRONICS CORP.
- Chia-Chen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...
- Publication number 20250192056
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250192044
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- YING-CHENG CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...
- Publication number 20250192055
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250192043
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- YING-CHENG CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH A POLYSILICON STRUCTURE ABOVE A STAIRC...
- Publication number 20250183196
- Publication date Jun 5, 2025
- Lodestar Licensing Group LLC
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Forming Backside Power Rails
- Publication number 20250185330
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING ACTIVE CONTACTS AND SUPPORT CONTACTS
- Publication number 20250174558
- Publication date May 29, 2025
- Micron Technology, Inc.
- S M Istiaque Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CELL, INTEGRATED CIRCUIT, AND MANUFACTURING METHOD OF MEMORY...
- Publication number 20250176442
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC CAPACITANCE, AND METHOD...
- Publication number 20250167042
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIAS WITH SELECTED GRAIN DISTRIBUTION
- Publication number 20250167046
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies, and Methods of Forming Integrated Assemblies
- Publication number 20250169072
- Publication date May 22, 2025
- Micron Technology, Inc.
- Gordon A. Haller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON COMPOUNDS AND METHODS OF MANUFACTURING INTEGRATED CIRCUIT D...
- Publication number 20250163081
- Publication date May 22, 2025
- DNF CO., LTD.
- Hyunwoo Kim
- H01 - BASIC ELECTRIC ELEMENTS

in via holes or trenches

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method of semiconductor structure comprising a gap an...

Contact structures for reducing electrical shorts and methods of fo...

Self-assembled dielectric on metal rie lines to increase reliability

Conformal deposition of silicon carbide films using heterogeneous p...

Method of producing a semiconductor body with a trench, semiconduct...

Conductive structures and methods of fabrication thereof

Self-forming embedded diffusion barriers

Method for fabricating inductor module

Integrated circuit including standard cells and at least one capaci...

Cobalt based interconnects and methods of fabrication thereof

Semiconductor structure and manufacturing method thereof

Contact structure for semiconductor device

Redistribution layer features

Surface modification layer for conductive feature formation

Treatment of spin on organic material to improve wet resistance

Inter block for recessed contacts and methods forming same

Semiconductor structure with material modification and low resistan...

Interconnect structures and methods of forming the same

Air gap through at least two metal layers

Bottom-up fill dielectric materials for semiconductor structure fab...

Planar slab vias for integrated circuit interconnects

Semiconductor interconnection structures and methods of forming the...

Remote plasma based deposition of silicon carbide films using silic...

Semiconductor structure and method of making the same

Semiconductor device with adjustment layers and method for fabricat...

Memory structure including low dielectric constant capping layer

Semiconductor device including spacer layer contacting bit line bot...

Method for preparing semiconductor device with composite passivatio...

Structures with deep trench isolation regions for a high-voltage fi...

Semiconductor device with liner structure

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING METAL STRUCTURE HAVING FUNNEL-SHAPED INTERC...

METHODS OF FORMING CONTACT FEATURES IN FIELD-EFFECT TRANSISTORS

SELF-ALIGNED CONTACTS

MEMORY DEVICE INCLUDING SELF-ALIGNED CONDUCTIVE CONTACTS

VERTICAL WIRING OF A SEMICONDUCTOR COMPONENT

SEMICONDUCTOR DEVICE WITH SELF-ALIGNED VIAS

HIGH ASPECT RATIO CARBON LAYER ETCH WITH IMPROVED THROUGHPUT AND PR...

METHODS OF MANUFACTURING INTERCONNECT STRUCTURES

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

Contact Structure For Semiconductor Device

SEMICONDUCTOR DEVICE WITH IMPROVED METAL-FILLING QUALITY OF METAL G...

VIA REVEAL PROCESSING AND STRUCTURES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHODS OF FORMING INTERCONNECT STRUCTURES INCLUDING LOW DIELECTRIC...

INTEGRATED CIRCUIT STRUCTURES WITH TRENCH CONTACT SPACER STRUCTURE

CONDUCTIVE FEATURE OF A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

MICROELECTRONIC DEVICES WITH A POLYSILICON STRUCTURE ABOVE A STAIRC...

Method Of Forming Backside Power Rails

MICROELECTRONIC DEVICES INCLUDING ACTIVE CONTACTS AND SUPPORT CONTACTS

MEMORY CELL, INTEGRATED CIRCUIT, AND MANUFACTURING METHOD OF MEMORY...

SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC CAPACITANCE, AND METHOD...

VIAS WITH SELECTED GRAIN DISTRIBUTION

Integrated Assemblies, and Methods of Forming Integrated Assemblies

SILICON COMPOUNDS AND METHODS OF MANUFACTURING INTEGRATED CIRCUIT D...