including bump connectors providing primarily thermal dissipation

Industry

CPC
H01L2224/14519

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/14519including bump connectors providing primarily thermal dissipation

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including heat dissipation layer
- Patent number 11,699,684
- Issue date Jul 11, 2023
- SK hynix Inc.
- Joo Wan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip
- Patent number 11,676,825
- Issue date Jun 13, 2023
- Murata Manufacturing Co., Ltd.
- Kenichi Shimamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,658,160
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Hyeonjun Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with enhanced thermal dissipation and method f...
- Patent number 11,626,343
- Issue date Apr 11, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having planarized passivation layer and method...
- Patent number 11,488,894
- Issue date Nov 1, 2022
- Samsung Electronics Co., Ltd.
- Young Lyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked circuits of III-V devices over silicon with high quality in...
- Patent number 11,393,789
- Issue date Jul 19, 2022
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,257,794
- Issue date Feb 22, 2022
- Samsung Electronics Co., Ltd.
- Hyeonjun Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,257,784
- Issue date Feb 22, 2022
- Samsung Electronics Co., Ltd.
- Bongken Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip die package structure and electronic device
- Patent number 11,251,136
- Issue date Feb 15, 2022
- Huawei Technologies Co., Ltd.
- Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pads with thermal pathways
- Patent number 11,139,258
- Issue date Oct 5, 2021
- Micron Technology, Inc.
- Jaspreet S Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip
- Patent number 10,971,377
- Issue date Apr 6, 2021
- Murata Manufacturing Co., Ltd.
- Kenichi Shimamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having planarized passivation layer and method...
- Patent number 10,847,447
- Issue date Nov 24, 2020
- Samsung Electronics Co., Ltd.
- Young Lyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit nanoparticle thermal routing structure in interc...
- Patent number 10,811,334
- Issue date Oct 20, 2020
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using an interconnect bump to traverse through a passivation layer...
- Patent number 10,777,524
- Issue date Sep 15, 2020
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pads with thermal pathways
- Patent number 10,580,746
- Issue date Mar 3, 2020
- Micron Technology, Inc.
- Jaspreet S Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 10,256,203
- Issue date Apr 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Lipu Kris Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semicondutor chip
- Patent number 10,211,073
- Issue date Feb 19, 2019
- Murata Manufacturing Co., Ltd.
- Kenichi Shimamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and electronic device having heat dissipation...
- Patent number 10,192,855
- Issue date Jan 29, 2019
- Samsung Electronics Co., Ltd.
- Sunkyoung Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, semiconductor package including the same, and m...
- Patent number 10,134,702
- Issue date Nov 20, 2018
- Samsung Electronics Co., Ltd.
- Sun-kyoung Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation bump electrode for chip on film
- Patent number 10,121,721
- Issue date Nov 6, 2018
- Lapis Semiconductor Co., Ltd.
- Hiroyoshi Ichikura
- G02 - OPTICS
Information Patent Grant
Semiconductor package having stacked chips and a heat dissipation p...
- Patent number 9,875,992
- Issue date Jan 23, 2018
- Samsung Electronics Co., Ltd.
- Junyeong Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip assembled on an interposer
- Patent number 9,780,015
- Issue date Oct 3, 2017
- STMicroelectronics S.A.
- Pierre Bar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-package and methods of manufacturing semiconductor package and...
- Patent number 9,761,477
- Issue date Sep 12, 2017
- Samsung Electronics Co., Ltd.
- Gun-ho Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, semiconductor package including the same, and m...
- Patent number 9,666,551
- Issue date May 30, 2017
- Smasung Electronics Co., Ltd.
- Sun-kyoung Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip assembled on an interposer
- Patent number 9,418,954
- Issue date Aug 16, 2016
- STMicroelectronics S.A.
- Pierre Bar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced stacked microelectronic assemblies with central contacts a...
- Patent number 9,312,239
- Issue date Apr 12, 2016
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and device provided with heat dissipation m...
- Patent number 8,928,148
- Issue date Jan 6, 2015
- STMicroelectronics (Grenoble 2) SAS
- Romain Coffy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced stacked microelectronic assemblies with central contacts a...
- Patent number 8,553,420
- Issue date Oct 8, 2013
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Package
- Publication number 20240170380
- Publication date May 23, 2024
- SEIKO EPSON CORPORATION
- Michiyoshi TAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240006362
- Publication date Jan 4, 2024
- Samsung Electronics Co., Ltd.
- Ju Bin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20230361170
- Publication date Nov 9, 2023
- MURATA MANUFACTURING CO., LTD.
- Fuminori MORISAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYER
- Publication number 20230317683
- Publication date Oct 5, 2023
- SK HYNIX INC.
- Joo Wan HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING THE SEMICONDUCT...
- Publication number 20220392859
- Publication date Dec 8, 2022
- Samsung Electronics Co., Ltd.
- Keum Hee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...
- Publication number 20220367318
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYER
- Publication number 20220173072
- Publication date Jun 2, 2022
- SK HYNIX INC.
- Joo Wan HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220157776
- Publication date May 19, 2022
- Samsung Electronics Co., Ltd.
- Bongken Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220139881
- Publication date May 5, 2022
- Samsung Electronics Co., Ltd.
- Hyeonjun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210265315
- Publication date Aug 26, 2021
- Samsung Electronics Co., Ltd.
- Hyeonjun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING ELEMENT AND SEMICONDUCTOR LIGHT EMITTI...
- Publication number 20210217942
- Publication date Jul 15, 2021
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Yasumitsu KUNOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP
- Publication number 20210193484
- Publication date Jun 24, 2021
- Murata Manufacturing Co., Ltd.
- Kenichi SHIMAMOTO
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210082872
- Publication date Mar 18, 2021
- SAMSUNG ELECTRONICS CO., LTD.
- Bongken Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING PLANARIZED PASSIVATION LAYER AND METHO...
- Publication number 20210028092
- Publication date Jan 28, 2021
- Samsung Electronics Co., Ltd.
- YOUNG LYONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-Chip Die Package Structure and Electronic Device
- Publication number 20210013154
- Publication date Jan 14, 2021
- Huawei Technologies Co., Ltd
- Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CIRCUITS OF III-V DEVICES OVER SILICON WITH HIGH QUALITY IN...
- Publication number 20200381398
- Publication date Dec 3, 2020
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PADS WITH THERMAL PATHWAYS
- Publication number 20200176404
- Publication date Jun 4, 2020
- Micron Technology, Inc.
- JASPREET S. GANDHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...
- Publication number 20200135613
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL SHUNTS AND THERMAL MANAGEMENT IN MONOLITHIC MICROWAVE INTEG...
- Publication number 20190189580
- Publication date Jun 20, 2019
- DUET MICROELECTRONICS INC.
- Ali Badar Alamin Dow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP
- Publication number 20190148172
- Publication date May 16, 2019
- MURATA MANUFACTURING CO., LTD.
- Kenichi SHIMAMOTO
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
USING AN INTERCONNECT BUMP TO TRAVERSE THROUGH A PASSIVATION LAYER...
- Publication number 20180366431
- Publication date Dec 20, 2018
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT NANOPARTICLE THERMAL ROUTING STRUCTURE IN INTERC...
- Publication number 20180151470
- Publication date May 31, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH THERMAL CONDUCTIVITY VIAS BY ADDITIVE PROCESSING
- Publication number 20180151471
- Publication date May 31, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING MODULE, LIGHTING APPARATUS FOR MOBILE OBJECT, AND MO...
- Publication number 20180062059
- Publication date Mar 1, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- Masashi KICHIMA
- F21 - LIGHTING
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND M...
- Publication number 20170229412
- Publication date Aug 10, 2017
- Samsung Electronics Co., Ltd.
- Sun-kyoung SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged microelectronic elements having blind vias for heat dissip...
- Publication number 20170207141
- Publication date Jul 20, 2017
- Tessera, Inc.
- David Edward Fisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND M...
- Publication number 20170170136
- Publication date Jun 15, 2017
- Samsung Electronics Co., Ltd.
- Sun-kyoung SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-PACKAGE AND METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGE AND...
- Publication number 20170025302
- Publication date Jan 26, 2017
- Samsung Electronics Co., Ltd.
- Gun-ho Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USING AN INTERCONNECT BUMP TO TRAVERSE THROUGH A PASSIVATION LAYER...
- Publication number 20170018520
- Publication date Jan 19, 2017
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20160079208
- Publication date Mar 17, 2016
- Junyeong HEO
- H01 - BASIC ELECTRIC ELEMENTS

including bump connectors providing primarily thermal dissipation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package including heat dissipation layer

Semiconductor chip

Semiconductor package and method of manufacturing the same

Semiconductor device with enhanced thermal dissipation and method f...

Semiconductor device having planarized passivation layer and method...

Stacked circuits of III-V devices over silicon with high quality in...

Semiconductor package and method of manufacturing the same

Semiconductor package

Flip-chip die package structure and electronic device

Bonding pads with thermal pathways

Semiconductor chip

Semiconductor device having planarized passivation layer and method...

Integrated circuit nanoparticle thermal routing structure in interc...

Using an interconnect bump to traverse through a passivation layer...

Bonding pads with thermal pathways

Semiconductor device and semiconductor package

Semicondutor chip

Semiconductor package and electronic device having heat dissipation...

Semiconductor chip, semiconductor package including the same, and m...

Heat dissipation bump electrode for chip on film

Semiconductor package having stacked chips and a heat dissipation p...

Integrated circuit chip assembled on an interposer

Pre-package and methods of manufacturing semiconductor package and...

Semiconductor chip, semiconductor package including the same, and m...

Integrated circuit chip assembled on an interposer

Enhanced stacked microelectronic assemblies with central contacts a...

Semiconductor component and device provided with heat dissipation m...

Enhanced stacked microelectronic assemblies with central contacts a...

Patents Applicationslast 30 patents

Semiconductor Package

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYER

SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING THE SEMICONDUCT...

SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...

SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYER

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR LIGHT EMITTING ELEMENT AND SEMICONDUCTOR LIGHT EMITTI...

SEMICONDUCTOR CHIP

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE HAVING PLANARIZED PASSIVATION LAYER AND METHO...

Flip-Chip Die Package Structure and Electronic Device

STACKED CIRCUITS OF III-V DEVICES OVER SILICON WITH HIGH QUALITY IN...

BONDING PADS WITH THERMAL PATHWAYS

SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...

THERMAL SHUNTS AND THERMAL MANAGEMENT IN MONOLITHIC MICROWAVE INTEG...

SEMICONDUCTOR CHIP

USING AN INTERCONNECT BUMP TO TRAVERSE THROUGH A PASSIVATION LAYER...

INTEGRATED CIRCUIT NANOPARTICLE THERMAL ROUTING STRUCTURE IN INTERC...

HIGH THERMAL CONDUCTIVITY VIAS BY ADDITIVE PROCESSING

LIGHT-EMITTING MODULE, LIGHTING APPARATUS FOR MOBILE OBJECT, AND MO...

SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND M...

Packaged microelectronic elements having blind vias for heat dissip...

SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND M...

PRE-PACKAGE AND METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGE AND...

USING AN INTERCONNECT BUMP TO TRAVERSE THROUGH A PASSIVATION LAYER...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME