including wave guides

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CPC
H01L2924/1903

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/1903including wave guides

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Antenna in package having antenna on package substrate
- Patent number 12,322,856
- Issue date Jun 3, 2025
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and semiconductor device
- Patent number 12,199,053
- Issue date Jan 14, 2025
- Renesas Electronics Corporation
- Shuuichi Kariyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and method
- Patent number 12,199,051
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 12,176,282
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid system including photonic and electronic integrated circuits...
- Patent number 12,100,701
- Issue date Sep 24, 2024
- PSIQUANTUM, CORP.
- Ramakanth Alapati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming microwave tunable composited thin-film dielectr...
- Patent number 12,048,948
- Issue date Jul 30, 2024
- Applied Materials, Inc.
- Yueh Sheng Ow
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 12,027,465
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection and wiring layers, package structures,...
- Patent number 12,015,003
- Issue date Jun 18, 2024
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient wave guide transition between package and PCB using solde...
- Patent number 11,963,291
- Issue date Apr 16, 2024
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for a semiconductor device
- Patent number 11,935,848
- Issue date Mar 19, 2024
- Sumitomo Electric Device Innovations, Inc.
- Ikuo Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-package RF waveguides as high bandwidth chip-to-chip interconnec...
- Patent number 11,894,324
- Issue date Feb 6, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising planar waveguide transmission lines
- Patent number 11,784,144
- Issue date Oct 10, 2023
- Infineon Technologies AG
- Horst Theuss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and processes for increasing semiconductor device reliability
- Patent number 11,784,155
- Issue date Oct 10, 2023
- Wolfspeed, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and method
- Patent number 11,764,171
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,735,532
- Issue date Aug 22, 2023
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide fan-out
- Patent number 11,728,290
- Issue date Aug 15, 2023
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having multiple dielectric waveguide channe...
- Patent number 11,682,638
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid system including photonic and electronic integrated circuits...
- Patent number 11,670,627
- Issue date Jun 6, 2023
- PSIQUANTUM, CORP.
- Ramakanth Alapati
- G02 - OPTICS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,640,935
- Issue date May 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Distributed inductance integrated field effect transistor structure
- Patent number 11,574,854
- Issue date Feb 7, 2023
- National Research Council of Canada
- Nianhua (Frank) Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,557,553
- Issue date Jan 17, 2023
- Sumitomo Electric Device Innovations, Inc.
- Ikuo Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate waveguide
- Patent number 11,532,574
- Issue date Dec 20, 2022
- Intel Coropration
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted wafer including mold material with recessed conductiv...
- Patent number 11,515,225
- Issue date Nov 29, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 11,456,255
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with side-radiating wave launcher and waveguide
- Patent number 11,437,706
- Issue date Sep 6, 2022
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip
- Patent number 11,373,964
- Issue date Jun 28, 2022
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yuji Kiyota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,355,445
- Issue date Jun 7, 2022
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stiffener and package substrate for a semiconductor package
- Patent number 11,295,998
- Issue date Apr 5, 2022
- Intel Corporation
- Stephen Christianson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and processes for increasing semiconductor device reliability
- Patent number 11,289,441
- Issue date Mar 29, 2022
- Wolfspeed, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency module, board equipped with antenna, and high freque...
- Patent number 11,284,506
- Issue date Mar 22, 2022
- Murata Manufacturing Co., Ltd.
- Hideki Ueda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE
- Publication number 20250233301
- Publication date Jul 17, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250192011
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structure and alignment method thereof
- Publication number 20250105166
- Publication date Mar 27, 2025
- UNITED MICROELECTRONICS CORP.
- Chiao-Yi Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE AND METHOD
- Publication number 20250096163
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250070013
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGES INCLUDING SUBSTRATE INTEGRATED WAVEGUIDES
- Publication number 20240396198
- Publication date Nov 28, 2024
- INFINEON TECHNOLOGIES AG
- Ernst SELER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC PACKAGES WITH MODULES AND FORMATION METHOD THEREOF
- Publication number 20240387491
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE INCLUDING PASSIVE COMPONENT TRAVERSING MULTIPLE SEMICONDU...
- Publication number 20240371809
- Publication date Nov 7, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Haritez Narisetty
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLAS...
- Publication number 20240178207
- Publication date May 30, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230387047
- Publication date Nov 30, 2023
- Mitsubishi Electric Corporation
- Takuma NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Structure and Method
- Publication number 20230369254
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Efficient Wave Guide Transition Between Package and PCB Using Solde...
- Publication number 20230345623
- Publication date Oct 26, 2023
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20230335512
- Publication date Oct 19, 2023
- RENESAS ELECTRONICS CORPORATION
- Shuuichi KARIYAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING MULTIPLE DIELECTRIC WAVEGUIDE CHANNE...
- Publication number 20230268298
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-SHIANG LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20230245967
- Publication date Aug 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION AND WIRING LAYERS, PACKAGE STRUCTURES,...
- Publication number 20230100769
- Publication date Mar 30, 2023
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR A SEMICONDUCTOR DEVICE
- Publication number 20230076573
- Publication date Mar 9, 2023
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
- Publication number 20230020310
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230018511
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE INTERPOSERS WITH PHOTONIC & ELECTRICAL R...
- Publication number 20220373734
- Publication date Nov 24, 2022
- Intel Corporation
- Benjamin Duong
- G02 - OPTICS
Information Patent Application
Integrated Circuit Structure and Method
- Publication number 20220344287
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20220278049
- Publication date Sep 1, 2022
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND PROCESSES FOR INCREASING SEMICONDUCTOR DEVICE RELIABILITY
- Publication number 20220216175
- Publication date Jul 7, 2022
- Wolfspeed, Inc.
- Sung Chul JOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE
- Publication number 20220209391
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-PACKAGE RF WAVEGUIDES AS HIGH BANDWIDTH CHIP-TO-CHIP INTERCONNEC...
- Publication number 20220084965
- Publication date Mar 17, 2022
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED WAFER INCLUDING MOLD MATERIAL WITH RECESSED CONDUCTIV...
- Publication number 20220077015
- Publication date Mar 10, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE LAYER RADIO FREQUENCY INTEGRATED CIRCUIT PACKAGE AND RELATED...
- Publication number 20210368615
- Publication date Nov 25, 2021
- Nadav Snir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISTRIBUTED INDUCTANCE INTEGRATED FIELD EFFECT TRANSISTOR STRUCTURE
- Publication number 20210320053
- Publication date Oct 14, 2021
- National Research Council of Canada
- Nianhua (Frank) JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20210202397
- Publication date Jul 1, 2021
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Processes for Increasing Semiconductor Device Reliability
- Publication number 20210111144
- Publication date Apr 15, 2021
- Cree, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS

including wave guides

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Antenna in package having antenna on package substrate

Electronic device and semiconductor device

Integrated circuit structure and method

Manufacturing method of semiconductor package

Hybrid system including photonic and electronic integrated circuits...

Methods for forming microwave tunable composited thin-film dielectr...

Impedance controlled electrical interconnection employing meta-mate...

High density interconnection and wiring layers, package structures,...

Efficient wave guide transition between package and PCB using solde...

Package for a semiconductor device

In-package RF waveguides as high bandwidth chip-to-chip interconnec...

Semiconductor devices comprising planar waveguide transmission lines

Systems and processes for increasing semiconductor device reliability

Integrated circuit structure and method

Semiconductor packages

Waveguide fan-out

Semiconductor structure having multiple dielectric waveguide channe...

Hybrid system including photonic and electronic integrated circuits...

Semiconductor package and manufacturing method thereof

Distributed inductance integrated field effect transistor structure

Semiconductor device

Through-substrate waveguide

Reconstituted wafer including mold material with recessed conductiv...

Impedance controlled electrical interconnection employing meta-mate...

Package with side-radiating wave launcher and waveguide

Semiconductor chip

Semiconductor packages

Stiffener and package substrate for a semiconductor package

Systems and processes for increasing semiconductor device reliability

High frequency module, board equipped with antenna, and high freque...

Patents Applicationslast 30 patents

ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor structure and alignment method thereof

INTEGRATED CIRCUIT STRUCTURE AND METHOD

SEMICONDUCTOR PACKAGE

CHIP PACKAGES INCLUDING SUBSTRATE INTEGRATED WAVEGUIDES

PHOTONIC PACKAGES WITH MODULES AND FORMATION METHOD THEREOF

STRUCTURE INCLUDING PASSIVE COMPONENT TRAVERSING MULTIPLE SEMICONDU...

PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLAS...

SEMICONDUCTOR MODULE

Integrated Circuit Structure and Method

Efficient Wave Guide Transition Between Package and PCB Using Solde...

ELECTRONIC DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE HAVING MULTIPLE DIELECTRIC WAVEGUIDE CHANNE...

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

HIGH DENSITY INTERCONNECTION AND WIRING LAYERS, PACKAGE STRUCTURES,...

PACKAGE FOR A SEMICONDUCTOR DEVICE

Impedance Controlled Electrical Interconnection Employing Meta-Mate...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT PACKAGE INTERPOSERS WITH PHOTONIC & ELECTRICAL R...

Integrated Circuit Structure and Method

SEMICONDUCTOR PACKAGES

SYSTEMS AND PROCESSES FOR INCREASING SEMICONDUCTOR DEVICE RELIABILITY

ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE

IN-PACKAGE RF WAVEGUIDES AS HIGH BANDWIDTH CHIP-TO-CHIP INTERCONNEC...

RECONSTITUTED WAFER INCLUDING MOLD MATERIAL WITH RECESSED CONDUCTIV...

SINGLE LAYER RADIO FREQUENCY INTEGRATED CIRCUIT PACKAGE AND RELATED...

DISTRIBUTED INDUCTANCE INTEGRATED FIELD EFFECT TRANSISTOR STRUCTURE

SEMICONDUCTOR PACKAGES

Systems and Processes for Increasing Semiconductor Device Reliability