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H01L2924/3701

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/3701increased through put

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and measurement device
- Patent number 11,854,952
- Issue date Dec 26, 2023
- Lapis Semiconductor Co., Ltd.
- Toshihisa Sone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for manufacturing semiconductor package structure
- Patent number 11,837,572
- Issue date Dec 5, 2023
- Advanced Semiconductor Engineering, Inc.
- Chun-Min Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an oscillator and an associated integra...
- Patent number 11,309,234
- Issue date Apr 19, 2022
- Lapis Semiconductor Co., Ltd.
- Toshihisa Sone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,998,288
- Issue date May 4, 2021
- Renesas Electronics Corporation
- Tadatoshi Danno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus with multi-wafer based device comprising embedded active...
- Patent number 10,714,446
- Issue date Jul 14, 2020
- Intel Corporation
- Anup Pancholi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection of foreign particles during wire bonding
- Patent number 10,658,328
- Issue date May 19, 2020
- ASM Technology Singapore Pte. Ltd.
- Tact Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and measurement device
- Patent number 10,615,108
- Issue date Apr 7, 2020
- Lapis Semiconductor Co., Ltd.
- Toshihisa Sone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,249,595
- Issue date Apr 2, 2019
- Renesas Electronics Corporation
- Tadatoshi Danno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression for semiconductor chip assembly
- Patent number 10,134,704
- Issue date Nov 20, 2018
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,806,035
- Issue date Oct 31, 2017
- Renesas Electronics Corporation
- Tadatoshi Danno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression for semiconductor chip assembly
- Patent number 9,735,125
- Issue date Aug 15, 2017
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip bonder and flip chip bonding method
- Patent number 9,536,856
- Issue date Jan 3, 2017
- Shinkawa Ltd.
- Kohei Seyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,425,165
- Issue date Aug 23, 2016
- Renesas Electronics Corporation
- Tadatoshi Danno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding device and method of eliminating defective bonding wire
- Patent number 9,355,989
- Issue date May 31, 2016
- Siliconware Precision Industries Co., Ltd.
- Wei-Sheng Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,355,975
- Issue date May 31, 2016
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact arrangements for stackable microelectronic package structur...
- Patent number 9,349,707
- Issue date May 24, 2016
- Invensas Corporation
- Zhuowen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for manufacturing the same
- Patent number 9,312,234
- Issue date Apr 12, 2016
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor multi-project or multi-product wafer process
- Patent number 9,312,254
- Issue date Apr 12, 2016
- Weng-Dah Ken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression for semiconductor chip assembly
- Patent number 9,287,230
- Issue date Mar 15, 2016
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and measurement device having an oscillator
- Patent number 9,257,377
- Issue date Feb 9, 2016
- Lapis Semiconductor Co., Ltd.
- Toshihisa Sone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via structure for three-dimensional circuit integration
- Patent number 9,214,435
- Issue date Dec 15, 2015
- GLOBALFOUNDRIES Inc.
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,196,594
- Issue date Nov 24, 2015
- Xintec Inc.
- Chao-Yen Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module
- Patent number 9,159,676
- Issue date Oct 13, 2015
- Mitsubishi Electric Corporation
- Takami Otsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression for semiconductor chip assembly
- Patent number 8,932,909
- Issue date Jan 13, 2015
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 8,592,961
- Issue date Nov 26, 2013
- Renesas Electronics Corporation
- Tadatoshi Danno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 8,513,785
- Issue date Aug 20, 2013
- Renesas Electronics Corporation
- Tadatoshi Danno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 8,507,321
- Issue date Aug 13, 2013
- Chao-Yen Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 8,053,875
- Issue date Nov 8, 2011
- Renesas Electronics Corporation
- Tadatoshi Danno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 7,833,833
- Issue date Nov 16, 2010
- Renesas Electronics Corporation
- Tadatoshi Danno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 7,691,677
- Issue date Apr 6, 2010
- Renesas Technology Corp.
- Tadatoshi Danno
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated process sequence for hybrid bonding applications
- Publication number 20240194635
- Publication date Jun 13, 2024
- Niranjan PINGLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Efficient Integration of a First Substrate without Solder Bumps wit...
- Publication number 20240128209
- Publication date Apr 18, 2024
- Newport Fab, LLC dba Tower Semiconductor Newport Beach
- Edward Preisler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20220392868
- Publication date Dec 8, 2022
- Advanced Semiconductor Engineering, Inc.
- Chun-Min WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS WITH MULTI-WAFER BASED DEVICE COMPRISING EMBEDDED ACTIVE...
- Publication number 20190348389
- Publication date Nov 14, 2019
- Intel Corporation
- Anup Pancholi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20190198477
- Publication date Jun 27, 2019
- RENESAS ELECTRONICS CORPORATION
- Tadatoshi Danno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTION OF FOREIGN PARTICLES DURING WIRE BONDING
- Publication number 20190139929
- Publication date May 9, 2019
- ASM Technology Singapore Pte Ltd
- Tact LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20180047677
- Publication date Feb 15, 2018
- RENESAS ELECTRONICS CORPORATION
- Tadatoshi Danno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION FOR SEMICONDUCTOR CHIP ASSEMBLY
- Publication number 20170309586
- Publication date Oct 26, 2017
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING DEVICE AND METHOD OF ELIMINATING DEFECTIVE BONDING WIRE
- Publication number 20160079198
- Publication date Mar 17, 2016
- Siliconware Precision Industries Co., Ltd.
- Wei-Sheng Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MULTI-PROJECT OR MULTI-PRODUCT WAFER PROCESS
- Publication number 20160043065
- Publication date Feb 11, 2016
- Weng-Dah Ken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP BONDER AND FLIP CHIP BONDING METHOD
- Publication number 20150380381
- Publication date Dec 31, 2015
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150235987
- Publication date Aug 20, 2015
- Renesas Electronics Corporation
- Tadatoshi Danno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION FOR SEMICONDUCTOR CHIP ASSEMBLY
- Publication number 20150123271
- Publication date May 7, 2015
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20150115478
- Publication date Apr 30, 2015
- Mitsubishi Electric Corporation
- Takami OTSUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MEASUREMENT DEVICE HAVING AN OSCILLATOR
- Publication number 20150076673
- Publication date Mar 19, 2015
- LAPIS SEMICONDUCTOR CO., LTD.
- Toshihisa SONE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module and Method for Manufacturing the Same
- Publication number 20150076570
- Publication date Mar 19, 2015
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURE FOR THREE-DIMENSIONAL CIRCUIT INTEGRATION
- Publication number 20150035169
- Publication date Feb 5, 2015
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140332969
- Publication date Nov 13, 2014
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140328523
- Publication date Nov 6, 2014
- Chao-Yen LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMOCOMPRESSION FOR SEMICONDUCTOR CHIP ASSEMBLY
- Publication number 20140131855
- Publication date May 15, 2014
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140054759
- Publication date Feb 27, 2014
- RENESAS ELECTRONICS CORPORATION
- Tadatoshi Danno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20130320532
- Publication date Dec 5, 2013
- Xintec Inc.
- Chao-Yen LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Via Structure For Three-Dimensional Circuit Integration
- Publication number 20130307160
- Publication date Nov 21, 2013
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MEASUREMENT DEVICE
- Publication number 20130285225
- Publication date Oct 31, 2013
- LAPIS SEMICONDUCTOR CO., LTD.
- Toshihisa SONE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Semiconductor Device
- Publication number 20130020691
- Publication date Jan 24, 2013
- Renesas Electronics Corporation
- Tadatoshi Danno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MULTI-PROJECT OR MULTI-PRODUCT WAFER PROCESS
- Publication number 20120088329
- Publication date Apr 12, 2012
- Weng-Dah Ken
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20110278724
- Publication date Nov 17, 2011
- Chao-Yen LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method of Manufacturing A Semiconductor Device
- Publication number 20110204502
- Publication date Aug 25, 2011
- Renesas Electronics Corporation
- Tadatoshi Danno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing A Semiconductor Device
- Publication number 20100065951
- Publication date Mar 18, 2010
- RENESAS TECHNOLOGY CORP.
- Tadatoshi Danno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing A Semiconductor Device
- Publication number 20100068852
- Publication date Mar 18, 2010
- RENESAS TECHNOLOGY CORP.
- Tadatoshi Danno
- H01 - BASIC ELECTRIC ELEMENTS

increased through put

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and measurement device

Apparatus and method for manufacturing semiconductor package structure

Semiconductor device having an oscillator and an associated integra...

Method of manufacturing a semiconductor device

Apparatus with multi-wafer based device comprising embedded active...

Detection of foreign particles during wire bonding

Semiconductor device and measurement device

Method of manufacturing a semiconductor device

Thermocompression for semiconductor chip assembly

Semiconductor device

Thermocompression for semiconductor chip assembly

Flip chip bonder and flip chip bonding method

Method of manufacturing semiconductor device

Wire bonding device and method of eliminating defective bonding wire

Chip package and method for forming the same

Contact arrangements for stackable microelectronic package structur...

Semiconductor module and method for manufacturing the same

Semiconductor multi-project or multi-product wafer process

Thermocompression for semiconductor chip assembly

Semiconductor device and measurement device having an oscillator

Via structure for three-dimensional circuit integration

Chip package and method for forming the same

Semiconductor module

Thermocompression for semiconductor chip assembly

Method of manufacturing a semiconductor device

Method of manufacturing a semiconductor device

Chip package and method for forming the same

Method of manufacturing a semiconductor device

Method of manufacturing a semiconductor device

Method of manufacturing a semiconductor device

Patents Applicationslast 30 patents

Integrated process sequence for hybrid bonding applications

Efficient Integration of a First Substrate without Solder Bumps wit...

APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE

APPARATUS WITH MULTI-WAFER BASED DEVICE COMPRISING EMBEDDED ACTIVE...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

DETECTION OF FOREIGN PARTICLES DURING WIRE BONDING

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

THERMOCOMPRESSION FOR SEMICONDUCTOR CHIP ASSEMBLY

WIRE BONDING DEVICE AND METHOD OF ELIMINATING DEFECTIVE BONDING WIRE

SEMICONDUCTOR MULTI-PROJECT OR MULTI-PRODUCT WAFER PROCESS

FLIP CHIP BONDER AND FLIP CHIP BONDING METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

THERMOCOMPRESSION FOR SEMICONDUCTOR CHIP ASSEMBLY

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND MEASUREMENT DEVICE HAVING AN OSCILLATOR

Semiconductor Module and Method for Manufacturing the Same

VIA STRUCTURE FOR THREE-DIMENSIONAL CIRCUIT INTEGRATION

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

THERMOCOMPRESSION FOR SEMICONDUCTOR CHIP ASSEMBLY

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

Via Structure For Three-Dimensional Circuit Integration

SEMICONDUCTOR DEVICE AND MEASUREMENT DEVICE

Method of Manufacturing a Semiconductor Device

SEMICONDUCTOR MULTI-PROJECT OR MULTI-PRODUCT WAFER PROCESS

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

Method of Manufacturing A Semiconductor Device

Method of Manufacturing A Semiconductor Device

Method of Manufacturing A Semiconductor Device