in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Industry

CPC
H05K3/10

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Aluminum/ceramic bonding substrate and method for producing same
- Patent number 12,221,389
- Issue date Feb 11, 2025
- Dowa Metaltech Co., Ltd.
- Koji Kobayashi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Conductive garment fastening product
- Patent number 12,201,167
- Issue date Jan 21, 2025
- Prym Intimates Group Limited
- Heenatikumbure Kavisekara Mudiyanselage Anjana Piushan Kavisekara
- A41 - WEARING APPAREL
Information Patent Grant
Chemical solution used for cleaning or etching ruthenium-containing...
- Patent number 12,187,943
- Issue date Jan 7, 2025
- Tokyo Ohka Kogyo Co., Ltd.
- Yukihisa Wada
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Printed circuit board having embedded component
- Patent number 12,185,478
- Issue date Dec 31, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring formation method and transfer mold manufacturing method
- Patent number 12,181,796
- Issue date Dec 31, 2024
- CONNECTEC JAPAN CORPORATION
- Hiroshi Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 12,177,978
- Issue date Dec 24, 2024
- Toppan Printing Co., Ltd.
- Jun Onohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,167,540
- Issue date Dec 10, 2024
- LG Innotek Co., Ltd
- Eui Yeol Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit board, producing method thereof, and wiring circuit...
- Patent number 12,167,544
- Issue date Dec 10, 2024
- Nitto Denko Corporation
- Ryosuke Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and systems of forming metal interconnect layers using engi...
- Patent number 12,165,881
- Issue date Dec 10, 2024
- Rashid Mavliev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wiring board having a wiring pattern that has a multi-layer structure
- Patent number 12,160,954
- Issue date Dec 3, 2024
- Shinko Electric Industries Co., Ltd.
- Yusuke Gozu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 12,160,949
- Issue date Dec 3, 2024
- FUJIFILM Corporation
- Genya Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connections to embedded electronic components
- Patent number 12,156,343
- Issue date Nov 26, 2024
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for providing dynamic feedback for selective adhesion PCB pr...
- Patent number 12,150,248
- Issue date Nov 19, 2024
- Honeywell Federal Manufacturing & Technologies, LLC
- Jonathan Douglas Hatch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 12,144,108
- Issue date Nov 12, 2024
- Dai Nippon Printing Co., Ltd.
- Naoko Okimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 12,144,122
- Issue date Nov 12, 2024
- Sumitomo Electric Industries Ltd.
- Shoichiro Sakai
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,144,121
- Issue date Nov 12, 2024
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterned article including electrically conductive elements
- Patent number 12,133,327
- Issue date Oct 29, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board
- Patent number 12,127,341
- Issue date Oct 22, 2024
- Thales
- Geoffroy Aupee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method of manufacturing thereof
- Patent number 12,120,812
- Issue date Oct 15, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Hao-Yi Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing stack components
- Patent number 12,119,327
- Issue date Oct 15, 2024
- FUJI CORPORATION
- Ryojiro Tominaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode-wiring-equipped cloth material
- Patent number 12,114,981
- Issue date Oct 15, 2024
- Lintec Corporation
- Yoshiaki Hagihara
- D03 - WEAVING
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 12,107,327
- Issue date Oct 1, 2024
- Dai Nippon Printing Co., Ltd.
- Koichi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering apparatus
- Patent number 12,097,575
- Issue date Sep 24, 2024
- ERSA GmbH
- Lothar Endreß
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of insulated metal substrate
- Patent number 12,096,569
- Issue date Sep 17, 2024
- Jentech Precision Industrial Co., LTD.
- Chun-Ta Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,082,349
- Issue date Sep 3, 2024
- HONOR DEVICE CO., LTD.
- Xiaoyong Dong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for holding a heat generating device
- Patent number 12,080,624
- Issue date Sep 3, 2024
- Solaredge Technologies Ltd.
- Tomer Kugman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods to improve thermal conduction from SMT and chip...
- Patent number 12,082,334
- Issue date Sep 3, 2024
- Hamilton Sundstrand Corporation
- John Dickey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive composition for molded film, molded film, molded article...
- Patent number 12,064,949
- Issue date Aug 20, 2024
- ARTIENCE CO., LTD.
- Kouichi Tosaki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Manufacturing sequences for high density interconnect printed circu...
- Patent number 12,063,751
- Issue date Aug 13, 2024
- Atotech Deutschland GmbH & Co. KG
- Akif Özkök
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed circuit board
- Patent number 12,063,743
- Issue date Aug 13, 2024
- Nichia Corporation
- Masakazu Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE TRANSPARENT WIRING BOARD AND METHOD FOR MANUFACTURING FLEX...
- Publication number 20250056728
- Publication date Feb 13, 2025
- NIPPON MEKTRON, LTD.
- Akihiro NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME
- Publication number 20250056715
- Publication date Feb 13, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Chao WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARCHITECTED LIQUID METAL NETWORKS AND PROCESSES OF MAKING AND USING...
- Publication number 20250040041
- Publication date Jan 30, 2025
- Government of the United States as Represented by the Secretary of the Air Force
- Carl J. Thrasher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20250031306
- Publication date Jan 23, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Xiao-Juan ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED STRUCTURE, AND METHOD FOR MANUFACTURING LAMINATED STRUCTURE
- Publication number 20250031319
- Publication date Jan 23, 2025
- Panasonic Holdings Corporation
- HIROKI KITAGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250016921
- Publication date Jan 9, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sang Ho JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED ARTICLE INCLUDING ELECTRICALLY CONDUCTIVE ELEMENTS
- Publication number 20250016916
- Publication date Jan 9, 2025
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND MECHANISMS FOR MAINTAINING AN ELECTRO-ACTIVE POLYMER IN...
- Publication number 20250016932
- Publication date Jan 9, 2025
- ElastiMed Ltd.
- Omer Zelka
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240431030
- Publication date Dec 26, 2024
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Michi OGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD MANUFACTURING PROCESS AND PRINTED CIRCUIT BOARD
- Publication number 20240431034
- Publication date Dec 26, 2024
- Gebr. Schmid GmbH
- Christian Schmid
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20240421471
- Publication date Dec 19, 2024
- DAI NIPPON PRINTING CO., LTD.
- Koichi SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTRA-PAIR SKEW COMPENSATION OF DIFFERENTIAL SIGNALS
- Publication number 20240407093
- Publication date Dec 5, 2024
- Achronix Semiconductor Corporation
- Hansel Desmond Dsilva
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRACE ARRANGEMENT FOR PRINTED CIRCUIT BOARD
- Publication number 20240381526
- Publication date Nov 14, 2024
- Cisco Technology, Inc.
- Shadi Ebrahimi Asl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICALLY CONDUCTIVE FILM AND METHOD FOR MANUFACTURING SAME, AND...
- Publication number 20240349425
- Publication date Oct 17, 2024
- TDK Corporation
- Yoshihisa TAMAGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240341034
- Publication date Oct 10, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD
- Publication number 20240341039
- Publication date Oct 10, 2024
- Resonac Corporation
- Kei TOGASAKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...
- Publication number 20240341042
- Publication date Oct 10, 2024
- Atotech Deutschland GmbH & Co. KG
- Bert REENTS
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240334586
- Publication date Oct 3, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Hsuan HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240334598
- Publication date Oct 3, 2024
- Shinko Electric Industries Co., Ltd.
- Yuki KOBAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PRINTED CIRCUIT BOARD DIELECTRIC MOLDING OR MACHINING AND...
- Publication number 20240334612
- Publication date Oct 3, 2024
- INFINITUM ELECTRIC INC.
- Edward C. CARIGNAN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DURABLE POROUS STRUCTURES AND ELECTRONICS DEVICES INCORPORATING THE...
- Publication number 20240328024
- Publication date Oct 3, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Sujan Dewanjee
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEM AND METHOD OF FABRICATING OBJECTS USING ADDITIVE MANUFACTURI...
- Publication number 20240324106
- Publication date Sep 26, 2024
- Advanced Printed Electronic Solutions LLC
- Richard Neill
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF, AND ELECTRONIC...
- Publication number 20240306306
- Publication date Sep 12, 2024
- Canon Kabushiki Kaisha
- JUN TSUKANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERNED CONDUCTIVE ARTICLE
- Publication number 20240306290
- Publication date Sep 12, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240298410
- Publication date Sep 5, 2024
- LG Innotek Co., Ltd.
- Min Young HWANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC-BASED CIRCUIT BOARD ASSEMBLIES FORMED USING METAL NANOPARTI...
- Publication number 20240292531
- Publication date Aug 29, 2024
- Kuprion Inc.
- Alfred A. ZINN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method For Manufacturing Electrical Devices
- Publication number 20240282517
- Publication date Aug 22, 2024
- Hutchinson Technology Incorporated
- Collin M. Grove
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD
- Publication number 20240284600
- Publication date Aug 22, 2024
- Nitto Denko Corporation
- Hayato TAKAKURA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240268034
- Publication date Aug 8, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jesang Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20240268027
- Publication date Aug 8, 2024
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Stanley Buchert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Aluminum/ceramic bonding substrate and method for producing same

Conductive garment fastening product

Chemical solution used for cleaning or etching ruthenium-containing...

Printed circuit board having embedded component

Wiring formation method and transfer mold manufacturing method

Circuit board

Printed circuit board

Wiring circuit board, producing method thereof, and wiring circuit...

Methods and systems of forming metal interconnect layers using engi...

Wiring board having a wiring pattern that has a multi-layer structure

Wiring board and method for manufacturing wiring board

Electrical connections to embedded electronic components

System for providing dynamic feedback for selective adhesion PCB pr...

Wiring board and method for manufacturing wiring board

Method of manufacturing printed circuit board

Wiring substrate and method for manufacturing wiring substrate

Patterned article including electrically conductive elements

Multilayer printed circuit board

Circuit board and method of manufacturing thereof

Method for manufacturing stack components

Electrode-wiring-equipped cloth material

Wiring board and method for manufacturing wiring board

Soldering apparatus

Manufacturing method of insulated metal substrate

Electronic device

Apparatus and method for holding a heat generating device

Devices and methods to improve thermal conduction from SMT and chip...

Conductive composition for molded film, molded film, molded article...

Manufacturing sequences for high density interconnect printed circu...

Printed circuit board

Patents Applicationslast 30 patents

FLEXIBLE TRANSPARENT WIRING BOARD AND METHOD FOR MANUFACTURING FLEX...

FLEXIBLE CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME

ARCHITECTED LIQUID METAL NETWORKS AND PROCESSES OF MAKING AND USING...

FLEXIBLE CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

LAMINATED STRUCTURE, AND METHOD FOR MANUFACTURING LAMINATED STRUCTURE

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PATTERNED ARTICLE INCLUDING ELECTRICALLY CONDUCTIVE ELEMENTS

METHODS AND MECHANISMS FOR MAINTAINING AN ELECTRO-ACTIVE POLYMER IN...

PRINTED WIRING BOARD

PRINTED CIRCUIT BOARD MANUFACTURING PROCESS AND PRINTED CIRCUIT BOARD

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

INTRA-PAIR SKEW COMPENSATION OF DIFFERENTIAL SIGNALS

TRACE ARRANGEMENT FOR PRINTED CIRCUIT BOARD

ELECTRICALLY CONDUCTIVE FILM AND METHOD FOR MANUFACTURING SAME, AND...

WIRING SUBSTRATE

METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...

PACKAGE STRUCTURE

WIRING SUBSTRATE

METHOD OF PRINTED CIRCUIT BOARD DIELECTRIC MOLDING OR MACHINING AND...

DURABLE POROUS STRUCTURES AND ELECTRONICS DEVICES INCORPORATING THE...

SYSTEM AND METHOD OF FABRICATING OBJECTS USING ADDITIVE MANUFACTURI...

ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF, AND ELECTRONIC...

PATTERNED CONDUCTIVE ARTICLE

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

CERAMIC-BASED CIRCUIT BOARD ASSEMBLIES FORMED USING METAL NANOPARTI...

Method For Manufacturing Electrical Devices

METHOD FOR PRODUCING WIRING CIRCUIT BOARD

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD