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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

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H01L27/06including a plurality of individual components in a non-repetitive configuration

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices comprising failure detectors for detecting fa...
- Patent number 12,181,512
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cross-coupled gate design for stacked device with separated top-dow...
- Patent number 12,183,738
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride-based semiconductor bidirectional switching device and meth...
- Patent number 12,176,343
- Issue date Dec 24, 2024
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Qiyue Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor structure
- Patent number 12,176,344
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to voltage compensated switch stack
- Patent number 12,176,304
- Issue date Dec 24, 2024
- Skyworks Solutions, Inc.
- Hanching Fuh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and method of forming the same
- Patent number 12,176,321
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked FET with independent gate control
- Patent number 12,176,345
- Issue date Dec 24, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroelectric structure including a ferroelectric film having a fir...
- Patent number 12,176,413
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Sanghyun Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device using high stress cleave plane
- Patent number 12,176,326
- Issue date Dec 24, 2024
- Silicon Genesis Corporation
- Theodore E. Fong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device with nanostructure channels
- Patent number 12,170,227
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Te Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,170,265
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-I Wu
- G11 - INFORMATION STORAGE
Information Patent Grant
Microelectronic devices and memory devices including conductive lev...
- Patent number 12,170,250
- Issue date Dec 17, 2024
- Micron Technology, Inc.
- Jordan D. Greenlee
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuits including composite dielectric layer
- Patent number 12,170,310
- Issue date Dec 17, 2024
- Texas Instruments Incorporated
- Guruvayurappan S. Mathur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,166,033
- Issue date Dec 10, 2024
- INNOLUX CORPORATION
- Chin-Lung Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor package with die-mounted voltage regulator
- Patent number 12,165,981
- Issue date Dec 10, 2024
- Advanced Micro Devices, Inc.
- Gabriel H Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with high-resistance polysilicon resistor form...
- Patent number 12,159,867
- Issue date Dec 3, 2024
- SK keyfoundry Inc.
- Heuiseung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,160,999
- Issue date Dec 3, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Kiyoshi Kato
- G11 - INFORMATION STORAGE
Information Patent Grant
Middle end of line decoupling capacitors for semiconductor devices...
- Patent number 12,159,827
- Issue date Dec 3, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMANY, LTD.
- Chung-Ting Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside interconnect structures for semiconductor devices and meth...
- Patent number 12,159,869
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Ting Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for determining characteristics of semiconducto...
- Patent number 12,158,492
- Issue date Dec 3, 2024
- FemtoMetrix, Inc.
- Ming Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 12,159,866
- Issue date Dec 3, 2024
- SOCIONEXT INC.
- Isaya Sobue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement gate formation in memory
- Patent number 12,159,919
- Issue date Dec 3, 2024
- Micron Technology, Inc.
- Thomas M. Graettinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistor geometry
- Patent number 12,159,898
- Issue date Dec 3, 2024
- PRAGMATIC SEMICONDUCTOR LIMITED
- Richard Price
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing capacitor structure
- Patent number 12,159,917
- Issue date Dec 3, 2024
- United Microelectronics Corp.
- Xiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RC-IGBT with lifetime control layer
- Patent number 12,159,944
- Issue date Dec 3, 2024
- Mitsubishi Electric Corporation
- Shinya Soneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 12,154,900
- Issue date Nov 26, 2024
- Rohm Co., Ltd.
- Kentaro Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit emulating neural system with neuron circuit and...
- Patent number 12,154,017
- Issue date Nov 26, 2024
- Seoul National University R&DBFoundation
- Byung-Gook Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three-dimensional integrated circuit packages and methods of formin...
- Patent number 12,154,896
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures
- Patent number 12,154,897
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor memory device and structure
- Patent number 12,154,817
- Issue date Nov 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED RESISTORS WITH INCREASED SHEET RESISTANCE FOR RF APPLICA...
- Publication number 20240429230
- Publication date Dec 26, 2024
- Wolfspeed, Inc.
- Matthew King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTOR AND RESISTOR-TRANSISTOR-LOGIC CIRCUIT WITH GAN STRUCTURE A...
- Publication number 20240429228
- Publication date Dec 26, 2024
- UNITED MICROELECTRONICS CORP.
- Kuo-Hsing Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INCLUDING A CAPACITIVE ELEMENT, AND CORRESPONDIN...
- Publication number 20240429232
- Publication date Dec 26, 2024
- STMicroelectronics International N.V.
- Abderrezak MARZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE RESISTIVE LADDER BYPASS FOR RF FET SWITCH STACK
- Publication number 20240429918
- Publication date Dec 26, 2024
- pSemi Corporation
- Ravindranath D. SHRIVASTAVA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSCALE-ALIGNED THREE-DIMENSIONAL STACKED INTEGRATED CIRCUIT
- Publication number 20240429099
- Publication date Dec 26, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES COMPRISING VERTICAL TRANSISTORS INCLUDING A CHANNEL REGION...
- Publication number 20240429104
- Publication date Dec 26, 2024
- Micron Technology, Inc.
- Kevin J. Torek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRINGE CAPACITOR, INTEGRATED CIRCUIT AND MANUFACTURING PROCESS FOR...
- Publication number 20240429233
- Publication date Dec 26, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Naveen Tipirneni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH A VERTICAL TRANSISTOR DEVICE
- Publication number 20240429231
- Publication date Dec 26, 2024
- Infineon Technologies Austria AG
- Alessandro Ferrara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HIGH VOLTAGE TERMINATION
- Publication number 20240429288
- Publication date Dec 26, 2024
- Infineon Technologies Austria AG
- Felix Simon Winterer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS
- Publication number 20240429086
- Publication date Dec 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE-ALL-AROUND TRANSISTOR WITH HYBRID CONDUCTION MECHANISM AND MAN...
- Publication number 20240429229
- Publication date Dec 26, 2024
- Fudan University
- Chunlei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429234
- Publication date Dec 26, 2024
- Fuji Electric Co., Ltd.
- Tatsuya NAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL JUNCTION FIELD-EFFECT TRANSISTORS WITH SOURCE-DRAIN DIODE...
- Publication number 20240421151
- Publication date Dec 19, 2024
- Qorvo US, Inc.
- Zhongda Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240421152
- Publication date Dec 19, 2024
- Fuji Electric Co., Ltd.
- Yuki SAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240421234
- Publication date Dec 19, 2024
- RENESAS ELECTRONICS CORPORATION
- Fumitoshi TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240421149
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Jinwoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING CAPACITOR STRUCTURES AND SEMICONDUCTOR...
- Publication number 20240421068
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Myoungsoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D STACKED INTEGRATED CIRCUITS HAVING FAILURE MANAGEMENT
- Publication number 20240421823
- Publication date Dec 19, 2024
- Micron Technology, Inc.
- Tony M. Brewer
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF FORMING PHOTONICS STRUCTURES
- Publication number 20240411090
- Publication date Dec 12, 2024
- Micron Technology, Inc.
- Gurtej Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240413151
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Jungho DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED 3D SEMICONDUCTOR DEVICE PACKAGE WITH TRANSISTORS ATTACHED...
- Publication number 20240413148
- Publication date Dec 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Tiburcio A. MALDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD-EFFECT TRANSISTORS (FETS) EMPLOYING THERMAL EXPANSION OF WORK...
- Publication number 20240413219
- Publication date Dec 12, 2024
- QUALCOMM Incorporated
- Xia Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED BOOT DIODE WITH HIGH FORWARD BIAS CAPABILITY
- Publication number 20240405017
- Publication date Dec 5, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Dong Seup Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD-PLATED RESISTOR
- Publication number 20240405018
- Publication date Dec 5, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Zachary K Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED SUBSTRATE FOR RADIO FREQUENCY APPLICATIONS
- Publication number 20240404960
- Publication date Dec 5, 2024
- Applied Materials, Inc.
- Guan Huei SEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYSILICON RESISTOR ALIGNED BETWEEN GATE STRUCTURES
- Publication number 20240405019
- Publication date Dec 5, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Marvin G.L. Montaque
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240405108
- Publication date Dec 5, 2024
- Mitsubishi Electric Corporation
- Kenji HARADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240405016
- Publication date Dec 5, 2024
- ROHM CO., LTD.
- Shinya UMEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION LAYER FOR AN INTEGRATED CIRCUIT DEVICE THAT PROVIDES A...
- Publication number 20240404905
- Publication date Dec 5, 2024
- STMicroelectronics Pte Ltd
- Eng Hui GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT INCLUDING MOS SWITCH
- Publication number 20240405775
- Publication date Dec 5, 2024
- Rohm Co., Ltd.
- Koichi Takanashi
- H01 - BASIC ELECTRIC ELEMENTS

including a plurality of individual components in a non-repetitive configuration

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor devices comprising failure detectors for detecting fa...

Cross-coupled gate design for stacked device with separated top-dow...

Nitride-based semiconductor bidirectional switching device and meth...

Methods of forming semiconductor structure

Devices and methods related to voltage compensated switch stack

Semiconductor packages and method of forming the same

Stacked FET with independent gate control

Ferroelectric structure including a ferroelectric film having a fir...

Method of forming semiconductor device using high stress cleave plane

Stacked semiconductor device with nanostructure channels

Semiconductor package

Microelectronic devices and memory devices including conductive lev...

Integrated circuits including composite dielectric layer

Electronic device

3D semiconductor package with die-mounted voltage regulator

Semiconductor device with high-resistance polysilicon resistor form...

Semiconductor device

Middle end of line decoupling capacitors for semiconductor devices...

Backside interconnect structures for semiconductor devices and meth...

Systems and methods for determining characteristics of semiconducto...

Semiconductor integrated circuit device

Replacement gate formation in memory

Resistor geometry

Method of manufacturing capacitor structure

RC-IGBT with lifetime control layer

Semiconductor device and semiconductor package

Integrated circuit emulating neural system with neuron circuit and...

Three-dimensional integrated circuit packages and methods of formin...

Package structures

Methods for producing a 3D semiconductor memory device and structure

Patents Applicationslast 30 patents

INTEGRATED RESISTORS WITH INCREASED SHEET RESISTANCE FOR RF APPLICA...

RESISTOR AND RESISTOR-TRANSISTOR-LOGIC CIRCUIT WITH GAN STRUCTURE A...

INTEGRATED CIRCUIT INCLUDING A CAPACITIVE ELEMENT, AND CORRESPONDIN...

GATE RESISTIVE LADDER BYPASS FOR RF FET SWITCH STACK

NANOSCALE-ALIGNED THREE-DIMENSIONAL STACKED INTEGRATED CIRCUIT

DEVICES COMPRISING VERTICAL TRANSISTORS INCLUDING A CHANNEL REGION...

FRINGE CAPACITOR, INTEGRATED CIRCUIT AND MANUFACTURING PROCESS FOR...

SEMICONDUCTOR DIE WITH A VERTICAL TRANSISTOR DEVICE

SEMICONDUCTOR DEVICE WITH HIGH VOLTAGE TERMINATION

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS

GATE-ALL-AROUND TRANSISTOR WITH HYBRID CONDUCTION MECHANISM AND MAN...

SEMICONDUCTOR DEVICE

VERTICAL JUNCTION FIELD-EFFECT TRANSISTORS WITH SOURCE-DRAIN DIODE...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES HAVING CAPACITOR STRUCTURES AND SEMICONDUCTOR...

3D STACKED INTEGRATED CIRCUITS HAVING FAILURE MANAGEMENT

METHOD OF FORMING PHOTONICS STRUCTURES

SEMICONDUCTOR DEVICE

ISOLATED 3D SEMICONDUCTOR DEVICE PACKAGE WITH TRANSISTORS ATTACHED...

FIELD-EFFECT TRANSISTORS (FETS) EMPLOYING THERMAL EXPANSION OF WORK...

INTEGRATED BOOT DIODE WITH HIGH FORWARD BIAS CAPABILITY

FIELD-PLATED RESISTOR

RECONSTITUTED SUBSTRATE FOR RADIO FREQUENCY APPLICATIONS

POLYSILICON RESISTOR ALIGNED BETWEEN GATE STRUCTURES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

PASSIVATION LAYER FOR AN INTEGRATED CIRCUIT DEVICE THAT PROVIDES A...

SEMICONDUCTOR INTEGRATED CIRCUIT INCLUDING MOS SWITCH