Inactivating or removing catalyst

Industry

CPC
H05K2203/0706

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0706Inactivating or removing catalyst

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Application specific electronics packaging systems, methods and dev...
- Patent number 11,503,718
- Issue date Nov 15, 2022
- Molex, LLC
- Marko Spiegel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Application specific electronics packaging systems, methods and dev...
- Patent number 10,905,014
- Issue date Jan 26, 2021
- Molex, LLC
- Marko Spiegel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Application specific electronics packaging systems, methods and dev...
- Patent number 10,667,407
- Issue date May 26, 2020
- Molex, LLC
- Marko Spiegel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Application specific electronics packaging systems, methods and dev...
- Patent number 10,433,428
- Issue date Oct 1, 2019
- Molex, LLC
- Marko Spiegel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 9,332,642
- Issue date May 3, 2016
- Panasonic Corporation
- Shingo Yoshioka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective metallization process
- Patent number 5,158,860
- Issue date Oct 27, 1992
- Shipley Company Inc.
- Michael Gulla
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacture of printed circuit boards
- Patent number 4,931,148
- Issue date Jun 5, 1990
- MacDermid, Incorporated
- Peter E. Kukanskis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective metallization process, additive method for manufacturing...
- Patent number 4,897,118
- Issue date Jan 30, 1990
- MacDermid, Incorporated
- Donald R. Ferrier
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metallization utilizing a catalyst which is removed or deactivated...
- Patent number 4,749,449
- Issue date Jun 7, 1988
- E. I. Du Pont de Nemours and Company
- Kevin D. Scott
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Selective metallization process and additive method for manufacture...
- Patent number 4,748,104
- Issue date May 31, 1988
- MacDermid, Incorporated
- Donald R. Ferrier
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
System for selective metallization of electronic interconnection bo...
- Patent number 4,668,532
- Issue date May 26, 1987
- Kollmorgen Technologies Corporation
- Michael P. Moisan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective metallization process
- Patent number 4,537,799
- Issue date Aug 27, 1985
- AT&T Technologies, Inc.
- John K. Dorey
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for production of printed circuits by electroless metal plating
- Patent number 4,293,592
- Issue date Oct 6, 1981
- Hitachi, Ltd.
- Hirosada Morishita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for production of printed circuits by electroless metal plat...
- Patent number 4,151,313
- Issue date Apr 24, 1979
- Hitachi, Ltd.
- Motoyo Wajima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
APPLICATION SPECIFIC ELECTRONICS PACKAGING SYSTEMS, METHODS AND DEV...
- Publication number 20200022265
- Publication date Jan 16, 2020
- Molex, LLC
- Marko SPIEGEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRA-THIN, REMOVABLE, CATALYTIC FILM FOR LASER DIRECT STRUCTURING...
- Publication number 20200022264
- Publication date Jan 16, 2020
- SABIC Global Technologies B.V.
- Yunan CHENG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PRODUCING ELECTROCONDUCTIVE LAMINATE, LAMINATE, AND ELEC...
- Publication number 20190010608
- Publication date Jan 10, 2019
- FUJIFILM CORPORATION
- Kohei HIGASHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Inactivating or removing catalyst

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Application specific electronics packaging systems, methods and dev...

Application specific electronics packaging systems, methods and dev...

Application specific electronics packaging systems, methods and dev...

Application specific electronics packaging systems, methods and dev...

Circuit board

Selective metallization process

Method for manufacture of printed circuit boards

Selective metallization process, additive method for manufacturing...

Metallization utilizing a catalyst which is removed or deactivated...

Selective metallization process and additive method for manufacture...

System for selective metallization of electronic interconnection bo...

Selective metallization process

Method for production of printed circuits by electroless metal plating

Method for production of printed circuits by electroless metal plat...

Patents Applicationslast 30 patents

APPLICATION SPECIFIC ELECTRONICS PACKAGING SYSTEMS, METHODS AND DEV...

ULTRA-THIN, REMOVABLE, CATALYTIC FILM FOR LASER DIRECT STRUCTURING...

METHOD FOR PRODUCING ELECTROCONDUCTIVE LAMINATE, LAMINATE, AND ELEC...