including thick film passive components

Industry

CPC
H01L2924/1902

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1902including thick film passive components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
High-power amplifier package
- Patent number 10,700,023
- Issue date Jun 30, 2020
- MACOM Technology Solutions Holdings, Inc.
- Timothy Gittemeier
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Passive within via
- Patent number 9,960,079
- Issue date May 1, 2018
- Intel Corporation
- Todd B. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of providing z-interconnect conduct...
- Patent number 9,640,504
- Issue date May 2, 2017
- STATS ChipPAC Pte. Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of providing Z-interconnect conduct...
- Patent number 8,742,579
- Issue date Jun 3, 2014
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of embedding passive component within via
- Patent number 8,487,446
- Issue date Jul 16, 2013
- Intel Corporation
- Todd B Myers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of providing z-interconnect conduct...
- Patent number 8,133,762
- Issue date Mar 13, 2012
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Noncontact information storage medium and method for manufacturing...
- Patent number 8,083,150
- Issue date Dec 27, 2011
- Panasonic Corporation
- Daisuke Sakurai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of forming UBM fixed relative to in...
- Patent number 8,072,059
- Issue date Dec 6, 2011
- STATS ChipPAC, Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale power converter package having an inductor substrate
- Patent number 8,058,960
- Issue date Nov 15, 2011
- Alpha and Omega Semiconductor Incorporated
- François Hébert
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Microchip assembly including an inductor and fabrication method
- Patent number 8,053,890
- Issue date Nov 8, 2011
- Infineon Technologies AG
- Giuseppe Li Puma
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of embedding passive component within via
- Patent number 7,952,202
- Issue date May 31, 2011
- Intel Corporation
- Todd B Myers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and circuit structure employing a photo-imaged solder mask
- Patent number 7,326,636
- Issue date Feb 5, 2008
- Agilent Technologies, Inc.
- Ling Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of embedding passive component within via
- Patent number 7,275,316
- Issue date Oct 2, 2007
- Intel Corporation
- Todd B Myers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Providing Z-Interconnect Conduct...
- Publication number 20140203443
- Publication date Jul 24, 2014
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE WITHIN VIA
- Publication number 20130249112
- Publication date Sep 26, 2013
- Todd B. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE, METHOD OF MANUFACTURING THE SAME, AND SYSTEMS INCLUDIN...
- Publication number 20130088838
- Publication date Apr 11, 2013
- JAE JUN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Providing Z-Interconnect Conduct...
- Publication number 20120153472
- Publication date Jun 21, 2012
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING DE-COUPLING CAPACITOR
- Publication number 20110316119
- Publication date Dec 29, 2011
- Yong-hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF EMBEDDING PASSIVE COMPONENT WITHIN VIA
- Publication number 20110198723
- Publication date Aug 18, 2011
- Todd B. Myers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Providing Z-Interconnect Conduct...
- Publication number 20100237495
- Publication date Sep 23, 2010
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming UBM Fixed Relative to In...
- Publication number 20090236686
- Publication date Sep 24, 2009
- STATS ChipPAC, Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF EMBEDDING PASSIVE COMPONENT WITHIN VIA
- Publication number 20090057910
- Publication date Mar 5, 2009
- Intel Corporation
- Todd B. Myers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Noncontact Information Storage Medium and Method for Manufacturing...
- Publication number 20090039168
- Publication date Feb 12, 2009
- Daisuke Sakurai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Chip scale power converter package having an inductor substrate
- Publication number 20080238599
- Publication date Oct 2, 2008
- Francois Hebert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assembly comprising a substrate and a chip mounted on the substrate...
- Publication number 20080130257
- Publication date Jun 5, 2008
- Giuseppe Li Puma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and circuit structure employing a photo-imaged solder mask
- Publication number 20060270079
- Publication date Nov 30, 2006
- Ling Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Passive within via
- Publication number 20050224989
- Publication date Oct 13, 2005
- Todd B. Myers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

including thick film passive components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High-power amplifier package

Passive within via

Semiconductor device and method of providing z-interconnect conduct...

Semiconductor device and method of providing Z-interconnect conduct...

Method of embedding passive component within via

Semiconductor device and method of providing z-interconnect conduct...

Noncontact information storage medium and method for manufacturing...

Semiconductor device and method of forming UBM fixed relative to in...

Chip scale power converter package having an inductor substrate

Microchip assembly including an inductor and fabrication method

Method of embedding passive component within via

Method and circuit structure employing a photo-imaged solder mask

Method of embedding passive component within via

Patents Applicationslast 30 patents

Semiconductor Device and Method of Providing Z-Interconnect Conduct...

PASSIVE WITHIN VIA

DIE PACKAGE, METHOD OF MANUFACTURING THE SAME, AND SYSTEMS INCLUDIN...

Semiconductor Device and Method of Providing Z-Interconnect Conduct...

SEMICONDUCTOR PACKAGE HAVING DE-COUPLING CAPACITOR

METHOD OF EMBEDDING PASSIVE COMPONENT WITHIN VIA

Semiconductor Device and Method of Providing Z-Interconnect Conduct...

Semiconductor Device and Method of Forming UBM Fixed Relative to In...

METHOD OF EMBEDDING PASSIVE COMPONENT WITHIN VIA

Noncontact Information Storage Medium and Method for Manufacturing...

Chip scale power converter package having an inductor substrate

Assembly comprising a substrate and a chip mounted on the substrate...

Method and circuit structure employing a photo-imaged solder mask

Passive within via