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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

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H01L27/06including a plurality of individual components in a non-repetitive configuration

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Multi-function threshold gate with input based adaptive threshold a...
- Patent number 12,322,743
- Issue date Jun 3, 2025
- Kepler Computing Inc.
- Amrita Mathuriya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-function linear threshold gate with input based adaptive thre...
- Patent number 12,316,319
- Issue date May 27, 2025
- Kepler Computing Inc.
- Amrita Mathuriya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Complementary MOS FETS vertically arranged and including multiple d...
- Patent number 12,300,550
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mark van Dal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods for reducing stress on circuit components
- Patent number 12,300,631
- Issue date May 13, 2025
- Analog Devices International Unlimited Company
- Padraig Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor module
- Patent number 12,300,694
- Issue date May 13, 2025
- Rohm Co. Ltd.
- Yuki Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed material power devices and driver circuits
- Patent number 12,294,356
- Issue date May 6, 2025
- CAMBRIDGE GAN DEVICES LIMITED
- Florin Udrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for wafer stack processing
- Patent number 12,293,946
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Lung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip sharing data bus
- Patent number 12,293,993
- Issue date May 6, 2025
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,289,878
- Issue date Apr 29, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Tatsuya Onuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,283,593
- Issue date Apr 22, 2025
- Denso Corporation
- Shuichi Toriyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic equipment
- Patent number 12,283,592
- Issue date Apr 22, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Shinya Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terahertz element and semiconductor device
- Patent number 12,278,423
- Issue date Apr 15, 2025
- Rohm Co., Ltd.
- Toshikazu Mukai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 12,278,285
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Seungchan Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 12,278,216
- Issue date Apr 15, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RC snubber with poly silicon resistor and capacitor formed from jun...
- Patent number 12,278,231
- Issue date Apr 15, 2025
- Infineon Technologies AG
- Dethard Peters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with source resistor
- Patent number 12,272,640
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Zeng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically controllable integrated switch
- Patent number 12,272,509
- Issue date Apr 8, 2025
- STMicroelectronics (Rousset) SAS
- Christian Rivero
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor integrated circuit
- Patent number 12,273,109
- Issue date Apr 8, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Jun Koyama
- G11 - INFORMATION STORAGE
Information Patent Grant
III-V semiconductor device with integrated power transistor and sta...
- Patent number 12,266,724
- Issue date Apr 1, 2025
- CAMBRIDGE GAN DEVICES LIMITED
- Florin Udrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench isolation structure and method of making the same
- Patent number 12,266,577
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hung-Ling Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 12,266,584
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method
- Patent number 12,266,532
- Issue date Apr 1, 2025
- Fuji Electric Co., Ltd.
- Yasunori Agata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parasitic capacitance reduction in GaN-on-silicon devices
- Patent number 12,266,523
- Issue date Apr 1, 2025
- MACOM Technology Solutions Holdings, Inc.
- Gabriel R. Cueva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D stacked integrated circuits having functional blocks configured...
- Patent number 12,266,647
- Issue date Apr 1, 2025
- Micron Technology, Inc.
- Tony M. Brewer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High density capacitor
- Patent number 12,266,684
- Issue date Apr 1, 2025
- TAIWAN SEMICONDCUTOR MANUFACTURING COMPANY, LTD.
- Pei-Jen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic discharge (ESD) protection circuits using tunneling f...
- Patent number 12,266,927
- Issue date Apr 1, 2025
- STMICROELECTRONICS INTERNATIONAL N.V.
- Radhakrishnan Sithanandam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic device
- Patent number 12,266,769
- Issue date Apr 1, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Junpei Momo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Pillar select transistor for 3-dimensional cross point memory
- Patent number 12,268,011
- Issue date Apr 1, 2025
- Intel Corporation
- Prashant Majhi
- G11 - INFORMATION STORAGE
Information Patent Grant
Gate metal-insulator-field plate metal integrated circuit capacitor...
- Patent number 12,261,168
- Issue date Mar 25, 2025
- Efficient Power Conversion Corporation
- Jianjun Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,261,169
- Issue date Mar 25, 2025
- United Microelectronics Corp.
- Kuo-Hsing Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250072015
- Publication date Feb 27, 2025
- UNITED MICROELECTRONICS CORP.
- Chang-Yih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRINTING AN ELECTRICALLY CONDUCTIVE LAYER ON A SURFACE O...
- Publication number 20250070043
- Publication date Feb 27, 2025
- Heraeus Electronics GmbH & Co. KG
- Ming Hung CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250070094
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-I Wu
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250072100
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Te TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION OF A POWER HEMT FROM OTHER CIRCUITS
- Publication number 20250072102
- Publication date Feb 27, 2025
- Cambridge GaN Devices Limited
- Loizos EFTHYMIOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
- Publication number 20250070091
- Publication date Feb 27, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC WITH GAP-FILL STRUCTURES AND THE METHOD OF MANUFACTURING THE SAME
- Publication number 20250070010
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ping-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR PACKAGE WITH DIE-MOUNTED VOLTAGE REGULATOR
- Publication number 20250070031
- Publication date Feb 27, 2025
- ADVANCED MICRO DEVICES, INC.
- Gabriel H LOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC WITH GAP-FILL STRUCTURES AND THE METHOD OF MANUFACTURING THE SAME
- Publication number 20250070007
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ping-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEMENT GATE FORMATION IN MEMORY
- Publication number 20250072079
- Publication date Feb 27, 2025
- Micron Technology, Inc.
- Thomas M. Graettinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING DEVICE, AND METHOD FOR MANUFACTURING METAL OXI...
- Publication number 20250059645
- Publication date Feb 20, 2025
- Duck Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING DISCHARGING PATH AND METHODS O...
- Publication number 20250063825
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- JAEHONG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250063803
- Publication date Feb 20, 2025
- UNITED MICROELECTRONICS CORP.
- Chang-Yih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250063801
- Publication date Feb 20, 2025
- Innolux Corporation
- Chin-Lung Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING WIMPY TRANSISTOR STACK WITH THI...
- Publication number 20250063782
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Panjae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT
- Publication number 20250063827
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ya-Qi MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STACK
- Publication number 20250062226
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Ho CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING A DIODE
- Publication number 20250056897
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Duckseoung KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250056819
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Lun Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250056872
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- WAN-LIN TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSS-COUPLED GATE DESIGN FOR STACKED DEVICE WITH SEPARATED TOP-DOW...
- Publication number 20250056873
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Seunghyun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES FOR INTEGRATED FRONT-END CIRCUITS
- Publication number 20250056878
- Publication date Feb 13, 2025
- MONDE Wireless Inc.
- Matthew Guidry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250056818
- Publication date Feb 13, 2025
- UNITED MICROELECTRONICS CORP.
- Chang-Yih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Metallization by a Nickel or Cobalt Alloy for the Manufac...
- Publication number 20250051927
- Publication date Feb 13, 2025
- MacDermid Enthone Inc.
- Mikailou THIAM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RESISTOR GEOMETRY
- Publication number 20250056817
- Publication date Feb 13, 2025
- Pragmatic Semiconductor Limited
- Richard PRICE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREFOR
- Publication number 20250054838
- Publication date Feb 13, 2025
- Institute of Microelectronics, Chinese Academy of Sciences
- Guanhua YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE...
- Publication number 20250048713
- Publication date Feb 6, 2025
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Zhiwen DONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSE TRANSISTOR WITH LOWER SPREADING RESISTANCE
- Publication number 20250048721
- Publication date Feb 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Eung Jung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE BRIDGE STRUCTURE
- Publication number 20250046720
- Publication date Feb 6, 2025
- AP MEMORY TECHNOLOGY CORPORATION
- WEN-LIANG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-GATE EFFECT CONTROL VIA DOPING
- Publication number 20250048691
- Publication date Feb 6, 2025
- Murata Manufacturing Co., Ltd.
- Kouassi Sebastien KOUASSI
- H01 - BASIC ELECTRIC ELEMENTS

including a plurality of individual components in a non-repetitive configuration

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-function threshold gate with input based adaptive threshold a...

Multi-function linear threshold gate with input based adaptive thre...

Complementary MOS FETS vertically arranged and including multiple d...

Devices and methods for reducing stress on circuit components

Semiconductor device and semiconductor module

Mixed material power devices and driver circuits

Techniques for wafer stack processing

3D chip sharing data bus

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device

Semiconductor device and electronic equipment

Terahertz element and semiconductor device

Semiconductor devices

3D semiconductor device and structure with metal layers

RC snubber with poly silicon resistor and capacitor formed from jun...

Semiconductor device with source resistor

Electrically controllable integrated switch

Semiconductor integrated circuit

III-V semiconductor device with integrated power transistor and sta...

Deep trench isolation structure and method of making the same

Integrated circuit package and method

Semiconductor device and fabrication method

Parasitic capacitance reduction in GaN-on-silicon devices

3D stacked integrated circuits having functional blocks configured...

High density capacitor

Electrostatic discharge (ESD) protection circuits using tunneling f...

Semiconductor device and electronic device

Pillar select transistor for 3-dimensional cross point memory

Gate metal-insulator-field plate metal integrated circuit capacitor...

Semiconductor device and method for fabricating the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METHOD FOR PRINTING AN ELECTRICALLY CONDUCTIVE LAYER ON A SURFACE O...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

ISOLATION OF A POWER HEMT FROM OTHER CIRCUITS

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS

3DIC WITH GAP-FILL STRUCTURES AND THE METHOD OF MANUFACTURING THE SAME

3D SEMICONDUCTOR PACKAGE WITH DIE-MOUNTED VOLTAGE REGULATOR

3DIC WITH GAP-FILL STRUCTURES AND THE METHOD OF MANUFACTURING THE SAME

REPLACEMENT GATE FORMATION IN MEMORY

SUBSTRATE PROCESSING DEVICE, AND METHOD FOR MANUFACTURING METAL OXI...

INTEGRATED CIRCUIT DEVICES INCLUDING DISCHARGING PATH AND METHODS O...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

ELECTRONIC DEVICE

INTEGRATED CIRCUIT DEVICE INCLUDING WIMPY TRANSISTOR STACK WITH THI...

INTEGRATED CIRCUIT

THREE-DIMENSIONAL INTEGRATED CIRCUIT STACK

INTEGRATED CIRCUIT DEVICE INCLUDING A DIODE

CAPACITOR STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

CROSS-COUPLED GATE DESIGN FOR STACKED DEVICE WITH SEPARATED TOP-DOW...

DEVICES FOR INTEGRATED FRONT-END CIRCUITS

SEMICONDUCTOR DEVICE

Method of Metallization by a Nickel or Cobalt Alloy for the Manufac...

RESISTOR GEOMETRY

THREE-DIMENSIONAL INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREFOR

NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE...

SENSE TRANSISTOR WITH LOWER SPREADING RESISTANCE

SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE BRIDGE STRUCTURE

BACK-GATE EFFECT CONTROL VIA DOPING