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MULTI-LAYER STACKED CHIP PACKAGE
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Publication number 20230411363
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Publication date Dec 21, 2023
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Walton Advanced Engineering, Inc
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HONG-CHI YU
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H01 - BASIC ELECTRIC ELEMENTS
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ELECTRONIC PACKAGE
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Publication number 20230343691
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Publication date Oct 26, 2023
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Siliconware Precision Industries Co., Ltd.
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Sung-Hua Chung
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H01 - BASIC ELECTRIC ELEMENTS
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PACKAGE STRUCTURE WITH DUMMY DIE
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Publication number 20230335539
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Publication date Oct 19, 2023
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Hsien-Wei CHEN
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGES
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Publication number 20230170291
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Publication date Jun 1, 2023
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Shu-Jung Tseng
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20230117865
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Publication date Apr 20, 2023
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Samsung Electronics Co., Ltd.
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Eungchang LEE
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H01 - BASIC ELECTRIC ELEMENTS
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