incorporating printed electric components

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H05K1/16

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

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H05K1/16incorporating printed electric components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Compact thin film surface mountable coupler having wide-band perfor...
- Patent number 12,327,903
- Issue date Jun 10, 2025
- KYOCERA AVX Components Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly and manufacturing method thereof
- Patent number 12,324,100
- Issue date Jun 3, 2025
- Unimicron Technology Corp.
- Yu-Shen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer-multi-turn structure for high efficiency wireless commu...
- Patent number 12,316,128
- Issue date May 27, 2025
- NuCurrent, Inc.
- Vinit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass core wiring substrate incorporating high-frequency filter, hi...
- Patent number 12,317,411
- Issue date May 27, 2025
- TOPPAN INC.
- Susumu Maniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transformer incorporating printed circuit board and manufacturing m...
- Patent number 12,308,156
- Issue date May 20, 2025
- Hyundai Motor Company
- Jun Hwan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multistage capacitive crosstalk compensation arrangement
- Patent number 12,308,573
- Issue date May 20, 2025
- CommScope Technologies LLC
- David Patrick Murray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transformer in a package substrate
- Patent number 12,302,498
- Issue date May 13, 2025
- STMicroelectronics (Tours) SAS
- Laurent Moindron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Far field interference cancellation for resistive-inductive-capacit...
- Patent number 12,295,102
- Issue date May 6, 2025
- Cirrus Logic Inc.
- Zhong You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D printable feedstock inks for signal control or computation
- Patent number 12,293,997
- Issue date May 6, 2025
- Lawrence Livermore National Security, LLC
- Maxwell Murialdo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metamaterial electromagnetic absorber
- Patent number 12,289,823
- Issue date Apr 29, 2025
- Hyundai Motor Company
- Seung Hyun Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-cell power converter
- Patent number 12,289,060
- Issue date Apr 29, 2025
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Closed-cavity printed circuit board
- Patent number 12,284,771
- Issue date Apr 22, 2025
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic wave absorber
- Patent number 12,279,363
- Issue date Apr 15, 2025
- Sony Group Corporation
- Takashi Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Isolator
- Patent number 12,279,362
- Issue date Apr 15, 2025
- Kabushiki Kaisha Toshiba
- Yoshinari Tamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with a magnetic element and a manufacturing method
- Patent number 12,279,372
- Issue date Apr 15, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ivan Salkovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DC/DC converter component
- Patent number 12,279,373
- Issue date Apr 15, 2025
- Murata Manufacturing Co., Ltd.
- Yoshimasa Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency board, high-frequency package, and high-frequency mo...
- Patent number 12,273,990
- Issue date Apr 8, 2025
- Kyocera Corporation
- Yoshiki Kawazu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coreless electronic substrates having embedded inductors
- Patent number 12,272,484
- Issue date Apr 8, 2025
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for nanoplasma switches
- Patent number 12,267,940
- Issue date Apr 1, 2025
- Analog Devices International Unlimited Company
- Romulo Maggay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor-wire-embedded wiring board
- Patent number 12,267,962
- Issue date Apr 1, 2025
- Samsung Electronics Co., Ltd.
- Soojae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of direct embedding a lithium ion battery on a flexible prin...
- Patent number 12,249,704
- Issue date Mar 11, 2025
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor component and method for manufacturing inductor component
- Patent number 12,249,454
- Issue date Mar 11, 2025
- Murata Manufacturing Co., Ltd.
- Hiroki Imaeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-axial position sensors printed on a folded flexible circuit b...
- Patent number 12,239,447
- Issue date Mar 4, 2025
- Biosense Webster (Israel) Ltd.
- Assaf Govari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current sensing device
- Patent number 12,241,914
- Issue date Mar 4, 2025
- Koa Corporation
- Miyahito Kinoshita
- G01 - MEASURING TESTING
Information Patent Grant
EMC filter for a control device
- Patent number 12,245,362
- Issue date Mar 4, 2025
- Robert Bosch GmbH
- Rupert Fackler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible pressure sensors and user interfaces
- Patent number 12,232,548
- Issue date Feb 25, 2025
- LOOMIA Technologies, Inc.
- Madison Thea Maxey
- A41 - WEARING APPAREL
Information Patent Grant
Method for manufacturing component embedded circuit board
- Patent number 12,238,871
- Issue date Feb 25, 2025
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Yong-Chao Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-Q switch inductor
- Patent number 12,232,264
- Issue date Feb 18, 2025
- Acacia Communications, Inc.
- Ian Dedic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Environmental hazard risk mitigation system, method and computer pr...
- Patent number 12,232,232
- Issue date Feb 18, 2025
- Lighting Defense Group, LLC
- Daniel S. Spiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Applicator with thermal contact sensors
- Patent number 12,220,346
- Issue date Feb 11, 2025
- LIGHTFECTIVE LTD
- Yotam Zimmerman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Component with one or more electrically conductive patterns for an...
- Publication number 20250185170
- Publication date Jun 5, 2025
- JET METAL TECHNOLOGIES
- Samuel Paul Henry STREMSDOERFER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR AN INTERMEDIATE DEVICE STRUCTURE
- Publication number 20250185139
- Publication date Jun 5, 2025
- LIGHTING DEFENSE GROUP, LLC
- Daniel S. Spiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRESSURE SENSORS AND USER INTERFACES
- Publication number 20250169555
- Publication date May 29, 2025
- LOOMIA Technologies, Inc.
- Madison Thea Maxey
- A41 - WEARING APPAREL
Information Patent Application
MULTI-AXIAL POSITION SENSORS PRINTED ON A FOLDED FLEXIBLE CIRCUIT B...
- Publication number 20250160716
- Publication date May 22, 2025
- BIOSENSE WEBSTER (ISRAEL) LTD.
- Assaf Govari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORE SUBSTRATE AND INTERPOSER
- Publication number 20250167091
- Publication date May 22, 2025
- NGK Insulators, Ltd.
- Yoshitsugu WAKAZONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING DEW CONDENSATION SENSOR
- Publication number 20250137962
- Publication date May 1, 2025
- LG ELECTRONICS INC.
- Kyungsup OH
- G08 - SIGNALLING
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME AND TERMINAL DEVIC...
- Publication number 20250142717
- Publication date May 1, 2025
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- CHAO WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT SENSOR
- Publication number 20250142727
- Publication date May 1, 2025
- Fondazione Istituto Italiano Di Tecnologia
- Simeon Asher BAMFORD
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COIL CARRIER BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250142728
- Publication date May 1, 2025
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VIA PLUG RESISTOR
- Publication number 20250125242
- Publication date Apr 17, 2025
- Intel Corporation
- Santosh Gangal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250107005
- Publication date Mar 27, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Xiao-Long HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COIL DEVICE AND PRINTED WIRING BOARD
- Publication number 20250107001
- Publication date Mar 27, 2025
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Michi OGATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF POWER MODULE
- Publication number 20250104902
- Publication date Mar 27, 2025
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250098071
- Publication date Mar 20, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jung Hyun CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH EMBEDDED AND SHIELDED INDUCTORS
- Publication number 20250096089
- Publication date Mar 20, 2025
- ADVANCED MICRO DEVICES, INC.
- Robert Grant SPURNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CATHETER SPLINES WITH EMBEDDED CIRCUIT ELEMENTS
- Publication number 20250082220
- Publication date Mar 13, 2025
- BIOSENSE WEBSTER (ISRAEL) LTD.
- Assaf Govari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RADIO FREQUENCY MODULE
- Publication number 20250070805
- Publication date Feb 27, 2025
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
STRETCHABLE CIRCUIT BOARD ASSEMBLY AND METHOD FOR MANUFACTURING THE...
- Publication number 20250071890
- Publication date Feb 27, 2025
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHAO WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250071902
- Publication date Feb 27, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seung Eun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COIL DEVICE AND PRINTED WIRING BOARD
- Publication number 20250062061
- Publication date Feb 20, 2025
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Michi OGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD WITH EMBEDDED RESISTORS AND METHOD FOR FABRICATING TH...
- Publication number 20250056725
- Publication date Feb 13, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Xiao-Juan ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT ROGOWSKI COIL
- Publication number 20250048554
- Publication date Feb 6, 2025
- Littelfuse Europe GmbH
- Pavel Kucera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED COPPER CLAD LAMINATE, CAPACITOR ELEMENT AND PRINTED WI...
- Publication number 20250046520
- Publication date Feb 6, 2025
- Mitsui Mining and Smelting Co., Ltd.
- Ryuji ISHIZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL SYSTEM FOR AN INDUCTIVE PROXIMITY SWITCH FOR FLUSH OR NON-FLUS...
- Publication number 20250038746
- Publication date Jan 30, 2025
- Turck Holding GmbH
- Michael Faber
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CAPACITIVE ELEMENT, CIRCUIT CARRIER HAVING THE SAME AND FABRICATION...
- Publication number 20250040051
- Publication date Jan 30, 2025
- Unimicron Technology Corp.
- Chun Hung KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR A COMPACT RECEIVER ASSEMBLY TO WIRELESSLY C...
- Publication number 20250015634
- Publication date Jan 9, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Yanghe Liu
- B60 - VEHICLES IN GENERAL
Information Patent Application
CIRCUIT DEVICE AND DISPLAY APPARATUS
- Publication number 20250016913
- Publication date Jan 9, 2025
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Dehui Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250008659
- Publication date Jan 2, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jae Heun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20250008660
- Publication date Jan 2, 2025
- KYOCERA CORPORATION
- Yoshio KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ASSEMBLY AND INTEGRATED POWER CONVERTER MODULE
- Publication number 20240431029
- Publication date Dec 26, 2024
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

incorporating printed electric components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Compact thin film surface mountable coupler having wide-band perfor...

Circuit board assembly and manufacturing method thereof

Multi-layer-multi-turn structure for high efficiency wireless commu...

Glass core wiring substrate incorporating high-frequency filter, hi...

Transformer incorporating printed circuit board and manufacturing m...

Multistage capacitive crosstalk compensation arrangement

Transformer in a package substrate

Far field interference cancellation for resistive-inductive-capacit...

3D printable feedstock inks for signal control or computation

Metamaterial electromagnetic absorber

Multi-cell power converter

Closed-cavity printed circuit board

Electromagnetic wave absorber

Isolator

Component carrier with a magnetic element and a manufacturing method

DC/DC converter component

High-frequency board, high-frequency package, and high-frequency mo...

Coreless electronic substrates having embedded inductors

Apparatus and methods for nanoplasma switches

Capacitor-wire-embedded wiring board

Method of direct embedding a lithium ion battery on a flexible prin...

Inductor component and method for manufacturing inductor component

Multi-axial position sensors printed on a folded flexible circuit b...

Current sensing device

EMC filter for a control device

Flexible pressure sensors and user interfaces

Method for manufacturing component embedded circuit board

High-Q switch inductor

Environmental hazard risk mitigation system, method and computer pr...

Applicator with thermal contact sensors

Patents Applicationslast 30 patents

Component with one or more electrically conductive patterns for an...

SYSTEMS AND METHODS FOR AN INTERMEDIATE DEVICE STRUCTURE

FLEXIBLE PRESSURE SENSORS AND USER INTERFACES

MULTI-AXIAL POSITION SENSORS PRINTED ON A FOLDED FLEXIBLE CIRCUIT B...

CORE SUBSTRATE AND INTERPOSER

ELECTRONIC DEVICE INCLUDING DEW CONDENSATION SENSOR

CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME AND TERMINAL DEVIC...

FLEXIBLE PRINTED CIRCUIT SENSOR

COIL CARRIER BOARD AND MANUFACTURING METHOD THEREOF

VIA PLUG RESISTOR

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

COIL DEVICE AND PRINTED WIRING BOARD

MANUFACTURING METHOD OF POWER MODULE

PRINTED CIRCUIT BOARD

CHIP PACKAGE WITH EMBEDDED AND SHIELDED INDUCTORS

CATHETER SPLINES WITH EMBEDDED CIRCUIT ELEMENTS

RADIO FREQUENCY MODULE

STRETCHABLE CIRCUIT BOARD ASSEMBLY AND METHOD FOR MANUFACTURING THE...

PRINTED CIRCUIT BOARD

COIL DEVICE AND PRINTED WIRING BOARD

CIRCUIT BOARD WITH EMBEDDED RESISTORS AND METHOD FOR FABRICATING TH...

FLEXIBLE PRINTED CIRCUIT ROGOWSKI COIL

DOUBLE-SIDED COPPER CLAD LAMINATE, CAPACITOR ELEMENT AND PRINTED WI...

COIL SYSTEM FOR AN INDUCTIVE PROXIMITY SWITCH FOR FLUSH OR NON-FLUS...

CAPACITIVE ELEMENT, CIRCUIT CARRIER HAVING THE SAME AND FABRICATION...

SYSTEMS AND METHODS FOR A COMPACT RECEIVER ASSEMBLY TO WIRELESSLY C...

CIRCUIT DEVICE AND DISPLAY APPARATUS

PRINTED CIRCUIT BOARD

CIRCUIT SUBSTRATE AND ELECTRONIC DEVICE

INTEGRATED ASSEMBLY AND INTEGRATED POWER CONVERTER MODULE