including bump connectors providing primarily mechanical bonding

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H01L2224/14517

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/14517including bump connectors providing primarily mechanical bonding

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device assembly with die support structures
- Patent number 12,148,727
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and preparation methods thereof
- Patent number 12,132,022
- Issue date Oct 29, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zengyan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,119,329
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Eunkyul Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with surface-mount die support struct...
- Patent number 12,087,720
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging substrate fine pitch metal bump and reinfor...
- Patent number 11,908,819
- Issue date Feb 20, 2024
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of direct bonding semiconductor components
- Patent number 11,810,892
- Issue date Nov 7, 2023
- Imec VZW
- Jaber Derakhshandeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,769,755
- Issue date Sep 26, 2023
- Samsung Electronics Co., Ltd.
- Eunkyul Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,769,746
- Issue date Sep 26, 2023
- Samsung Electronics Co., Ltd.
- Ae-nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing pillar structures on semicond...
- Patent number 11,735,549
- Issue date Aug 22, 2023
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages with angled pillars for decreasing st...
- Patent number 11,721,658
- Issue date Aug 8, 2023
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC chip package with dummy solder structure under corner, and relat...
- Patent number 11,682,646
- Issue date Jun 20, 2023
- MARVELL ASIA PTE. LTD.
- Manish Nayini
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor package including a first s...
- Patent number 11,646,299
- Issue date May 9, 2023
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip, method of manufacturing the integrated cir...
- Patent number 11,569,206
- Issue date Jan 31, 2023
- Samsung Electronics Co., Ltd.
- Min-hee Uh
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor packaging substrate fine pitch metal bump and reinfor...
- Patent number 11,545,455
- Issue date Jan 3, 2023
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,476,220
- Issue date Oct 18, 2022
- Samsung Electronics Co., Ltd.
- Jimin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,456,268
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a semiconductor device bonded to a cir...
- Patent number 11,387,183
- Issue date Jul 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,335,668
- Issue date May 17, 2022
- Samsung Electronics Co., Ltd.
- Eunkyul Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a first sub-package stacked atop a...
- Patent number 11,239,217
- Issue date Feb 1, 2022
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC chip package with dummy solder structure under corner, and relat...
- Patent number 11,171,104
- Issue date Nov 9, 2021
- Marvell Asia Pte, Ltd.
- Manish Nayini
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device packages with angled pillars for decreasing st...
- Patent number 11,164,837
- Issue date Nov 2, 2021
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing pillar structures on semicond...
- Patent number 11,081,460
- Issue date Aug 3, 2021
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and display device using the same
- Patent number 11,069,641
- Issue date Jul 20, 2021
- LG Display Co., Ltd.
- Daehwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip, method of manufacturing the integrated cir...
- Patent number 11,049,846
- Issue date Jun 29, 2021
- Samsung Electronics Co., Ltd.
- Min-hee Uh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having metal bump and method of manufacturing...
- Patent number 11,037,894
- Issue date Jun 15, 2021
- Samsung Electronics Co., Ltd.
- Jinchan Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with surface-mount die support struct...
- Patent number 10,950,568
- Issue date Mar 16, 2021
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,943,881
- Issue date Mar 9, 2021
- Samsung Electronics Co., Ltd.
- Ae-nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with die support structures
- Patent number 10,923,447
- Issue date Feb 16, 2021
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,833,037
- Issue date Nov 10, 2020
- Rohm Co., Ltd.
- Kiyotaka Umemoto
- G01 - MEASURING TESTING
Information Patent Grant
Electronic component including a conductive pillar and method of ma...
- Patent number 10,818,627
- Issue date Oct 27, 2020
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER
- Publication number 20240395746
- Publication date Nov 28, 2024
- SK HYNIX INC.
- Jae Jun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD...
- Publication number 20240234358
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- JUNHO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240234342
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Geunwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Bump Configurations in Circuitry and Methods of Manufacture...
- Publication number 20240178174
- Publication date May 30, 2024
- Anwar Hashmi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240136307
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Geunwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240047446
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230387083
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- EUNKYUL OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS R...
- Publication number 20230282607
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Ting Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-YIELDING AND ULTRAFINE PITCH PACKAGES FOR LARGE-SCALE IC OR AD...
- Publication number 20230238345
- Publication date Jul 27, 2023
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230223368
- Publication date Jul 13, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Zengyan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230154866
- Publication date May 18, 2023
- SAMSUNG ELECTRONICS CO., LTD.
- Juyoun CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230132054
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- Wooram MYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Substrate Fine Pitch Metal Bump and Reinfor...
- Publication number 20230115986
- Publication date Apr 13, 2023
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND PREPARATION METHODS THEREOF
- Publication number 20230054495
- Publication date Feb 23, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zengyan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20230009719
- Publication date Jan 12, 2023
- InnoLux Corporation
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220302030
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220262769
- Publication date Aug 18, 2022
- Samsung Electronics Co., Ltd.
- EUNKYUL OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE INCLUDING A FIRST S...
- Publication number 20220102328
- Publication date Mar 31, 2022
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device, Method Making It And Packaging Structure
- Publication number 20220052008
- Publication date Feb 17, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Zengyan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES WITH ANGLED PILLARS FOR DECREASING ST...
- Publication number 20220028814
- Publication date Jan 27, 2022
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES WITH ANGLED PILLARS FOR DECREASING ST...
- Publication number 20210366859
- Publication date Nov 25, 2021
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING PILLAR STRUCTURES ON SEMICOND...
- Publication number 20210343670
- Publication date Nov 4, 2021
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210305223
- Publication date Sep 30, 2021
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20210305190
- Publication date Sep 30, 2021
- Samsung Electronics Co., Ltd.
- Jimin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP, METHOD OF MANUFACTURING THE INTEGRATED CIR...
- Publication number 20210296287
- Publication date Sep 23, 2021
- Samsung Electronics Co., Ltd.
- Min-hee UH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210183801
- Publication date Jun 17, 2021
- Samsung Electronics Co., Ltd.
- Ae-nee JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES
- Publication number 20210167030
- Publication date Jun 3, 2021
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING SEMICONDUCTOR COMPONENTS
- Publication number 20210159207
- Publication date May 27, 2021
- IMEC vzw
- Jaber Derakhshandeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20210134761
- Publication date May 6, 2021
- Samsung Electronics Co., Ltd.
- EUNKYUL OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC CHIP PACKAGE WITH DUMMY SOLDER STRUCTURE UNDER CORNER, AND RELAT...
- Publication number 20210125952
- Publication date Apr 29, 2021
- Marvell International Ltd.
- Manish Nayini
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

including bump connectors providing primarily mechanical bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device assembly with die support structures

Semiconductor devices and preparation methods thereof

Semiconductor package and method of fabricating the same

Semiconductor device assembly with surface-mount die support struct...

Semiconductor packaging substrate fine pitch metal bump and reinfor...

Method of direct bonding semiconductor components

Semiconductor package and method of fabricating the same

Semiconductor package

Methods and systems for manufacturing pillar structures on semicond...

Semiconductor device packages with angled pillars for decreasing st...

IC chip package with dummy solder structure under corner, and relat...

Method of manufacturing a semiconductor package including a first s...

Integrated circuit chip, method of manufacturing the integrated cir...

Semiconductor packaging substrate fine pitch metal bump and reinfor...

Semiconductor packages

Semiconductor package and manufacturing method thereof

Semiconductor package having a semiconductor device bonded to a cir...

Semiconductor package and method of fabricating the same

Semiconductor package including a first sub-package stacked atop a...

IC chip package with dummy solder structure under corner, and relat...

Semiconductor device packages with angled pillars for decreasing st...

Methods and systems for manufacturing pillar structures on semicond...

Integrated circuit package and display device using the same

Integrated circuit chip, method of manufacturing the integrated cir...

Semiconductor device having metal bump and method of manufacturing...

Semiconductor device assembly with surface-mount die support struct...

Semiconductor package

Semiconductor device assembly with die support structures

Semiconductor device

Electronic component including a conductive pillar and method of ma...

Patents Applicationslast 30 patents

SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER

SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD...

SEMICONDUCTOR PACKAGE

Solder Bump Configurations in Circuitry and Methods of Manufacture...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS R...

HIGH-YIELDING AND ULTRAFINE PITCH PACKAGES FOR LARGE-SCALE IC OR AD...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

Semiconductor Packaging Substrate Fine Pitch Metal Bump and Reinfor...

SEMICONDUCTOR DEVICES AND PREPARATION METHODS THEREOF

ELECTRONIC APPARATUS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE INCLUDING A FIRST S...

Semiconductor Device, Method Making It And Packaging Structure

SEMICONDUCTOR DEVICE PACKAGES WITH ANGLED PILLARS FOR DECREASING ST...

SEMICONDUCTOR DEVICE PACKAGES WITH ANGLED PILLARS FOR DECREASING ST...

METHODS AND SYSTEMS FOR MANUFACTURING PILLAR STRUCTURES ON SEMICOND...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES

INTEGRATED CIRCUIT CHIP, METHOD OF MANUFACTURING THE INTEGRATED CIR...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES

METHOD FOR BONDING SEMICONDUCTOR COMPONENTS

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

IC CHIP PACKAGE WITH DUMMY SOLDER STRUCTURE UNDER CORNER, AND RELAT...