including bonding areas providing primarily thermal dissipation

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CPC
H01L2224/09519

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/09519including bonding areas providing primarily thermal dissipation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor component and method for producing a power semi...
- Patent number 11,955,402
- Issue date Apr 9, 2024
- Vitesco Technologies GbmH
- Christina Quest-Matt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and forming method thereof
- Patent number 11,955,441
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device including dummy via anch...
- Patent number 11,302,654
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including dummy via anchored to dummy metal layer
- Patent number 10,777,510
- Issue date Sep 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with heat-dissipating structure and method of...
- Patent number 10,679,955
- Issue date Jun 9, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming bonded semiconductor structures, and semiconduct...
- Patent number 10,553,562
- Issue date Feb 4, 2020
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 10,256,203
- Issue date Apr 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Lipu Kris Chuang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20240213180
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240128147
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sey-Ping SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230112006
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- Dongjoon OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MODULE WITH HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD T...
- Publication number 20220336314
- Publication date Oct 20, 2022
- SMArim Global Corp.
- TIEN-LAI WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20220216165
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION APPARATUS, PHOTOELECTRIC CONVERSION SYSTEM...
- Publication number 20210305303
- Publication date Sep 30, 2021
- Canon Kabushiki Kaisha
- Yusuke Onuki
- B60 - VEHICLES IN GENERAL
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20200411452
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES, AND SEMICONDUCT...
- Publication number 20200168584
- Publication date May 28, 2020
- Sony Semiconductor Solutions Corporation
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC BONDING FOR INTEGRATED CIRCUITS
- Publication number 20180226322
- Publication date Aug 9, 2018
- Intel Corporation
- Chwee Lin Choong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180197831
- Publication date Jul 12, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES, AND SEMICONDUCT...
- Publication number 20180012869
- Publication date Jan 11, 2018
- Sony Semiconductor Solutions Corporation
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20150084170
- Publication date Mar 26, 2015
- Hohyeuk IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES, AND SEMICONDUCT...
- Publication number 20120248621
- Publication date Oct 4, 2012
- S.O.I TEC SILICON ON INSULATOR TECHNOLOGIES
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS

including bonding areas providing primarily thermal dissipation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power semiconductor component and method for producing a power semi...

Interconnect structure and forming method thereof

Method of fabricating semiconductor device including dummy via anch...

Semiconductor device including dummy via anchored to dummy metal layer

Semiconductor package with heat-dissipating structure and method of...

Methods of forming bonded semiconductor structures, and semiconduct...

Semiconductor device and semiconductor package

Patents Applicationslast 30 patents

INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

CHIP MODULE WITH HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD T...

INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF

PHOTOELECTRIC CONVERSION APPARATUS, PHOTOELECTRIC CONVERSION SYSTEM...

METHOD OF FABRICATING SEMICONDUCTOR DEVICE

METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES, AND SEMICONDUCT...

THERMOELECTRIC BONDING FOR INTEGRATED CIRCUITS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES, AND SEMICONDUCT...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES, AND SEMICONDUCT...