Claims
- 1. A composition for use in treating a substrate surface which has been masked in a predetermined pattern with an organic plating resist material such that upon subsequent treatment of the substrate surface with an activating solution and a metal plating solution, metal plating on unmasked surfaces is enhanced while metal plating on said resist is minimized, said composition consisting essentially of an aqueous solution containing (i) an organosilane conditioning agent, present in an amount of from about 0.1 to 8 g/l, and (ii) an adjuvant, selected from the group consisting of ethylenediamine, N,N,N',N'-tetramethyl-1,3-butanediamine, diethylene diamine, triethylene tetraamine, and mixtures thereof, in an amount of from about 5 to 15 g/l.
- 2. The composition according to claim 1 wherein said adjuvant is ethylenediamine.
Parent Case Info
This is a divisional of co-pending application Ser. No. 929,595 filed on Nov. 10, 1986 now U.S. Pat. No. 4,748,104.
US Referenced Citations (7)
Divisions (1)
|
Number |
Date |
Country |
Parent |
929595 |
Nov 1986 |
|