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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

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H01L27/06including a plurality of individual components in a non-repetitive configuration

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure of stacked two-dimensional material layers
- Patent number 12,237,375
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mesa contact for MOS controlled power semiconductor device and meth...
- Patent number 12,237,381
- Issue date Feb 25, 2025
- Infineon Technologies AG
- Alim Karmous
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,237,386
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Sun Ki Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional field effect device
- Patent number 12,237,325
- Issue date Feb 25, 2025
- International Business Machines Corporation
- Huimei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Architecture with stacked N and P transistors with a channel struct...
- Patent number 12,237,330
- Issue date Feb 25, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Sylvain Barraud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 12,237,324
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Jangeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,230,627
- Issue date Feb 18, 2025
- Fuji Electric Co., Ltd.
- Isao Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Body tie optimization for stacked transistor amplifier
- Patent number 12,231,087
- Issue date Feb 18, 2025
- pSemi Corporation
- Simon Edward Willard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interdigitated device stack
- Patent number 12,224,281
- Issue date Feb 11, 2025
- Tokyo Electron Limited
- Lars Liebmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing 3D semiconductor devices and structures with t...
- Patent number 12,225,737
- Issue date Feb 11, 2025
- Monolithic 3D Inc.
- Deepak C. Sekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising wiring layer over driver circuit
- Patent number 12,225,711
- Issue date Feb 11, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Stacked planar capacitors based multi-function linear threshold gat...
- Patent number 12,218,045
- Issue date Feb 4, 2025
- Kepler Computing Inc.
- Amrita Mathuriya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring in diffusion breaks in an integrated circuit
- Patent number 12,218,135
- Issue date Feb 4, 2025
- Tokyo Electron Limited
- Lars Liebmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked IC structure with orthogonal interconnect layers
- Patent number 12,218,059
- Issue date Feb 4, 2025
- Adeia Semiconductor Inc.
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride-based semiconductor bidirectional switching device and meth...
- Patent number 12,218,128
- Issue date Feb 4, 2025
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Qiyue Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 12,218,024
- Issue date Feb 4, 2025
- Fuji Electric Co., Ltd.
- Motoyoshi Kubouchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional memory and methods of forming the same
- Patent number 12,219,765
- Issue date Feb 4, 2025
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-end-of-line passive device structure having common connection...
- Patent number 12,218,186
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Chiung Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making 3D segmented devices for enhanced 3D circuit density
- Patent number 12,218,011
- Issue date Feb 4, 2025
- Tokyo Electron Limited
- Mark Gardner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory array, integrated circuit including the same, and manufactur...
- Patent number 12,211,825
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Sheng Yun
- G11 - INFORMATION STORAGE
Information Patent Grant
Device including MIM capacitor and resistor
- Patent number 12,211,838
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hsiang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,211,836
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated circuit and fabrication thereof
- Patent number 12,211,789
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chenming Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including gate contact structure formed from g...
- Patent number 12,211,837
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Myunghoon Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip manufacturing method
- Patent number 12,211,754
- Issue date Jan 28, 2025
- STMicroelectronics S.r.l.
- Pierpaolo Monge Roffarello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic qubit integrated circuits
- Patent number 12,211,928
- Issue date Jan 28, 2025
- Sorin Petre Voinigescu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Group III-V IC with different sheet resistance 2-DEG resistors
- Patent number 12,211,835
- Issue date Jan 28, 2025
- Texas Instruments Incorporated
- Dong Seup Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,211,534
- Issue date Jan 28, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Super-steep switching device and inverter device using the same
- Patent number 12,211,849
- Issue date Jan 28, 2025
- Research & Business Foundation Sungkyunkwan University
- Hae Ju Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-voltage semiconductor device structures
- Patent number 12,205,949
- Issue date Jan 21, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Zhenyu Hu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRINTING AN ELECTRICALLY CONDUCTIVE LAYER ON A SURFACE O...
- Publication number 20250070043
- Publication date Feb 27, 2025
- Heraeus Electronics GmbH & Co. KG
- Ming Hung CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250070094
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-I Wu
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250072015
- Publication date Feb 27, 2025
- UNITED MICROELECTRONICS CORP.
- Chang-Yih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
- Publication number 20250070091
- Publication date Feb 27, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC WITH GAP-FILL STRUCTURES AND THE METHOD OF MANUFACTURING THE SAME
- Publication number 20250070010
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ping-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR PACKAGE WITH DIE-MOUNTED VOLTAGE REGULATOR
- Publication number 20250070031
- Publication date Feb 27, 2025
- ADVANCED MICRO DEVICES, INC.
- Gabriel H LOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250072100
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Te TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION OF A POWER HEMT FROM OTHER CIRCUITS
- Publication number 20250072102
- Publication date Feb 27, 2025
- Cambridge GaN Devices Limited
- Loizos EFTHYMIOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC WITH GAP-FILL STRUCTURES AND THE METHOD OF MANUFACTURING THE SAME
- Publication number 20250070007
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ping-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEMENT GATE FORMATION IN MEMORY
- Publication number 20250072079
- Publication date Feb 27, 2025
- Micron Technology, Inc.
- Thomas M. Graettinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING DEVICE, AND METHOD FOR MANUFACTURING METAL OXI...
- Publication number 20250059645
- Publication date Feb 20, 2025
- Duck Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250063803
- Publication date Feb 20, 2025
- UNITED MICROELECTRONICS CORP.
- Chang-Yih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING DISCHARGING PATH AND METHODS O...
- Publication number 20250063825
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- JAEHONG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250063801
- Publication date Feb 20, 2025
- Innolux Corporation
- Chin-Lung Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING WIMPY TRANSISTOR STACK WITH THI...
- Publication number 20250063782
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Panjae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT
- Publication number 20250063827
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ya-Qi MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STACK
- Publication number 20250062226
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Ho CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING A DIODE
- Publication number 20250056897
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Duckseoung KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250056819
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Lun Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250056872
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- WAN-LIN TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSS-COUPLED GATE DESIGN FOR STACKED DEVICE WITH SEPARATED TOP-DOW...
- Publication number 20250056873
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Seunghyun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES FOR INTEGRATED FRONT-END CIRCUITS
- Publication number 20250056878
- Publication date Feb 13, 2025
- MONDE Wireless Inc.
- Matthew Guidry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250056818
- Publication date Feb 13, 2025
- UNITED MICROELECTRONICS CORP.
- Chang-Yih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Metallization by a Nickel or Cobalt Alloy for the Manufac...
- Publication number 20250051927
- Publication date Feb 13, 2025
- MacDermid Enthone Inc.
- Mikailou THIAM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RESISTOR GEOMETRY
- Publication number 20250056817
- Publication date Feb 13, 2025
- Pragmatic Semiconductor Limited
- Richard PRICE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREFOR
- Publication number 20250054838
- Publication date Feb 13, 2025
- Institute of Microelectronics, Chinese Academy of Sciences
- Guanhua YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE BRIDGE STRUCTURE
- Publication number 20250046720
- Publication date Feb 6, 2025
- AP MEMORY TECHNOLOGY CORPORATION
- WEN-LIANG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE...
- Publication number 20250048713
- Publication date Feb 6, 2025
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Zhiwen DONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSE TRANSISTOR WITH LOWER SPREADING RESISTANCE
- Publication number 20250048721
- Publication date Feb 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Eung Jung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-GATE EFFECT CONTROL VIA DOPING
- Publication number 20250048691
- Publication date Feb 6, 2025
- Murata Manufacturing Co., Ltd.
- Kouassi Sebastien KOUASSI
- H01 - BASIC ELECTRIC ELEMENTS

including a plurality of individual components in a non-repetitive configuration

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure of stacked two-dimensional material layers

Mesa contact for MOS controlled power semiconductor device and meth...

Semiconductor device and method for fabricating the same

Three-dimensional field effect device

Architecture with stacked N and P transistors with a channel struct...

Integrated circuit device

Semiconductor device

Body tie optimization for stacked transistor amplifier

Interdigitated device stack

Method for producing 3D semiconductor devices and structures with t...

Semiconductor device comprising wiring layer over driver circuit

Stacked planar capacitors based multi-function linear threshold gat...

Wiring in diffusion breaks in an integrated circuit

Stacked IC structure with orthogonal interconnect layers

Nitride-based semiconductor bidirectional switching device and meth...

Semiconductor device and fabrication method thereof

Three dimensional memory and methods of forming the same

Back-end-of-line passive device structure having common connection...

Method of making 3D segmented devices for enhanced 3D circuit density

Memory array, integrated circuit including the same, and manufactur...

Device including MIM capacitor and resistor

Semiconductor device and manufacturing method thereof

Three dimensional integrated circuit and fabrication thereof

Semiconductor device including gate contact structure formed from g...

Semiconductor chip manufacturing method

Monolithic qubit integrated circuits

Group III-V IC with different sheet resistance 2-DEG resistors

Semiconductor device

Super-steep switching device and inverter device using the same

High-voltage semiconductor device structures

Patents Applicationslast 30 patents

METHOD FOR PRINTING AN ELECTRICALLY CONDUCTIVE LAYER ON A SURFACE O...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS

3DIC WITH GAP-FILL STRUCTURES AND THE METHOD OF MANUFACTURING THE SAME

3D SEMICONDUCTOR PACKAGE WITH DIE-MOUNTED VOLTAGE REGULATOR

SEMICONDUCTOR DEVICE

ISOLATION OF A POWER HEMT FROM OTHER CIRCUITS

3DIC WITH GAP-FILL STRUCTURES AND THE METHOD OF MANUFACTURING THE SAME

REPLACEMENT GATE FORMATION IN MEMORY

SUBSTRATE PROCESSING DEVICE, AND METHOD FOR MANUFACTURING METAL OXI...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

INTEGRATED CIRCUIT DEVICES INCLUDING DISCHARGING PATH AND METHODS O...

ELECTRONIC DEVICE

INTEGRATED CIRCUIT DEVICE INCLUDING WIMPY TRANSISTOR STACK WITH THI...

INTEGRATED CIRCUIT

THREE-DIMENSIONAL INTEGRATED CIRCUIT STACK

INTEGRATED CIRCUIT DEVICE INCLUDING A DIODE

CAPACITOR STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

CROSS-COUPLED GATE DESIGN FOR STACKED DEVICE WITH SEPARATED TOP-DOW...

DEVICES FOR INTEGRATED FRONT-END CIRCUITS

SEMICONDUCTOR DEVICE

Method of Metallization by a Nickel or Cobalt Alloy for the Manufac...

RESISTOR GEOMETRY

THREE-DIMENSIONAL INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE BRIDGE STRUCTURE

NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE...

SENSE TRANSISTOR WITH LOWER SPREADING RESISTANCE

BACK-GATE EFFECT CONTROL VIA DOPING