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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76831in via holes or trenches

Industries

Patents Grantslast 30 patents

Information Patent Grant
Self-assembled monolayer for selective deposition
- Patent number 11,967,523
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Xiangjin Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inter block for recessed contacts and methods forming same
- Patent number 11,967,622
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain contact having a protruding segment
- Patent number 11,968,817
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jui-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and manufacturing method thereof
- Patent number 11,967,526
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective tungsten deposition at low temperatures
- Patent number 11,967,525
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Yi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch damage and ESL free dual damascene metal interconnect
- Patent number 11,955,376
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,955,428
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsin-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for preparing semiconductor device
- Patent number 11,955,371
- Issue date Apr 9, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jingwen Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure with anti-adhesion layer
- Patent number 11,948,835
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for forming dual metal interconnects
- Patent number 11,948,885
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Suketu A Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer light detecting device and electronic apparatus
- Patent number 11,948,833
- Issue date Apr 2, 2024
- Sony Group Corporation
- Masaki Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of metal films with tungsten liner
- Patent number 11,948,836
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Yu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface modification layer for conductive feature formation
- Patent number 11,942,362
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian-Jou Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of a protective layer to reduce interconnect s...
- Patent number 11,942,364
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pedestal-based pocket integration process for embedded memory
- Patent number 11,942,133
- Issue date Mar 26, 2024
- Kepler Computing Inc.
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming stacked layers and devices formed thereof
- Patent number 11,942,363
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact features of semiconductor devices
- Patent number 11,935,786
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsui-Ling Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor devices
- Patent number 11,935,835
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Hyo-Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having improved electrical characteristics an...
- Patent number 11,929,324
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Taejin Park
- G11 - INFORMATION STORAGE
Information Patent Grant
Barrier structure on interconnect wire to increase processing windo...
- Patent number 11,923,293
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Chieh Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single diffusion cut for gate structures
- Patent number 11,923,248
- Issue date Mar 5, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Hui Zang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having air gaps and method for manufacturin...
- Patent number 11,923,243
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vias for cobalt-based interconnects and methods of fabrication thereof
- Patent number 11,908,735
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising cap layer over dielectric layer and...
- Patent number 11,908,792
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device structure with lining layer
- Patent number 11,908,693
- Issue date Feb 20, 2024
- NANYA TECHNOLOGY CORPORATION
- Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric film for semiconductor fabrication
- Patent number 11,901,295
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,901,392
- Issue date Feb 13, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Masaki Haneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor having a source/drain contact with a single inner spacer
- Patent number 11,901,434
- Issue date Feb 13, 2024
- QUALCOMM Incorporated
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a FinFET by implanting a dielectric with a...
- Patent number 11,901,455
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bilayer seal material for air gaps in semiconductor devices
- Patent number 11,901,220
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER DISTRIBUTION NETWORK WITH BACKSIDE POWER RAIL
- Publication number 20240128191
- Publication date Apr 18, 2024
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240120272
- Publication date Apr 11, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Wei-Hao LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING HIGH ASPECT RATIO FEATURES
- Publication number 20240120237
- Publication date Apr 11, 2024
- Lodestar Licensing Group LLC
- Ken Tokashiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240120279
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- Jeong Hyuk YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INNER SPACER RELIABILITY MACRO DESIGN AND WELL CONTACT FORMATION
- Publication number 20240113200
- Publication date Apr 4, 2024
- International Business Machines Corporation
- HUIMEI ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240105507
- Publication date Mar 28, 2024
- SK HYNIX INC.
- Nam Jae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATOR
- Publication number 20240105592
- Publication date Mar 28, 2024
- Kabushiki Kaisha Toshiba
- Masaki YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device, Method and Machine of Manufacture
- Publication number 20240093357
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jen-Chun Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONTACT FEATURE AND METHOD OF FABRICATI...
- Publication number 20240096971
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xusheng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20240096796
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Yongjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING EDGE SEAL AND METHOD OF MAKING THEREOF...
- Publication number 20240096694
- Publication date Mar 21, 2024
- SANDISK TECHNOLOGIES LLC
- Kazuto WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ILD DEPOSITION FOR FULLY ALIGNED VIA WITH AIRGAP
- Publication number 20240096693
- Publication date Mar 21, 2024
- TESSERA LLC
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING EDGE SEAL AND METHOD OF MAKING THEREOF...
- Publication number 20240096695
- Publication date Mar 21, 2024
- SANDISK TECHNOLOGIES LLC
- Michiaki SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH MATERIAL MODIFICATION AND LOW RESISTAN...
- Publication number 20240087952
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Mrunal A. Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET ETCH PROCESS AND METHODS TO FORM AIR GAPS BETWEEN METAL INTERCO...
- Publication number 20240087950
- Publication date Mar 14, 2024
- TOKYO ELECTRON LIMITED
- Shan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Structure with Interconnect Structure and Meth...
- Publication number 20240087951
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hao Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Large Surface VBPR for Robust Alignment in Advanced Technology Nodes
- Publication number 20240087957
- Publication date Mar 14, 2024
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240088019
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIA CHEN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE-VIA WITH REENTRANT PROFILE
- Publication number 20240087988
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Ling Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20240079255
- Publication date Mar 7, 2024
- United Semiconductor (Xiamen) Co., Ltd.
- Ji He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING CONTACT STRUCTURES, AND RELATED M...
- Publication number 20240079322
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Darwin A. Clampitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE INTERCONNECT FEATURES AND METHOD FOR MANUFACTURING T...
- Publication number 20240071822
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Lung CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES INCLUDING STAIR STEP STR...
- Publication number 20240071930
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Harsh Narendrakumar Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SKIP VIA WITH LOCALIZED SPACER
- Publication number 20240071904
- Publication date Feb 29, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20240071919
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Mohad Baboli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT PLUGS AND METHODS FORMING SAME
- Publication number 20240072155
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Hua Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS MITIGATION FOR THREE-DIMENSIONAL METAL CONTACTS
- Publication number 20240071819
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Chandra S. Tiwari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20240071905
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Martin J. Barclay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE FORMATION IN A MEMORY ARRAY
- Publication number 20240071502
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Alyssa N. Scarbrough
- G11 - INFORMATION STORAGE
Information Patent Application
INTERCONNECT STRUCTURE FOR SEMICONDUCTOR DEVICE AND RELATED METHODS
- Publication number 20240071820
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- Yu-Shan Yeh
- H01 - BASIC ELECTRIC ELEMENTS

in via holes or trenches

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Self-assembled monolayer for selective deposition

Inter block for recessed contacts and methods forming same

Source/drain contact having a protruding segment

Integrated circuit structure and manufacturing method thereof

Selective tungsten deposition at low temperatures

Etch damage and ESL free dual damascene metal interconnect

Semiconductor structure and manufacturing method thereof

Semiconductor device and method for preparing semiconductor device

Interconnection structure with anti-adhesion layer

Methods and apparatus for forming dual metal interconnects

Multilayer light detecting device and electronic apparatus

Deposition of metal films with tungsten liner

Surface modification layer for conductive feature formation

Selective deposition of a protective layer to reduce interconnect s...

Pedestal-based pocket integration process for embedded memory

Methods for forming stacked layers and devices formed thereof

Contact features of semiconductor devices

Methods of manufacturing semiconductor devices

Semiconductor devices having improved electrical characteristics an...

Barrier structure on interconnect wire to increase processing windo...

Single diffusion cut for gate structures

Semiconductor structure having air gaps and method for manufacturin...

Vias for cobalt-based interconnects and methods of fabrication thereof

Semiconductor device comprising cap layer over dielectric layer and...

Method for preparing semiconductor device structure with lining layer

Dielectric film for semiconductor fabrication

Semiconductor device and method of manufacturing semiconductor device

Semiconductor having a source/drain contact with a single inner spacer

Method of manufacturing a FinFET by implanting a dielectric with a...

Bilayer seal material for air gaps in semiconductor devices

Patents Applicationslast 30 patents

POWER DISTRIBUTION NETWORK WITH BACKSIDE POWER RAIL

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

MICROELECTRONIC DEVICES INCLUDING HIGH ASPECT RATIO FEATURES

SEMICONDUCTOR DEVICE

INNER SPACER RELIABILITY MACRO DESIGN AND WELL CONTACT FORMATION

SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

ISOLATOR

Semiconductor Device, Method and Machine of Manufacture

SEMICONDUCTOR DEVICE HAVING CONTACT FEATURE AND METHOD OF FABRICATI...

INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICE HAVING EDGE SEAL AND METHOD OF MAKING THEREOF...

SELECTIVE ILD DEPOSITION FOR FULLY ALIGNED VIA WITH AIRGAP

SEMICONDUCTOR DEVICE HAVING EDGE SEAL AND METHOD OF MAKING THEREOF...

SEMICONDUCTOR STRUCTURE WITH MATERIAL MODIFICATION AND LOW RESISTAN...

WET ETCH PROCESS AND METHODS TO FORM AIR GAPS BETWEEN METAL INTERCO...

Semiconductor Device Structure with Interconnect Structure and Meth...

Large Surface VBPR for Robust Alignment in Advanced Technology Nodes

CONNECTING STRUCTURE AND METHOD FOR FORMING THE SAME

THROUGH-SUBSTRATE-VIA WITH REENTRANT PROFILE

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

MICROELECTRONIC DEVICES INCLUDING CONTACT STRUCTURES, AND RELATED M...

LOW RESISTANCE INTERCONNECT FEATURES AND METHOD FOR MANUFACTURING T...

METHODS OF FORMING MICROELECTRONIC DEVICES INCLUDING STAIR STEP STR...

SKIP VIA WITH LOCALIZED SPACER

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...

CONTACT PLUGS AND METHODS FORMING SAME

STRESS MITIGATION FOR THREE-DIMENSIONAL METAL CONTACTS

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...

STAIRCASE FORMATION IN A MEMORY ARRAY

INTERCONNECT STRUCTURE FOR SEMICONDUCTOR DEVICE AND RELATED METHODS