in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Industry

CPC
H05K3/10

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a device substrate
- Patent number 12,317,423
- Issue date May 27, 2025
- AUO Corporation
- Chun-Yueh Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for preparing internal laser induced carbonization layer of...
- Patent number 12,305,012
- Issue date May 20, 2025
- Jiangsu University
- Yunxia Ye
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical module assembly, optical module, package for optical module...
- Patent number 12,309,917
- Issue date May 20, 2025
- Sumitomo Electric Industries, Ltd.
- Taichi Misawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin film-based microfluidic electronic device, method of forming t...
- Patent number 12,302,505
- Issue date May 13, 2025
- Singapore University of Technology and Design
- Kento Yamagishi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wiring substrate
- Patent number 12,302,493
- Issue date May 13, 2025
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluid connection and fluid heating device
- Patent number 12,292,147
- Issue date May 6, 2025
- Hutchinson
- Ksenia Astafyeva
- F01 - MACHINES OR ENGINES IN GENERAL ENGINE PLANTS IN GENERAL STEAM ENGINES
Information Patent Grant
Method for manufacturing an electronic device
- Patent number 12,295,107
- Issue date May 6, 2025
- Innolux Corporation
- Yu-Chia Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with partially metallized hole using anti-plating...
- Patent number 12,295,108
- Issue date May 6, 2025
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Jiangfeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing circuits of substrate of display device
- Patent number 12,295,106
- Issue date May 6, 2025
- TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Tong Deng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component, manufacturing method thereof, and electronic...
- Patent number 12,292,657
- Issue date May 6, 2025
- Canon Kabushiki Kaisha
- Jun Tsukano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid circuit board
- Patent number 12,282,053
- Issue date Apr 22, 2025
- COBHAM ADVANCED ELECTRONIC SOLUTIONS INC.
- Mark Bates
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wiring board, wiring board, method for man...
- Patent number 12,284,767
- Issue date Apr 22, 2025
- Fujikura Ltd.
- Kazutoshi Koshimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and display device
- Patent number 12,279,378
- Issue date Apr 15, 2025
- Kyocera Corporation
- Nobuyuki Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with plurality of condctor patterns and vias
- Patent number 12,279,364
- Issue date Apr 15, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Woong Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical module assembly, optical module, package for optical module...
- Patent number 12,273,991
- Issue date Apr 8, 2025
- Sumitomo Electric Industries, Ltd.
- Taichi Misawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with anti-corrosion properties and electronic device...
- Patent number 12,267,963
- Issue date Apr 1, 2025
- Champ Tech Optical (Foshan) Corporation
- Li-Ping Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and systems for fabricating 3D multielectrode arrays with 3...
- Patent number 12,245,369
- Issue date Mar 4, 2025
- University of Oregon
- Timothy Gardner
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Ultra-thin composite transparent conductive film and preparation me...
- Patent number 12,245,371
- Issue date Mar 4, 2025
- IVTOUCH CO., LTD.
- Xiaohong Zhou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three-dimensional molding machine
- Patent number 12,245,378
- Issue date Mar 4, 2025
- FUJI CORPORATION
- Akihiro Kawajiri
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Method of preparing a high density interconnect printed circuit boa...
- Patent number 12,245,383
- Issue date Mar 4, 2025
- Atotech Deutschland GmbH & Co. KG
- Bert Reents
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for manufacturing component embedded circuit board
- Patent number 12,238,871
- Issue date Feb 25, 2025
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Yong-Chao Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection method for chip and circuit board, and circuit board ass...
- Patent number 12,232,266
- Issue date Feb 18, 2025
- INTELLIMICRO MEDICAL CO., LTD.
- Yu-chong Tai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of fabricating the same
- Patent number 12,232,273
- Issue date Feb 18, 2025
- LG Innotek Co., Ltd
- Yun Mi Bae
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Aluminum/ceramic bonding substrate and method for producing same
- Patent number 12,221,389
- Issue date Feb 11, 2025
- Dowa Metaltech Co., Ltd.
- Koji Kobayashi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Conductive garment fastening product
- Patent number 12,201,167
- Issue date Jan 21, 2025
- Prym Intimates Group Limited
- Heenatikumbure Kavisekara Mudiyanselage Anjana Piushan Kavisekara
- A41 - WEARING APPAREL
Information Patent Grant
Chemical solution used for cleaning or etching ruthenium-containing...
- Patent number 12,187,943
- Issue date Jan 7, 2025
- Tokyo Ohka Kogyo Co., Ltd.
- Yukihisa Wada
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Printed circuit board having embedded component
- Patent number 12,185,478
- Issue date Dec 31, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring formation method and transfer mold manufacturing method
- Patent number 12,181,796
- Issue date Dec 31, 2024
- CONNECTEC JAPAN CORPORATION
- Hiroshi Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 12,177,978
- Issue date Dec 24, 2024
- Toppan Printing Co., Ltd.
- Jun Onohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,167,540
- Issue date Dec 10, 2024
- LG Innotek Co., Ltd
- Eui Yeol Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR CUSTOMIZED SESMICONDIUCTOR PACKAGING, SERVER, SYSTEM...
- Publication number 20250185178
- Publication date Jun 5, 2025
- UNIST (ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)
- Jimin Kwon
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250176103
- Publication date May 29, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sanghyeok Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING ME...
- Publication number 20250159815
- Publication date May 15, 2025
- Resonac Corporation
- Masashi OHKOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLYMER-CONDUCTOR MATRIX ELECTRICAL INTERCONNECT
- Publication number 20250151204
- Publication date May 8, 2025
- Worcester Polytechnic Institute
- Pratap Rao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CIRCUIT FORMATION METHOD, AND ELECTRICAL CIRCUIT FORMATI...
- Publication number 20250142734
- Publication date May 1, 2025
- FUJI CORPORATION
- Kenji TSUKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COIL CARRIER BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250142728
- Publication date May 1, 2025
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250126703
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seung Min Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COIL DEVICE AND PRINTED WIRING BOARD
- Publication number 20250107001
- Publication date Mar 27, 2025
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Michi OGATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GENERATION OF RANDOM SECURITY CIRCUIT PATTERNS FOR IN-SITU FABRICAT...
- Publication number 20250089174
- Publication date Mar 13, 2025
- International Business Machines Corporation
- Hongqing ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier with Rough Surface and Smooth Surface Metal Trace...
- Publication number 20250081330
- Publication date Mar 6, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Patrick LENHARDT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE CIRCUIT BOARD ASSEMBLY AND METHOD FOR MANUFACTURING THE...
- Publication number 20250071890
- Publication date Feb 27, 2025
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHAO WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD
- Publication number 20250071896
- Publication date Feb 27, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seong Ho CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods And Systems Of Forming Metal Interconnect Layers Using Engi...
- Publication number 20250069900
- Publication date Feb 27, 2025
- Rashid Mavliev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FLEXIBLE TRANSPARENT WIRING BOARD AND METHOD FOR MANUFACTURING FLEX...
- Publication number 20250056728
- Publication date Feb 13, 2025
- NIPPON MEKTRON, LTD.
- Akihiro NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME
- Publication number 20250056715
- Publication date Feb 13, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Chao WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARCHITECTED LIQUID METAL NETWORKS AND PROCESSES OF MAKING AND USING...
- Publication number 20250040041
- Publication date Jan 30, 2025
- Government of the United States as Represented by the Secretary of the Air Force
- Carl J. Thrasher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20250031306
- Publication date Jan 23, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Xiao-Juan ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED STRUCTURE, AND METHOD FOR MANUFACTURING LAMINATED STRUCTURE
- Publication number 20250031319
- Publication date Jan 23, 2025
- Panasonic Holdings Corporation
- HIROKI KITAGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250016921
- Publication date Jan 9, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sang Ho JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED ARTICLE INCLUDING ELECTRICALLY CONDUCTIVE ELEMENTS
- Publication number 20250016916
- Publication date Jan 9, 2025
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND MECHANISMS FOR MAINTAINING AN ELECTRO-ACTIVE POLYMER IN...
- Publication number 20250016932
- Publication date Jan 9, 2025
- ElastiMed Ltd.
- Omer Zelka
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240431030
- Publication date Dec 26, 2024
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Michi OGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD MANUFACTURING PROCESS AND PRINTED CIRCUIT BOARD
- Publication number 20240431034
- Publication date Dec 26, 2024
- Gebr. Schmid GmbH
- Christian Schmid
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20240421471
- Publication date Dec 19, 2024
- DAI NIPPON PRINTING CO., LTD.
- Koichi SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTRA-PAIR SKEW COMPENSATION OF DIFFERENTIAL SIGNALS
- Publication number 20240407093
- Publication date Dec 5, 2024
- Achronix Semiconductor Corporation
- Hansel Desmond Dsilva
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRACE ARRANGEMENT FOR PRINTED CIRCUIT BOARD
- Publication number 20240381526
- Publication date Nov 14, 2024
- Cisco Technology, Inc.
- Shadi Ebrahimi Asl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICALLY CONDUCTIVE FILM AND METHOD FOR MANUFACTURING SAME, AND...
- Publication number 20240349425
- Publication date Oct 17, 2024
- TDK Corporation
- Yoshihisa TAMAGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240341034
- Publication date Oct 10, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD
- Publication number 20240341039
- Publication date Oct 10, 2024
- Resonac Corporation
- Kei TOGASAKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...
- Publication number 20240341042
- Publication date Oct 10, 2024
- Atotech Deutschland GmbH & Co. KG
- Bert REENTS
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing a device substrate

Method for preparing internal laser induced carbonization layer of...

Optical module assembly, optical module, package for optical module...

Thin film-based microfluidic electronic device, method of forming t...

Wiring substrate

Fluid connection and fluid heating device

Method for manufacturing an electronic device

Component carrier with partially metallized hole using anti-plating...

Method of producing circuits of substrate of display device

Electronic component, manufacturing method thereof, and electronic...

Hybrid circuit board

Method for manufacturing wiring board, wiring board, method for man...

Wiring board and display device

Printed circuit board with plurality of condctor patterns and vias

Optical module assembly, optical module, package for optical module...

Circuit board with anti-corrosion properties and electronic device...

Methods and systems for fabricating 3D multielectrode arrays with 3...

Ultra-thin composite transparent conductive film and preparation me...

Three-dimensional molding machine

Method of preparing a high density interconnect printed circuit boa...

Method for manufacturing component embedded circuit board

Connection method for chip and circuit board, and circuit board ass...

Printed circuit board and method of fabricating the same

Aluminum/ceramic bonding substrate and method for producing same

Conductive garment fastening product

Chemical solution used for cleaning or etching ruthenium-containing...

Printed circuit board having embedded component

Wiring formation method and transfer mold manufacturing method

Circuit board

Printed circuit board

Patents Applicationslast 30 patents

APPARATUS FOR CUSTOMIZED SESMICONDIUCTOR PACKAGING, SERVER, SYSTEM...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING ME...

POLYMER-CONDUCTOR MATRIX ELECTRICAL INTERCONNECT

ELECTRICAL CIRCUIT FORMATION METHOD, AND ELECTRICAL CIRCUIT FORMATI...

COIL CARRIER BOARD AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

COIL DEVICE AND PRINTED WIRING BOARD

GENERATION OF RANDOM SECURITY CIRCUIT PATTERNS FOR IN-SITU FABRICAT...

Component Carrier with Rough Surface and Smooth Surface Metal Trace...

STRETCHABLE CIRCUIT BOARD ASSEMBLY AND METHOD FOR MANUFACTURING THE...

CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD

Methods And Systems Of Forming Metal Interconnect Layers Using Engi...

FLEXIBLE TRANSPARENT WIRING BOARD AND METHOD FOR MANUFACTURING FLEX...

FLEXIBLE CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME

ARCHITECTED LIQUID METAL NETWORKS AND PROCESSES OF MAKING AND USING...

FLEXIBLE CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

LAMINATED STRUCTURE, AND METHOD FOR MANUFACTURING LAMINATED STRUCTURE

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PATTERNED ARTICLE INCLUDING ELECTRICALLY CONDUCTIVE ELEMENTS

METHODS AND MECHANISMS FOR MAINTAINING AN ELECTRO-ACTIVE POLYMER IN...

PRINTED WIRING BOARD

PRINTED CIRCUIT BOARD MANUFACTURING PROCESS AND PRINTED CIRCUIT BOARD

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

INTRA-PAIR SKEW COMPENSATION OF DIFFERENTIAL SIGNALS

TRACE ARRANGEMENT FOR PRINTED CIRCUIT BOARD

ELECTRICALLY CONDUCTIVE FILM AND METHOD FOR MANUFACTURING SAME, AND...

WIRING SUBSTRATE

METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...