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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

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H01L27/08including only semiconductor components of a single kind

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method
- Patent number 12,272,557
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuei-Lun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around integrated circuit structures having adjacent struc...
- Patent number 12,272,737
- Issue date Apr 8, 2025
- Intel Corporation
- Biswajeet Guha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit
- Patent number 12,273,109
- Issue date Apr 8, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Jun Koyama
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor structure having an anchor-shaped backside via
- Patent number 12,272,634
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective growth self-aligned gate endcap (SAGE) architectures with...
- Patent number 12,272,688
- Issue date Apr 8, 2025
- Intel Corporation
- Leonard P. Guler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with composite oxide layer
- Patent number 12,272,689
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Negative capacitance transistor with a diffusion blocking layer
- Patent number 12,272,751
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Hsing Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Middle-of-line interconnect structure and manufacturing method
- Patent number 12,272,731
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low warpage high density trench capacitor
- Patent number 12,272,725
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jyun-Ying Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and circuits including transistors with different polariz...
- Patent number 12,272,744
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chan-Hong Chern
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with nanostructure
- Patent number 12,272,726
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-Ching Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor gate structures and methods of forming the same
- Patent number 12,272,735
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Hao Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with backside spacer and methods of forming th...
- Patent number 12,266,606
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-V semiconductor device with integrated power transistor and sta...
- Patent number 12,266,724
- Issue date Apr 1, 2025
- CAMBRIDGE GAN DEVICES LIMITED
- Florin Udrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,266,652
- Issue date Apr 1, 2025
- Samsung Electronics Co., Ltd.
- Junmo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and methods of forming the same
- Patent number 12,266,653
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ta-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structures having dielectric anchor void
- Patent number 12,266,708
- Issue date Apr 1, 2025
- Intel Corporation
- Leonard P. Guler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple gate field-effect transistors having various gate oxide th...
- Patent number 12,266,575
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET devices and methods of forming the same
- Patent number 12,266,654
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Cheng Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistors with recessed silicon cap and method forming same
- Patent number 12,266,655
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reversed tone patterning method for dipole incorporation for multip...
- Patent number 12,266,544
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Lung-Kun Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor nanostructures device structure with backside contact
- Patent number 12,266,700
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Huan-Chieh Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-gate field-effect transistors in integrated circuits
- Patent number 12,267,991
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhon Jhy Liaw
- G11 - INFORMATION STORAGE
Information Patent Grant
Transistor isolation regions and methods of forming the same
- Patent number 12,266,573
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi Chen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing thereof
- Patent number 12,266,715
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with circuit active elements and dummy active...
- Patent number 12,261,171
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Seonah Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 12,261,212
- Issue date Mar 25, 2025
- United Microelectronics Corp.
- Zhenhai Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Middle-end-of-line strap for standard cell
- Patent number 12,261,113
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Hung Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 12,261,208
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Yonghee Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for integrating high-voltage (HV) device, medium-voltage (MV...
- Patent number 12,261,086
- Issue date Mar 25, 2025
- United Microelectronics Corp.
- Chih-Kai Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEVICE AND METHOD TO REDUCE MG TO SD CAPACITANCE BY AN AIR GAP BETW...
- Publication number 20250072052
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Chun Yi CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
- Publication number 20250070091
- Publication date Feb 27, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING SEMICONDUCTOR DEVICES
- Publication number 20250072096
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Gi Woong SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20250072028
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-TE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20250072070
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Chen An Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY DEVICE FOR CORE DEVICE TO OPERATE IN A SAFE OPERATING AREA AN...
- Publication number 20250072104
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- SZU-CHUN TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR CELL AND STRUCTURE THEREOF
- Publication number 20250072108
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFIGURABLE METAL - INSULATOR - METAL CAPACITOR AND DEVICES AND PR...
- Publication number 20250070016
- Publication date Feb 27, 2025
- MACOM Technology Solutions Holdings, Inc.
- Jeremy FISHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED VIA WITH CONDUCTIVE LINK TO ADJACENT CONTACT
- Publication number 20250072069
- Publication date Feb 27, 2025
- Intel Corporation
- Leonard P. Guler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
- Publication number 20250072078
- Publication date Feb 27, 2025
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20250072101
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Uei Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTOR STRUCTURE WITH CAPPING STRUCTURE ON TFR LAYER
- Publication number 20250072013
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Tsung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250072082
- Publication date Feb 27, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- I-Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, COMPOSITE SEMICONDUCTOR DEVICE, AND DRIVE CIR...
- Publication number 20250072043
- Publication date Feb 27, 2025
- Sanken Electric Co., Ltd
- Kenichiro TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20250063799
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Ju Hun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME
- Publication number 20250063812
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shun-Jang LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FET WITH BOTTOM EPI SIZE CONTROL AND WRAPAROUND BACKSIDE CO...
- Publication number 20250062190
- Publication date Feb 20, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT RESISTANCE REDUCTION
- Publication number 20250062161
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Ming Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING
- Publication number 20250063807
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Yao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250063808
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- KUAN-TING PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250063749
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Lun LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING GATE STRUCTURE
- Publication number 20250063759
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250063781
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Shiang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCAL TRAPPED METAL CONTACT FOR STACKED FET
- Publication number 20250063795
- Publication date Feb 20, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN FIELD EFFECT TRANSISTORS HAVING VERTICALLY STACKED NANO-SHEET
- Publication number 20250063809
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wang-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NAND String Utilizing Floating Body Memory Cell
- Publication number 20250063718
- Publication date Feb 20, 2025
- Zeno Semiconductor, Inc.
- Benjamin S. Louie
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250063789
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Hsiang SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVER STAGE CURRENT DENSITY ENHANCEMENT
- Publication number 20250063798
- Publication date Feb 20, 2025
- Intel Corporation
- Yuri Rozenfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY AND MANUFACTURING METHOD THEREFOR
- Publication number 20250063714
- Publication date Feb 20, 2025
- BEIJING SUPERSTRING ACADEMY OF MEMORY TECHNOLOGY
- Zhengyong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING WIMPY TRANSISTOR STACK WITH THI...
- Publication number 20250063782
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Panjae PARK
- H01 - BASIC ELECTRIC ELEMENTS

including only semiconductor components of a single kind

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method

Gate-all-around integrated circuit structures having adjacent struc...

Semiconductor integrated circuit

Semiconductor structure having an anchor-shaped backside via

Selective growth self-aligned gate endcap (SAGE) architectures with...

Semiconductor structure with composite oxide layer

Negative capacitance transistor with a diffusion blocking layer

Middle-of-line interconnect structure and manufacturing method

Low warpage high density trench capacitor

Apparatus and circuits including transistors with different polariz...

Semiconductor structure with nanostructure

Transistor gate structures and methods of forming the same

Semiconductor device with backside spacer and methods of forming th...

III-V semiconductor device with integrated power transistor and sta...

Semiconductor device

Semiconductor structure and methods of forming the same

Integrated circuit structures having dielectric anchor void

Multiple gate field-effect transistors having various gate oxide th...

FinFET devices and methods of forming the same

Transistors with recessed silicon cap and method forming same

Reversed tone patterning method for dipole incorporation for multip...

Semiconductor nanostructures device structure with backside contact

Multi-gate field-effect transistors in integrated circuits

Transistor isolation regions and methods of forming the same

Semiconductor devices and methods of manufacturing thereof

Semiconductor devices with circuit active elements and dummy active...

Manufacturing method of semiconductor structure

Middle-end-of-line strap for standard cell

Integrated circuit device

Method for integrating high-voltage (HV) device, medium-voltage (MV...

Patents Applicationslast 30 patents

DEVICE AND METHOD TO REDUCE MG TO SD CAPACITANCE BY AN AIR GAP BETW...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS

METHODS OF FABRICATING SEMICONDUCTOR DEVICES

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

DUMMY DEVICE FOR CORE DEVICE TO OPERATE IN A SAFE OPERATING AREA AN...

CAPACITOR CELL AND STRUCTURE THEREOF

CONFIGURABLE METAL - INSULATOR - METAL CAPACITOR AND DEVICES AND PR...

RECESSED VIA WITH CONDUCTIVE LINK TO ADJACENT CONTACT

HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

RESISTOR STRUCTURE WITH CAPPING STRUCTURE ON TFR LAYER

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE, COMPOSITE SEMICONDUCTOR DEVICE, AND DRIVE CIR...

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME

STACKED FET WITH BOTTOM EPI SIZE CONTROL AND WRAPAROUND BACKSIDE CO...

BACKSIDE CONTACT RESISTANCE REDUCTION

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

METHOD OF FORMING GATE STRUCTURE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

LOCAL TRAPPED METAL CONTACT FOR STACKED FET

FIN FIELD EFFECT TRANSISTORS HAVING VERTICALLY STACKED NANO-SHEET

NAND String Utilizing Floating Body Memory Cell

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

DRIVER STAGE CURRENT DENSITY ENHANCEMENT

MEMORY AND MANUFACTURING METHOD THEREFOR

INTEGRATED CIRCUIT DEVICE INCLUDING WIMPY TRANSISTOR STACK WITH THI...