in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Industry

CPC
H05K3/10

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Industries

Patents Grantslast 30 patents

Information Patent Grant
Wiring board
- Patent number 11,979,981
- Issue date May 7, 2024
- Kyocera Corporation
- Takayuki Umemoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing an electronic device
- Patent number 11,974,403
- Issue date Apr 30, 2024
- Innolux Corporation
- Yu-Chia Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Efficient wave guide transition between package and PCB using solde...
- Patent number 11,963,291
- Issue date Apr 16, 2024
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing transparent circuit board
- Patent number 11,950,371
- Issue date Apr 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing circuits using thick metals and machined bu...
- Patent number 11,950,373
- Issue date Apr 2, 2024
- Lockheed Martin Corporation
- Marc T. Angelucci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with anti-corrosion properties, method for manufactur...
- Patent number 11,943,875
- Issue date Mar 26, 2024
- Champ Tech Optical (Foshan) Corporation
- Li-Ping Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 11,930,601
- Issue date Mar 12, 2024
- Ibiden Co., Ltd.
- Yuji Kadowaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
2D and 3D inductors fabricating photoactive substrates
- Patent number 11,929,199
- Issue date Mar 12, 2024
- 3D GLASS SOLUTIONS, INC.
- Jeb H. Flemming
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, electronic device and electronic module
- Patent number 11,930,586
- Issue date Mar 12, 2024
- Kyocera Corporation
- Toshiyuki Hamachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit copper overlay for temperature management
- Patent number 11,924,958
- Issue date Mar 5, 2024
- Western Digital Technologies, Inc.
- Teruhiro Nakamiya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermoplastic composition for laser direct structuring
- Patent number 11,912,863
- Issue date Feb 27, 2024
- MEP EUROPE B.V.
- Bernardus Antonius Gerardus Schrauwen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Fabrication method of substrate having electrical interconnection s...
- Patent number 11,913,121
- Issue date Feb 27, 2024
- Siliconware Precision Industries Co., Ltd.
- Po-Yi Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,917,768
- Issue date Feb 27, 2024
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 11,916,285
- Issue date Feb 27, 2024
- Dai Nippon Printing Co., Ltd.
- Koichi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern transfer printing systems and methods
- Patent number 11,910,537
- Issue date Feb 20, 2024
- Wuhan DR Laser Technology Corp,. LTD
- Gad Igra
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Smart cards with metal layer(s) and methods of manufacture
- Patent number 11,907,791
- Issue date Feb 20, 2024
- Amatech Group Lijited
- Mustafa Lotya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Pressure-sensitive machine interface device
- Patent number 11,907,463
- Issue date Feb 20, 2024
- Accenture Global Solutions Limited
- Mark Benjamin Greenspan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High-density soft-matter electronics
- Patent number 11,903,139
- Issue date Feb 13, 2024
- Carnegie Mellon University
- Carmel Majidi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Neurostimulation or electromyography cuff
- Patent number 11,883,645
- Issue date Jan 30, 2024
- Battelle Memorial Institute
- Chad E. Bouton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 11,889,634
- Issue date Jan 30, 2024
- LG Innotek Co., Ltd
- Jung Ho Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating tamper-respondent sensors with random three-dimensional...
- Patent number 11,877,390
- Issue date Jan 16, 2024
- International Business Machines Corporation
- John S. Werner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component-incorporated substrate and method for manufacturing same
- Patent number 11,871,524
- Issue date Jan 9, 2024
- Fujikura Ltd.
- Masahiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board having complementary signal conducting patterns
- Patent number 11,871,510
- Issue date Jan 9, 2024
- Hong Fu Jin Precision Industry (WuHan) Co., Ltd.
- Hou-Yuan Chou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering structure with groove portion and power module comprising...
- Patent number 11,862,537
- Issue date Jan 2, 2024
- Hyundai Motor Company
- Jun Hee Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate, maintenance method and display device
- Patent number 11,864,326
- Issue date Jan 2, 2024
- CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Hongda Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrates comprising a network comprising core shell liquid metal...
- Patent number 11,856,690
- Issue date Dec 26, 2023
- United States of America as represented by the Secretary of the Air Force
- Carl J. Thrasher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rogowski coil integrated in glass substrate
- Patent number 11,856,711
- Issue date Dec 26, 2023
- Infineon Technologies Austria AG
- Alexander Breymesser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring substrate, method of manufacturing same, and prob...
- Patent number 11,852,655
- Issue date Dec 26, 2023
- POINT ENGINEERING CO., LTD.
- Bum Mo Ahn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Smartcards with multiple coupling frames
- Patent number 11,836,565
- Issue date Dec 5, 2023
- AMATECH GROUP LIMITED
- Mustafa Lotya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method of circuit board assembly
- Patent number 11,825,595
- Issue date Nov 21, 2023
- HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD.
- Mao-Feng Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND SYSTEM FOR PRODUCING CIRCUIT BOARDS WITH PERFORATED SHAP...
- Publication number 20240164023
- Publication date May 16, 2024
- JUMATECH GMBH
- Markus WÖLFEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROMAGNETIC WAVE SHIELDING SHEET, FLEXIBLE PRINTED CIRCUIT BOAR...
- Publication number 20240164009
- Publication date May 16, 2024
- WISOL CO., LTD.
- Jung Min KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD, WIRING CIRCUIT BOARD WIT...
- Publication number 20240164024
- Publication date May 16, 2024
- Nitto Denko Corporation
- Ikuya HASHIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20240164017
- Publication date May 16, 2024
- Nitto Denko Corporation
- Hideki MATSUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING TRANSFER PLATE, WIRING-EQUIPPED WIRING TRANSFER PLATE, WIRIN...
- Publication number 20240155774
- Publication date May 9, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Takayoshi NIRENGI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240147615
- Publication date May 2, 2024
- Japan Display Inc.
- Takumi SANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME, PACKAG...
- Publication number 20240147629
- Publication date May 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHANG-HE ZHU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20240147632
- Publication date May 2, 2024
- YAZAKI CORPORATION
- Mitsuaki Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Device
- Publication number 20240130048
- Publication date Apr 18, 2024
- Honor Device Co., Ltd.
- Xiaoyong Dong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND MECHANISMS FOR MAINTAINING AN ELECTRO-ACTIVE POLYMER IN...
- Publication number 20240130047
- Publication date Apr 18, 2024
- ElastiMed Ltd.
- Omer Zelka
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
NEUROSTIMULATION OR ELECTROMYOGRAPHY CUFF
- Publication number 20240115851
- Publication date Apr 11, 2024
- Battelle Memorial Institute
- Chad E. Bouton
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD
- Publication number 20240114628
- Publication date Apr 4, 2024
- Nitto Denko Corporation
- Kenta FUKUSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD
- Publication number 20240107664
- Publication date Mar 28, 2024
- Nitto Denko Corporation
- Kenta FUKUSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...
- Publication number 20240098889
- Publication date Mar 21, 2024
- Sumitomo Electric Industries, Ltd.
- Hiroshi UEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID SOFT-RIGID ELECTRICAL INTERCONNECTION SYSTEM
- Publication number 20240091528
- Publication date Mar 21, 2024
- ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE (EPFL)
- Florian FALLEGGER
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
LIGHT-EMITTING MODULE, METHOD OF MANUFACTURING WIRING SUBSTRATE, AN...
- Publication number 20240098901
- Publication date Mar 21, 2024
- Nichia Corporation.
- Shota TAKASE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-INCORPORATED SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240090140
- Publication date Mar 14, 2024
- FUJIKURA LTD.
- Masahiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20240057253
- Publication date Feb 15, 2024
- LG Innotek Co., Ltd.
- Sang Myung LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING BOARD, LAMINATE AND METHOD FOR PRODUCIN...
- Publication number 20240057263
- Publication date Feb 15, 2024
- Resonac Corporation
- Masaya TOBA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE WITH INDUCTOR, AND MANUFACTURING METHOD THEREOF
- Publication number 20240057256
- Publication date Feb 15, 2024
- JCET GROUP CO., LTD.
- Yaojian LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20240049398
- Publication date Feb 8, 2024
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY
- Publication number 20240040687
- Publication date Feb 1, 2024
- Avary Holding (Shenzhen) Co., Ltd.
- Mao-Feng HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND DISK DEVICE
- Publication number 20240040696
- Publication date Feb 1, 2024
- Kabushiki Kaisha Toshiba
- Yoshihiro AMEMIYA
- G11 - INFORMATION STORAGE
Information Patent Application
WIRING CIRCUIT BOARD ASSEMBLY SHEET
- Publication number 20240040705
- Publication date Feb 1, 2024
- Nitto Denko Corporation
- Rihito FUKUSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240040695
- Publication date Feb 1, 2024
- Murata Manufacturing Co., Ltd.
- Tomoya OOSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240032201
- Publication date Jan 25, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Do Jae Yoo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING FORMATION METHOD AND TRANSFER MOLD MANUFACTURING METHOD
- Publication number 20240032205
- Publication date Jan 25, 2024
- CONNECTEC JAPAN Corporation
- Hiroshi KOMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND DISPLAY DEVICE
- Publication number 20240023248
- Publication date Jan 18, 2024
- KYOCERA CORPORATION
- Nobuyuki HASEGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PRODUCING CIRCUITS OF SUBSTRATE OF DISPLAY DEVICE
- Publication number 20240015891
- Publication date Jan 11, 2024
- TCL China Star Optoelectronics Technology Co., Ltd.
- Tong Deng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Impedence Matching Conductive Structure for High Efficiency RF Circ...
- Publication number 20240014794
- Publication date Jan 11, 2024
- 3D GLASS SOLUTIONS, INC
- Jeb H. Flemming
- G06 - COMPUTING CALCULATING COUNTING

in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring board

Method for manufacturing an electronic device

Efficient wave guide transition between package and PCB using solde...

Method for manufacturing transparent circuit board

Method of manufacturing circuits using thick metals and machined bu...

Circuit board with anti-corrosion properties, method for manufactur...

Method for manufacturing printed wiring board

2D and 3D inductors fabricating photoactive substrates

Wiring substrate, electronic device and electronic module

Flexible printed circuit copper overlay for temperature management

Thermoplastic composition for laser direct structuring

Fabrication method of substrate having electrical interconnection s...

Single-layer circuit board, multi-layer circuit board, and manufact...

Wiring board and method for manufacturing wiring board

Pattern transfer printing systems and methods

Smart cards with metal layer(s) and methods of manufacture

Pressure-sensitive machine interface device

High-density soft-matter electronics

Neurostimulation or electromyography cuff

Printed circuit board and method of manufacturing the same

Fabricating tamper-respondent sensors with random three-dimensional...

Component-incorporated substrate and method for manufacturing same

Circuit board having complementary signal conducting patterns

Soldering structure with groove portion and power module comprising...

Substrate, maintenance method and display device

Substrates comprising a network comprising core shell liquid metal...

Rogowski coil integrated in glass substrate

Multilayer wiring substrate, method of manufacturing same, and prob...

Smartcards with multiple coupling frames

Manufacturing method of circuit board assembly

Patents Applicationslast 30 patents

METHOD AND SYSTEM FOR PRODUCING CIRCUIT BOARDS WITH PERFORATED SHAP...

ELECTROMAGNETIC WAVE SHIELDING SHEET, FLEXIBLE PRINTED CIRCUIT BOAR...

METHOD FOR PRODUCING WIRING CIRCUIT BOARD, WIRING CIRCUIT BOARD WIT...

WIRING CIRCUIT BOARD

WIRING TRANSFER PLATE, WIRING-EQUIPPED WIRING TRANSFER PLATE, WIRIN...

ELECTRONIC DEVICE

CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME, PACKAG...

WIRING BOARD

Electronic Device

METHODS AND MECHANISMS FOR MAINTAINING AN ELECTRO-ACTIVE POLYMER IN...

NEUROSTIMULATION OR ELECTROMYOGRAPHY CUFF

METHOD FOR PRODUCING WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD

METHOD FOR PRODUCING WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...

HYBRID SOFT-RIGID ELECTRICAL INTERCONNECTION SYSTEM

LIGHT-EMITTING MODULE, METHOD OF MANUFACTURING WIRING SUBSTRATE, AN...

COMPONENT-INCORPORATED SUBSTRATE AND METHOD FOR MANUFACTURING SAME

CIRCUIT BOARD

METHOD FOR PRODUCING WIRING BOARD, LAMINATE AND METHOD FOR PRODUCIN...

PACKAGE STRUCTURE WITH INDUCTOR, AND MANUFACTURING METHOD THEREOF

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

CIRCUIT BOARD ASSEMBLY

PRINTED CIRCUIT BOARD AND DISK DEVICE

WIRING CIRCUIT BOARD ASSEMBLY SHEET

ELECTRONIC COMPONENT

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

WIRING FORMATION METHOD AND TRANSFER MOLD MANUFACTURING METHOD

WIRING BOARD AND DISPLAY DEVICE

METHOD OF PRODUCING CIRCUITS OF SUBSTRATE OF DISPLAY DEVICE

Impedence Matching Conductive Structure for High Efficiency RF Circ...