including layer connectors providing primarily thermal dissipation

Industry

CPC
H01L2224/33519

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/33519including layer connectors providing primarily thermal dissipation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 11,961,779
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and forming method thereof
- Patent number 11,955,441
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,855,067
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 11,742,323
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor packaging device and heat di...
- Patent number 11,658,091
- Issue date May 23, 2023
- Global Unichip Corporation
- Jia-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with enhanced thermal dissipation and method f...
- Patent number 11,626,343
- Issue date Apr 11, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,502,072
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation structure, semiconductor packaging device, and man...
- Patent number 11,450,586
- Issue date Sep 20, 2022
- Global Unichip Corporation
- Jia-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device including dummy via anch...
- Patent number 11,302,654
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 11,037,852
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including dummy via anchored to dummy metal layer
- Patent number 10,777,510
- Issue date Sep 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control in package-on-package structures
- Patent number 10,535,616
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 10,461,009
- Issue date Oct 29, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer board and electronic device
- Patent number 10,354,939
- Issue date Jul 16, 2019
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low thermal resistance hanging die package
- Patent number 10,347,558
- Issue date Jul 9, 2019
- Intel IP Corporation
- Christian Geissler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 10,256,203
- Issue date Apr 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Lipu Kris Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control in package-on-package structures
- Patent number 10,170,434
- Issue date Jan 1, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 10,157,813
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package semiconductor device
- Patent number 10,083,940
- Issue date Sep 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control in package-on-package structures
- Patent number 9,941,221
- Issue date Apr 10, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 9,735,082
- Issue date Aug 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package semiconductor device
- Patent number 9,685,426
- Issue date Jun 20, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control in package-on-package structures
- Patent number 9,559,064
- Issue date Jan 31, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF
- Publication number 20240363577
- Publication date Oct 31, 2024
- Siliconware Precision Industries Co., Ltd.
- Pin-Jing SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES
- Publication number 20240222218
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20240213180
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240203960
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Seokhyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC PACKAGE
- Publication number 20240096835
- Publication date Mar 21, 2024
- Siliconware Precision Industries Co., Ltd.
- Pin-Jing SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20240088123
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240079366
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Jonggyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230378130
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20220392884
- Publication date Dec 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGING DEVICE AND HEAT DI...
- Publication number 20220367313
- Publication date Nov 17, 2022
- Global Unichip Corporation
- Jia-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...
- Publication number 20220367318
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20220344304
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE, SEMICONDUCTOR PACKAGING DEVICE, AND MAN...
- Publication number 20220262701
- Publication date Aug 18, 2022
- Global Unichip Corporation
- Jia-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20220216165
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20210327866
- Publication date Oct 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20200411452
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...
- Publication number 20200135613
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warpage Control in Package-on-Package Structures
- Publication number 20190131254
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Packaging with Hot Spot Thermal Management Features
- Publication number 20190096781
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER BOARD AND ELECTRONIC DEVICE
- Publication number 20180233429
- Publication date Aug 16, 2018
- Murata Manufacturing Co., Ltd.
- Kuniaki YOSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warpage Control in Package-on-Package Structures
- Publication number 20180226363
- Publication date Aug 9, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW THERMAL RESISTANCE HANGING DIE PACKAGE
- Publication number 20180218962
- Publication date Aug 2, 2018
- Intel IP Corporation
- Christian GEISSLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Packaging with Hot Spot Thermal Management Features
- Publication number 20170345732
- Publication date Nov 30, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SEMICONDUCTOR DEVICE
- Publication number 20170278827
- Publication date Sep 28, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Packaging with Hot Spot Thermal Management Features
- Publication number 20150155218
- Publication date Jun 4, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warpage Control in Package-on-Package Structures
- Publication number 20150155243
- Publication date Jun 4, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140077388
- Publication date Mar 20, 2014
- Samsung Electronics Co., Ltd.
- Hong-Pyo HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SEMICONDUCTOR DEVICE
- Publication number 20140054760
- Publication date Feb 27, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP DEVICE WITH THERMAL INTERFACE MATERIAL FRAME
- Publication number 20130105975
- Publication date May 2, 2013
- Rafiqul Hussain
- H01 - BASIC ELECTRIC ELEMENTS

including layer connectors providing primarily thermal dissipation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

3DIC packaging with hot spot thermal management features

Interconnect structure and forming method thereof

Integrated circuit package and method

Semiconductor structure and method of forming the same

Methods of manufacturing semiconductor packaging device and heat di...

Semiconductor device with enhanced thermal dissipation and method f...

Integrated circuit package and method

Heat dissipation structure, semiconductor packaging device, and man...

Method of fabricating semiconductor device including dummy via anch...

3DIC packaging with hot spot thermal management features

Semiconductor device including dummy via anchored to dummy metal layer

Warpage control in package-on-package structures

3DIC packaging with hot spot thermal management features

Multilayer board and electronic device

Low thermal resistance hanging die package

Semiconductor device and semiconductor package

Warpage control in package-on-package structures

3DIC packaging with hot spot thermal management features

Package-on-package semiconductor device

Warpage control in package-on-package structures

3DIC packaging with hot spot thermal management features

Package-on-package semiconductor device

Warpage control in package-on-package structures

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF

3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES

INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF

SEMICONDUCTOR PACKAGE

MANUFACTURING METHOD OF ELECTRONIC PACKAGE

Integrated Circuit Package and Method

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

Integrated Circuit Package and Method

METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGING DEVICE AND HEAT DI...

SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

HEAT DISSIPATION STRUCTURE, SEMICONDUCTOR PACKAGING DEVICE, AND MAN...

INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF

INTEGRATED CIRCUIT PACKAGE AND METHOD

METHOD OF FABRICATING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...

Warpage Control in Package-on-Package Structures

3DIC Packaging with Hot Spot Thermal Management Features

MULTILAYER BOARD AND ELECTRONIC DEVICE

Warpage Control in Package-on-Package Structures

LOW THERMAL RESISTANCE HANGING DIE PACKAGE

3DIC Packaging with Hot Spot Thermal Management Features

PACKAGE-ON-PACKAGE SEMICONDUCTOR DEVICE

3DIC Packaging with Hot Spot Thermal Management Features

Warpage Control in Package-on-Package Structures

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PACKAGE-ON-PACKAGE SEMICONDUCTOR DEVICE

SEMICONDUCTOR CHIP DEVICE WITH THERMAL INTERFACE MATERIAL FRAME