incorporating printed capacitors

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CPC
H05K1/162

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

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H05K1/162incorporating printed capacitors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for additive manufacturing passive resistor-cap...
- Patent number 12,133,336
- Issue date Oct 29, 2024
- Nano Dimension Technologies, LTD.
- Daniel Sokol
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-performance capacitor packaging for next generation power elec...
- Patent number 12,100,560
- Issue date Sep 24, 2024
- UT-Battelle, LLC
- Shajjad Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ measurement and feedback control of additively manufactured...
- Patent number 12,087,501
- Issue date Sep 10, 2024
- Honeywell Federal Manufacturing & Technologies, LLC
- Joseph Ambrose Wolf
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
High speed communication jack
- Patent number 12,051,878
- Issue date Jul 30, 2024
- SENTINEL CONNECTOR SYSTEMS
- Brett D. Robinson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer board
- Patent number 12,046,838
- Issue date Jul 23, 2024
- Murata Manufacturing Co., Ltd.
- Koji Kamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric thin film, capacitor element, and electronic circuit board
- Patent number 11,999,616
- Issue date Jun 4, 2024
- TDK Corporation
- Kumiko Yamazaki
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Capacitive leadwire for physiological patient monitoring
- Patent number 11,931,177
- Issue date Mar 19, 2024
- General Electric Company
- Jussi Halinen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Filtering cable
- Patent number 11,929,189
- Issue date Mar 12, 2024
- Yunan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density soft-matter electronics
- Patent number 11,903,139
- Issue date Feb 13, 2024
- Carnegie Mellon University
- Carmel Majidi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Telecommunications device
- Patent number 11,888,263
- Issue date Jan 30, 2024
- CommScope Technologies LLC
- Bernard Harold Hammond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal substrate with high-resistance magnification and positive t...
- Patent number 11,859,094
- Issue date Jan 2, 2024
- LMS Consulting Group, LLC
- Shuyong Xiao
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electronic component
- Patent number 11,848,144
- Issue date Dec 19, 2023
- Taiyo Yuden Co., Ltd.
- Hirotaka Wakabayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive component
- Patent number 11,800,635
- Issue date Oct 24, 2023
- Murata Manufacturing Co., Ltd.
- Jyou Kikura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency board, high-frequency package, and high-frequency mo...
- Patent number 11,758,648
- Issue date Sep 12, 2023
- Kyocera Corporation
- Yoshiki Kawazu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resistive PCB traces for improved stability
- Patent number 11,723,149
- Issue date Aug 8, 2023
- Kioxia Corporation
- Stephen Pardoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit support structure with integrated isolation circuitry
- Patent number 11,716,117
- Issue date Aug 1, 2023
- Texas Instruments Incorporated
- Michael Lueders
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Thermally inkjettable acrylic dielectric ink formulation and process
- Patent number 11,708,503
- Issue date Jul 25, 2023
- FUNAI ELECTRIC HOLDINGS CO., LTD.
- Xiaorong Cai
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Vertical embedded component in a printed circuit board blind hole
- Patent number 11,696,409
- Issue date Jul 4, 2023
- Intel Corporation
- Tin Poay Chuah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Automatic trimming of a PCB-based LC circuit
- Patent number 11,696,406
- Issue date Jul 4, 2023
- Microchip Technology Incorporated
- Ajay Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processor interposer and electronic system including the processor...
- Patent number 11,683,889
- Issue date Jun 20, 2023
- Infineon Technologies Austria AG
- Danny Clavette
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems, articles, and methods for electromyography sensors
- Patent number 11,666,264
- Issue date Jun 6, 2023
- Meta Platforms Technologies, LLC
- Cezar Morun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making smart functional leather
- Patent number 11,665,830
- Issue date May 30, 2023
- Honda Motor Co., Ltd.
- Zainab I. Ali
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Performance of capacitors
- Patent number 11,664,172
- Issue date May 30, 2023
- The Research Foundation for the State University of New York
- James N Turner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a glass substrate with a plurality of vias
- Patent number 11,646,246
- Issue date May 9, 2023
- Samtec, Inc.
- Tim Mobley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible energy storage device
- Patent number 11,631,544
- Issue date Apr 18, 2023
- Power Roll Limited
- Alexander John Topping
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip tampering detector
- Patent number 11,621,234
- Issue date Apr 4, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Regis Caillet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low inductance laser driver packaging using lead-frame and thin die...
- Patent number 11,611,193
- Issue date Mar 21, 2023
- Excelitas Canada, Inc.
- Gabriel Charlebois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 11,581,147
- Issue date Feb 14, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Telecommunications device
- Patent number 11,581,685
- Issue date Feb 14, 2023
- CommScope Technologies LLC
- Bernard Harold Hammond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded power device module, processor substrate and electronic sy...
- Patent number 11,552,049
- Issue date Jan 10, 2023
- Infineon Technologies Austria AG
- Danny Clavette
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICALLY COUPLING PRINTED CIRCUIT BOARDS USING A SNAP-FIT CONNE...
- Publication number 20240397624
- Publication date Nov 28, 2024
- Western Digital Technologies, Inc.
- Tew Wei Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thick Film Single Layer Capacitor
- Publication number 20240379649
- Publication date Nov 14, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Speed Communication Jack
- Publication number 20240364059
- Publication date Oct 31, 2024
- Sentinel Connector Systems, Inc.
- Brett D. Robinson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240357751
- Publication date Oct 24, 2024
- Advanced Semiconductor Engineering, Inc.
- Hsin-Yu CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE AND SEMICONDUCTOR COMPOSITE APPARATUS
- Publication number 20240334591
- Publication date Oct 3, 2024
- Murata Manufacturing Co., Ltd.
- Takeshi FURUKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Arrangement for Determining a Printed Circuit Board Identifier
- Publication number 20240298404
- Publication date Sep 5, 2024
- Siemens Aktiengesellschaft
- Martin MATSCHNIG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MATCHING CIRCUIT BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20240292520
- Publication date Aug 29, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT, CIRCUIT BOARD, AND HEAT SINK ASSEMBLY FOR RETROFITTING A L...
- Publication number 20240251506
- Publication date Jul 25, 2024
- Musco Corporation
- Timothy A. Barker
- F21 - LIGHTING
Information Patent Application
Single Layer Capacitor
- Publication number 20240234038
- Publication date Jul 11, 2024
- KYOCERA AVX Components Corporation
- Ronald S. Demcko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INORGANIC-ORGANIC DIELECTRICS FOR THIN FILM CAPACITORS IN P...
- Publication number 20240222295
- Publication date Jul 4, 2024
- Intel Corporation
- Mahdi Mohammadighaleni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240224426
- Publication date Jul 4, 2024
- TOPPAN Holdings Inc.
- Yuki UMEMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SWITCHING POWER SUPPLY DEVICE
- Publication number 20240206071
- Publication date Jun 20, 2024
- Murata Manufacturing Co., Ltd.
- Tatsuya HOSOTANI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
TELECOMMUNICATIONS DEVICE
- Publication number 20240204460
- Publication date Jun 20, 2024
- CommScope Technologies LLC
- Bernard Harold Hammond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTISTAGE CAPACITIVE CROSSTALK COMPENSATION ARRANGEMENT
- Publication number 20240195125
- Publication date Jun 13, 2024
- CommScope Technologies LLC
- David Patrick Murray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single Layer Capacitor
- Publication number 20240136123
- Publication date Apr 25, 2024
- KYOCERA AVX Components Corporation
- Ronald S. Demcko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT HAVING PACKAGE SUBSTRATE WITH INTEGRATE...
- Publication number 20240120964
- Publication date Apr 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Giacomo Calabrese
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
THERMAL SUBSTRATE WITH HIGH-RESISTANCE MAGNIFICATION AND POSITIVE T...
- Publication number 20240101851
- Publication date Mar 28, 2024
- LMS Consulting Group, LLC
- Shuyong Xiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240079175
- Publication date Mar 7, 2024
- Taiyo Yuden Co., Ltd.
- Hirotaka WAKABAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC WAVE ABSORBER
- Publication number 20230397324
- Publication date Dec 7, 2023
- SONY GROUP CORPORATION
- TAKASHI KAWAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-FREQUENCY BOARD, HIGH-FREQUENCY PACKAGE, AND HIGH-FREQUENCY MO...
- Publication number 20230380052
- Publication date Nov 23, 2023
- Kyocera Corporation
- Yoshiki KAWAZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD SYSTEMS AND METHODS
- Publication number 20230371181
- Publication date Nov 16, 2023
- HAMILTON SUNDSTRAND CORPORATION
- Srinivas Prasad Banavara Anantharam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN DIELECTRIC SUBSTRATE FOR LOW THERMAL RESISTANCE AND LOW PARASI...
- Publication number 20230352384
- Publication date Nov 2, 2023
- Lumentum Operations LLC
- Wei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUPPORT STRUCTURE WITH INTEGRATED ISOLATION CIRCUITRY
- Publication number 20230344467
- Publication date Oct 26, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Michael Lueders
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT, METHOD OF MANUFACTURING TH...
- Publication number 20230326682
- Publication date Oct 12, 2023
- Taiyo Yuden Co., Ltd.
- Tomoki SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMC FILTER FOR A CONTROL DEVICE
- Publication number 20230328874
- Publication date Oct 12, 2023
- ROBERT BOSCH GmbH
- Rupert Fackler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITOR IN A SUBSTRATE VIA
- Publication number 20230319997
- Publication date Oct 5, 2023
- Intel Corporation
- Aslam HASWAREY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20230309229
- Publication date Sep 28, 2023
- TDK Corporation
- Takeshi OOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TELECOMMUNICATIONS DEVICE
- Publication number 20230307875
- Publication date Sep 28, 2023
- CommScope Technologies LLC
- Bernard Harold Hammond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY INKJETTABLE ACRYLIC DIELECTRIC INK FORMULATION AND PROCESS
- Publication number 20230303867
- Publication date Sep 28, 2023
- Funai Electric Co., Ltd.
- Xiaorong CAI
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
SYSTEMS AND METHODS FOR ADDITIVE MANUFACTURING PASSIVE RESISTOR-CAP...
- Publication number 20230269882
- Publication date Aug 24, 2023
- Daniel Sokol
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

incorporating printed capacitors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems and methods for additive manufacturing passive resistor-cap...

High-performance capacitor packaging for next generation power elec...

In-situ measurement and feedback control of additively manufactured...

High speed communication jack

Multilayer board

Dielectric thin film, capacitor element, and electronic circuit board

Capacitive leadwire for physiological patient monitoring

Filtering cable

High-density soft-matter electronics

Telecommunications device

Thermal substrate with high-resistance magnification and positive t...

Electronic component

Integrated passive component

High-frequency board, high-frequency package, and high-frequency mo...

Resistive PCB traces for improved stability

Circuit support structure with integrated isolation circuitry

Thermally inkjettable acrylic dielectric ink formulation and process

Vertical embedded component in a printed circuit board blind hole

Automatic trimming of a PCB-based LC circuit

Processor interposer and electronic system including the processor...

Systems, articles, and methods for electromyography sensors

Method of making smart functional leather

Performance of capacitors

Method of fabricating a glass substrate with a plurality of vias

Flexible energy storage device

Chip tampering detector

Low inductance laser driver packaging using lead-frame and thin die...

Electronic component

Telecommunications device

Embedded power device module, processor substrate and electronic sy...

Patents Applicationslast 30 patents

ELECTRICALLY COUPLING PRINTED CIRCUIT BOARDS USING A SNAP-FIT CONNE...

Thick Film Single Layer Capacitor

High Speed Communication Jack

ELECTRONIC DEVICE

MODULE AND SEMICONDUCTOR COMPOSITE APPARATUS

Arrangement for Determining a Printed Circuit Board Identifier

MATCHING CIRCUIT BOARD AND SEMICONDUCTOR DEVICE

CIRCUIT, CIRCUIT BOARD, AND HEAT SINK ASSEMBLY FOR RETROFITTING A L...

Single Layer Capacitor

STACKED INORGANIC-ORGANIC DIELECTRICS FOR THIN FILM CAPACITORS IN P...

WIRING SUBSTRATE

SWITCHING POWER SUPPLY DEVICE

TELECOMMUNICATIONS DEVICE

MULTISTAGE CAPACITIVE CROSSTALK COMPENSATION ARRANGEMENT

Single Layer Capacitor

PACKAGED INTEGRATED CIRCUIT HAVING PACKAGE SUBSTRATE WITH INTEGRATE...

THERMAL SUBSTRATE WITH HIGH-RESISTANCE MAGNIFICATION AND POSITIVE T...

ELECTRONIC COMPONENT

ELECTROMAGNETIC WAVE ABSORBER

HIGH-FREQUENCY BOARD, HIGH-FREQUENCY PACKAGE, AND HIGH-FREQUENCY MO...

CIRCUIT BOARD SYSTEMS AND METHODS

THIN DIELECTRIC SUBSTRATE FOR LOW THERMAL RESISTANCE AND LOW PARASI...

CIRCUIT SUPPORT STRUCTURE WITH INTEGRATED ISOLATION CIRCUITRY

MULTILAYER CERAMIC ELECTRONIC COMPONENT, METHOD OF MANUFACTURING TH...

EMC FILTER FOR A CONTROL DEVICE

CAPACITOR IN A SUBSTRATE VIA

ELECTRONIC COMPONENT

TELECOMMUNICATIONS DEVICE

THERMALLY INKJETTABLE ACRYLIC DIELECTRIC INK FORMULATION AND PROCESS

SYSTEMS AND METHODS FOR ADDITIVE MANUFACTURING PASSIVE RESISTOR-CAP...