including bump connectors providing primarily thermal dissipation

Industry

CPC
H01L2224/17519

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/17519including bump connectors providing primarily thermal dissipation

Industries

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic package with solder array thermal interface materia...
- Patent number 12,205,915
- Issue date Jan 21, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal pads between stacked semiconductor dies and associated syst...
- Patent number 12,033,980
- Issue date Jul 9, 2024
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC die and heat spreaders with solderable thermal interface structu...
- Patent number 11,984,377
- Issue date May 14, 2024
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including high thermal conductivity layer
- Patent number 11,948,851
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Sunjae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform electrochemical plating of metal onto arrays of pillars hav...
- Patent number 11,923,329
- Issue date Mar 5, 2024
- Jonathan S. Hacker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexible circuit board and chip package having a chip mounting region
- Patent number 11,903,119
- Issue date Feb 13, 2024
- LG Innotek Co., Ltd
- Chae Won Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies including thermal circuits and methods of...
- Patent number 11,791,315
- Issue date Oct 17, 2023
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing stacked semiconductor die assemblies with...
- Patent number 11,776,877
- Issue date Oct 3, 2023
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package including a hybrid thermal interface material an...
- Patent number 11,749,631
- Issue date Sep 5, 2023
- Apple Inc.
- Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with solder array thermal interface materia...
- Patent number 11,735,552
- Issue date Aug 22, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor packaging device and heat di...
- Patent number 11,658,091
- Issue date May 23, 2023
- Global Unichip Corporation
- Jia-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on film package
- Patent number 11,581,261
- Issue date Feb 14, 2023
- Novatek Microelectronics Corp.
- Chun-Yu Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform electrochemical plating of metal onto arrays of pillars hav...
- Patent number 11,527,505
- Issue date Dec 13, 2022
- Micron Technology, Inc.
- Jonathan S. Hacker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Effective heat conduction from hotspot to heat spreader through pac...
- Patent number 11,502,017
- Issue date Nov 15, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having planarized passivation layer and method...
- Patent number 11,488,894
- Issue date Nov 1, 2022
- Samsung Electronics Co., Ltd.
- Young Lyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation structure, semiconductor packaging device, and man...
- Patent number 11,450,586
- Issue date Sep 20, 2022
- Global Unichip Corporation
- Jia-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package device
- Patent number 11,430,760
- Issue date Aug 30, 2022
- Huawei Technologies Co., Ltd.
- Jiajie Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer layers embedded with metal pads for heat dissipation
- Patent number 11,398,440
- Issue date Jul 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Hsiang Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies including thermal circuits and methods of...
- Patent number 11,171,118
- Issue date Nov 9, 2021
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pads with thermal pathways
- Patent number 11,139,258
- Issue date Oct 5, 2021
- Micron Technology, Inc.
- Jaspreet S Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreading device and method
- Patent number 10,867,884
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreading device and method
- Patent number 10,867,885
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having planarized passivation layer and method...
- Patent number 10,847,447
- Issue date Nov 24, 2020
- Samsung Electronics Co., Ltd.
- Young Lyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform electrochemical plating of metal onto arrays of pillars hav...
- Patent number 10,847,486
- Issue date Nov 24, 2020
- Micron Technology, Inc.
- Jonathan S. Hacker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor devices with underfill control features, and associat...
- Patent number 10,784,224
- Issue date Sep 22, 2020
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device apparatus with multiple thermally conductive path...
- Patent number 10,720,377
- Issue date Jul 21, 2020
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with heat-dissipating structure and method of...
- Patent number 10,679,955
- Issue date Jun 9, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal pads between stacked semiconductor dies and associated syst...
- Patent number 10,651,155
- Issue date May 12, 2020
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die assemblies with heat sink and associated systems...
- Patent number 10,636,678
- Issue date Apr 28, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die with in-chip heat sink
- Patent number 10,629,512
- Issue date Apr 21, 2020
- Xilinx, Inc.
- Hong-Tsz Pan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS INCLUDING TSV STRUCTURE
- Publication number 20240421040
- Publication date Dec 19, 2024
- Micron Technology, Inc.
- SEIJI NARUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...
- Publication number 20240347511
- Publication date Oct 17, 2024
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER
- Publication number 20240222217
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Sunjae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF DIFFERENT STACKED CH...
- Publication number 20240194643
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Youngdeuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM ELECTROCHEMICAL PLATING OF METAL ONTO ARRAYS OF PILLARS HAV...
- Publication number 20240178175
- Publication date May 30, 2024
- Lodestar Licensing Group LLC
- Jonathan S. Hacker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGING DEVICE INCLUDING BUMPS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240105656
- Publication date Mar 28, 2024
- SK HYNIX INC.
- Jae Jun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC PACKAGE
- Publication number 20240096835
- Publication date Mar 21, 2024
- Siliconware Precision Industries Co., Ltd.
- Pin-Jing SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240096754
- Publication date Mar 21, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yuan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240055385
- Publication date Feb 15, 2024
- WISTRON NEWEB CORPORATION
- KUO-HUA HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20230395463
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...
- Publication number 20230343738
- Publication date Oct 26, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM ELECTROCHEMICAL PLATING OF METAL ONTO ARRAYS OF PILLARS HAV...
- Publication number 20230104042
- Publication date Apr 6, 2023
- Micron Technology, Inc.
- Jonathan S. Hacker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGING DEVICE AND HEAT DI...
- Publication number 20220367313
- Publication date Nov 17, 2022
- Global Unichip Corporation
- Jia-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE, SEMICONDUCTOR PACKAGING DEVICE, AND MAN...
- Publication number 20220262701
- Publication date Aug 18, 2022
- Global Unichip Corporation
- Jia-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES INCLUDING THERMAL CIRCUITS AND METHODS OF...
- Publication number 20220059508
- Publication date Feb 24, 2022
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT BOARD FOR CHIP ON FILM AND CHIP PACKAGE COMPRISING...
- Publication number 20220046785
- Publication date Feb 10, 2022
- LG Innotek Co., Ltd.
- Chae Won Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20220013434
- Publication date Jan 13, 2022
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Thermal Interface Material and Low Temperature Solder Patter...
- Publication number 20210366861
- Publication date Nov 25, 2021
- Apple Inc.
- Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTU...
- Publication number 20210305121
- Publication date Sep 30, 2021
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON FILM PACKAGE
- Publication number 20210183781
- Publication date Jun 17, 2021
- NOVATEK MICROELECTRONICS CORP.
- Chun-Yu Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM ELECTROCHEMICAL PLATING OF METAL ONTO ARRAYS OF PILLARS HAV...
- Publication number 20210074663
- Publication date Mar 11, 2021
- Micron Technology, Inc.
- Jonathan S. Hacker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE HAVING PLANARIZED PASSIVATION LAYER AND METHO...
- Publication number 20210028092
- Publication date Jan 28, 2021
- Samsung Electronics Co., Ltd.
- YOUNG LYONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES INCLUDING THERMAL CIRCUITS AND METHODS OF...
- Publication number 20210005575
- Publication date Jan 7, 2021
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...
- Publication number 20200411464
- Publication date Dec 31, 2020
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...
- Publication number 20200411482
- Publication date Dec 31, 2020
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE DEVICE
- Publication number 20200350274
- Publication date Nov 5, 2020
- Huawei Technologies Co., Ltd
- Jiajie TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFECTIVE HEAT CONDUCTION FROM HOTSPOT TO HEAT SPREADER THROUGH PAC...
- Publication number 20200185300
- Publication date Jun 11, 2020
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PADS WITH THERMAL PATHWAYS
- Publication number 20200176404
- Publication date Jun 4, 2020
- Micron Technology, Inc.
- JASPREET S. GANDHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE APPARATUS WITH MULTIPLE THERMALLY CONDUCTIVE PATH...
- Publication number 20200152546
- Publication date May 14, 2020
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Spreading Device and Method
- Publication number 20200013697
- Publication date Jan 9, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

including bump connectors providing primarily thermal dissipation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Microelectronic package with solder array thermal interface materia...

Thermal pads between stacked semiconductor dies and associated syst...

IC die and heat spreaders with solderable thermal interface structu...

Semiconductor package including high thermal conductivity layer

Uniform electrochemical plating of metal onto arrays of pillars hav...

Flexible circuit board and chip package having a chip mounting region

Semiconductor assemblies including thermal circuits and methods of...

Methods of manufacturing stacked semiconductor die assemblies with...

Electronic package including a hybrid thermal interface material an...

Microelectronic package with solder array thermal interface materia...

Methods of manufacturing semiconductor packaging device and heat di...

Chip on film package

Uniform electrochemical plating of metal onto arrays of pillars hav...

Effective heat conduction from hotspot to heat spreader through pac...

Semiconductor device having planarized passivation layer and method...

Heat dissipation structure, semiconductor packaging device, and man...

Chip package device

Polymer layers embedded with metal pads for heat dissipation

Semiconductor assemblies including thermal circuits and methods of...

Bonding pads with thermal pathways

Heat spreading device and method

Heat spreading device and method

Semiconductor device having planarized passivation layer and method...

Uniform electrochemical plating of metal onto arrays of pillars hav...

Semiconductor devices with underfill control features, and associat...

Electronic device apparatus with multiple thermally conductive path...

Semiconductor package with heat-dissipating structure and method of...

Thermal pads between stacked semiconductor dies and associated syst...

Semiconductor die assemblies with heat sink and associated systems...

Integrated circuit die with in-chip heat sink

Patents Applicationslast 30 patents

APPARATUS INCLUDING TSV STRUCTURE

THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...

SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER

SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF DIFFERENT STACKED CH...

UNIFORM ELECTROCHEMICAL PLATING OF METAL ONTO ARRAYS OF PILLARS HAV...

PACKAGING DEVICE INCLUDING BUMPS AND METHOD OF MANUFACTURING THE SAME

MANUFACTURING METHOD OF ELECTRONIC PACKAGE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...

UNIFORM ELECTROCHEMICAL PLATING OF METAL ONTO ARRAYS OF PILLARS HAV...

METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGING DEVICE AND HEAT DI...

HEAT DISSIPATION STRUCTURE, SEMICONDUCTOR PACKAGING DEVICE, AND MAN...

SEMICONDUCTOR ASSEMBLIES INCLUDING THERMAL CIRCUITS AND METHODS OF...

FLEXIBLE CIRCUIT BOARD FOR CHIP ON FILM AND CHIP PACKAGE COMPRISING...

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

Hybrid Thermal Interface Material and Low Temperature Solder Patter...

IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTU...

CHIP ON FILM PACKAGE

UNIFORM ELECTROCHEMICAL PLATING OF METAL ONTO ARRAYS OF PILLARS HAV...

SEMICONDUCTOR DEVICE HAVING PLANARIZED PASSIVATION LAYER AND METHO...

SEMICONDUCTOR ASSEMBLIES INCLUDING THERMAL CIRCUITS AND METHODS OF...

MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...

THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...

CHIP PACKAGE DEVICE

EFFECTIVE HEAT CONDUCTION FROM HOTSPOT TO HEAT SPREADER THROUGH PAC...

BONDING PADS WITH THERMAL PATHWAYS

ELECTRONIC DEVICE APPARATUS WITH MULTIPLE THERMALLY CONDUCTIVE PATH...

Heat Spreading Device and Method