including thin film passive components

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H01L2924/19015

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/19015including thin film passive components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,154,878
- Issue date Nov 26, 2024
- Intel Corporation
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor and electronic circuit substrate having the same
- Patent number 12,132,078
- Issue date Oct 29, 2024
- TDK Corporation
- Yoshihiko Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded resistor-capacitor film for fan out wafer level packaging
- Patent number 12,100,674
- Issue date Sep 24, 2024
- Dialog Semiconductor (UK) Limited
- Ernesto Gutierrez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for thin film capacitor integration
- Patent number 11,948,871
- Issue date Apr 2, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,848,294
- Issue date Dec 19, 2023
- Intel Corporation
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded resistor-capacitor film for fan out wafer level packaging
- Patent number 11,239,185
- Issue date Feb 1, 2022
- Dialog Semiconductor (UK) Limited
- Ernesto Gutierrez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,233,027
- Issue date Jan 25, 2022
- INTEL DEUTSCHLAND GMBH
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter monolithically integrating transistors, carrier, an...
- Patent number 11,043,477
- Issue date Jun 22, 2021
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Data acquisition system-in-package
- Patent number 10,979,062
- Issue date Apr 13, 2021
- Analog Devices International Unlimited Company
- John P. Healy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming inductor over insulating...
- Patent number 10,903,304
- Issue date Jan 26, 2021
- STATS ChipPAC Pte. Ltd.
- Meenakshi Padmanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,879,227
- Issue date Dec 29, 2020
- Renesas Electronics Corporation
- Yoichiro Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Data acquisition system-in-package
- Patent number 10,680,633
- Issue date Jun 9, 2020
- Analog Devices International Unlimited Compnay
- John P. Healy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,679,959
- Issue date Jun 9, 2020
- INTEL DEUTSCHLAND GMBH
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,580,763
- Issue date Mar 3, 2020
- Renesas Electronics Corporation
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,529,678
- Issue date Jan 7, 2020
- INTEL DEUTSCHLAND GMBH
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive device for RF power amplifier package
- Patent number 10,453,810
- Issue date Oct 22, 2019
- Ampleon Netherlands B.V.
- Johannes Adrianus Maria De Boet
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Integrated passive device for RF power amplifier package
- Patent number 10,242,960
- Issue date Mar 26, 2019
- Ampleon Netherlands B.V.
- Johannes Adrianus Maria De Boet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,224,318
- Issue date Mar 5, 2019
- Renesas Electronics Corporation
- Yoichiro Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin film capacitor and semiconductor device with improved heat dis...
- Patent number 10,121,728
- Issue date Nov 6, 2018
- TDK Corporation
- Masahiro Yamaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter monolithically integrating transistors, carrier, an...
- Patent number 10,050,025
- Issue date Aug 14, 2018
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor packages with thermal-enhanced conformal shielding an...
- Patent number 9,984,983
- Issue date May 29, 2018
- Advanced Semiconductor Engineering, Inc.
- Chi-Sheng Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and mounting structure thereof
- Patent number 9,847,299
- Issue date Dec 19, 2017
- MURATA MANUFACTURING CO., LTD.
- Yuichiro Teshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming inductor over insulating...
- Patent number 9,640,603
- Issue date May 2, 2017
- STATS ChipPAC Pte. Ltd.
- Meenakshi Padmanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with thermal-enhanced conformal shielding an...
- Patent number 9,484,313
- Issue date Nov 1, 2016
- Advanced Semiconductor Engineering, Inc.
- Chi-Sheng Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple access over proximity communication
- Patent number 9,472,498
- Issue date Oct 18, 2016
- Oracle International Corporation
- Alex Chow
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic device
- Patent number 9,406,602
- Issue date Aug 2, 2016
- Renesas Electronics Corporation
- Yoichiro Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming IPD in fan-out wafer lev...
- Patent number 9,343,396
- Issue date May 17, 2016
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate assembly with embedded resistance element
- Patent number 9,343,393
- Issue date May 17, 2016
- Industrial Technology Research Institute
- Peng-Shu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an IPD beneath a semicon...
- Patent number 9,257,356
- Issue date Feb 9, 2016
- STATS ChipPAC, Ltd.
- Rui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate, semiconductor device, and electronic device
- Patent number 9,251,942
- Issue date Feb 2, 2016
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESS FOR THIN FILM CAPACITOR INTEGRATION
- Publication number 20240194574
- Publication date Jun 13, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE FOR DISAGGREGATED INTEGRATED VOLTAGE REGULATORS
- Publication number 20230060727
- Publication date Mar 2, 2023
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220415799
- Publication date Dec 29, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR THIN FILM CAPACITOR INTEGRATION
- Publication number 20220375836
- Publication date Nov 24, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Resistor-Capacitor Film for Fan Out Wafer Level Packaging
- Publication number 20220139850
- Publication date May 5, 2022
- Dialog Semiconductor (UK) Limited
- Ernesto Gutierrez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200266166
- Publication date Aug 20, 2020
- Intel Deutschland GmbH
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DATA ACQUISITION SYSTEM-IN-PACKAGE
- Publication number 20200252074
- Publication date Aug 6, 2020
- Analog Devices International Unlimited Company
- John P. Healy
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Integrated Passive Device for RF Power Amplifier Package
- Publication number 20190172804
- Publication date Jun 6, 2019
- Ampleon Netherlands B.V.
- Johannes Adrianus Maria De Boet
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Embedded Resistor-Capacitor Film for Fan Out Wafer Level Packaging
- Publication number 20190139911
- Publication date May 9, 2019
- Dialog Semiconductor (UK) Limited
- Ernesto Gutierrez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Converter Monolithically Integrating Transistors, Carrier, an...
- Publication number 20180331083
- Publication date Nov 15, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria Noquil
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
THIN FILM LC COMPONENT AND MOUNTING STRUCTURE OF SAME
- Publication number 20180226391
- Publication date Aug 9, 2018
- Murata Manufacturing Co., Ltd.
- Noriyuki UEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Passive Device for RF Power Amplifier Package
- Publication number 20180026000
- Publication date Jan 25, 2018
- Ampleon Netherlands B.V.
- Johannes Adrianus Maria De Boet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER MONOLITHICALLY INTEGRATING TRANSISTORS, CARRIER, AN...
- Publication number 20170229435
- Publication date Aug 10, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITOR AND SEMICONDUCTOR DEVICE
- Publication number 20170025324
- Publication date Jan 26, 2017
- TDK Corporation
- Masahiro YAMAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MOUNTING STRUCTURE THEREOF
- Publication number 20160351504
- Publication date Dec 1, 2016
- Murata Manufacturing Co., Ltd.
- Yuichiro Teshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20140346681
- Publication date Nov 27, 2014
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Inductor Over Insulating...
- Publication number 20140327107
- Publication date Nov 6, 2014
- Meenakshi Padmanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL-ENHANCED CONFORMAL SHIELDING AN...
- Publication number 20140239464
- Publication date Aug 28, 2014
- Advanced Semiconductor Engineering, Inc.
- Chi-Sheng Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140217620
- Publication date Aug 7, 2014
- DENSO CORPORATION
- Tetsuto Yamagishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HELICAL SPIRAL INDUCTOR BETWEEN STACKING DIE
- Publication number 20140217546
- Publication date Aug 7, 2014
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFORMER SIGNAL COUPLING FOR FLIP-CHIP INTEGRATION
- Publication number 20140206105
- Publication date Jul 24, 2014
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20140103524
- Publication date Apr 17, 2014
- RENESAS ELECTRONICS CORPORATION
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SUBSTRATE, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE
- Publication number 20140070915
- Publication date Mar 13, 2014
- SEIKO EPSON CORPORATION
- Nobuaki Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A PACKAGE SUBSTRATE
- Publication number 20140051212
- Publication date Feb 20, 2014
- Sungkyunkwan University Foundation for Corporate Collaboration
- Seung Wook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20130099390
- Publication date Apr 25, 2013
- RENESAS ELECTRONICS CORPORATION
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFORMER SIGNAL COUPLING FOR FLIP-CHIP INTEGRATION
- Publication number 20130095576
- Publication date Apr 18, 2013
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE, METHOD OF MANUFACTURING THE SAME, AND SYSTEMS INCLUDIN...
- Publication number 20130088838
- Publication date Apr 11, 2013
- JAE JUN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Forming Passive Circuit Element...
- Publication number 20130015554
- Publication date Jan 17, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming IPD in Fan-Out Wafer Lev...
- Publication number 20120267800
- Publication date Oct 25, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT AND CONTACTLESS DIFFERENTIAL I/O PADS FOR CHIP-TO-CHIP COMM...
- Publication number 20120262231
- Publication date Oct 18, 2012
- STMicroelectronics S.r.l.
- Mauro SCANDIUZZO
- G01 - MEASURING TESTING

including thin film passive components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Thin film capacitor and electronic circuit substrate having the same

Embedded resistor-capacitor film for fan out wafer level packaging

Process for thin film capacitor integration

Semiconductor device

Embedded resistor-capacitor film for fan out wafer level packaging

Semiconductor device

Power converter monolithically integrating transistors, carrier, an...

Data acquisition system-in-package

Semiconductor device and method of forming inductor over insulating...

Electronic device

Data acquisition system-in-package

Semiconductor device

Electronic device

Semiconductor device

Integrated passive device for RF power amplifier package

Integrated passive device for RF power amplifier package

Electronic device

Thin film capacitor and semiconductor device with improved heat dis...

Power converter monolithically integrating transistors, carrier, an...

Semiconductor packages with thermal-enhanced conformal shielding an...

Semiconductor package and mounting structure thereof

Semiconductor device and method of forming inductor over insulating...

Semiconductor packages with thermal-enhanced conformal shielding an...

Multiple access over proximity communication

Electronic device

Semiconductor device and method of forming IPD in fan-out wafer lev...

Semiconductor substrate assembly with embedded resistance element

Semiconductor device and method of forming an IPD beneath a semicon...

Electronic substrate, semiconductor device, and electronic device

Patents Applicationslast 30 patents

PROCESS FOR THIN FILM CAPACITOR INTEGRATION

PACKAGING ARCHITECTURE FOR DISAGGREGATED INTEGRATED VOLTAGE REGULATORS

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

PROCESS FOR THIN FILM CAPACITOR INTEGRATION

Embedded Resistor-Capacitor Film for Fan Out Wafer Level Packaging

SEMICONDUCTOR DEVICE

DATA ACQUISITION SYSTEM-IN-PACKAGE

Integrated Passive Device for RF Power Amplifier Package

Embedded Resistor-Capacitor Film for Fan Out Wafer Level Packaging

Power Converter Monolithically Integrating Transistors, Carrier, an...

THIN FILM LC COMPONENT AND MOUNTING STRUCTURE OF SAME

Integrated Passive Device for RF Power Amplifier Package

POWER CONVERTER MONOLITHICALLY INTEGRATING TRANSISTORS, CARRIER, AN...

THIN FILM CAPACITOR AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND MOUNTING STRUCTURE THEREOF

ELECTRONIC DEVICE

Semiconductor Device and Method of Forming Inductor Over Insulating...

SEMICONDUCTOR PACKAGES WITH THERMAL-ENHANCED CONFORMAL SHIELDING AN...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

HELICAL SPIRAL INDUCTOR BETWEEN STACKING DIE

TRANSFORMER SIGNAL COUPLING FOR FLIP-CHIP INTEGRATION

ELECTRONIC DEVICE

ELECTRONIC SUBSTRATE, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE

METHOD OF FABRICATING A PACKAGE SUBSTRATE

ELECTRONIC DEVICE

TRANSFORMER SIGNAL COUPLING FOR FLIP-CHIP INTEGRATION

DIE PACKAGE, METHOD OF MANUFACTURING THE SAME, AND SYSTEMS INCLUDIN...

Semiconductor Device and Method for Forming Passive Circuit Element...

Semiconductor Device and Method of Forming IPD in Fan-Out Wafer Lev...

CONTACT AND CONTACTLESS DIFFERENTIAL I/O PADS FOR CHIP-TO-CHIP COMM...