Indium antimonide [InSb]

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CPC
H01L2924/10332

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/10332Indium antimonide [InSb]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages
- Patent number 12,159,839
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on integrated chips and methods of forming same
- Patent number 11,658,150
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,502,039
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 11,472,171
- Issue date Oct 18, 2022
- X Display Company Technology Limited
- Christopher Bower
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
System on integrated chips and methods of forming same
- Patent number 11,069,658
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and methods of forming the same
- Patent number 10,867,965
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Ching Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanently bonding wafers
- Patent number 10,825,793
- Issue date Nov 3, 2020
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 10,784,203
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current sensor isolation
- Patent number 10,753,963
- Issue date Aug 25, 2020
- ALLEGRO MICROSYSTEMS, LLC
- Shaun D. Milano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on integrated chips and methods of forming same
- Patent number 10,541,227
- Issue date Jan 21, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and methods of forming the same
- Patent number 10,529,690
- Issue date Jan 7, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Ching Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a bonding layer
- Patent number 10,438,925
- Issue date Oct 8, 2019
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Current sensor isolation
- Patent number 10,345,343
- Issue date Jul 9, 2019
- ALLEGRO MICROSYSTEMS, LLC
- Shaun D. Milano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 10,252,514
- Issue date Apr 9, 2019
- X-CELEPRINT LIMITED
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Semiconductor arrangement, semiconductor system and method of formi...
- Patent number 10,115,646
- Issue date Oct 30, 2018
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, multi-die packages, and methods of manufacur...
- Patent number 9,984,969
- Issue date May 29, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern generator having stacked chips
- Patent number 9,865,550
- Issue date Jan 9, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Chieh Chan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Laser die backside film removal for integrated circuit (IC) packaging
- Patent number 9,859,248
- Issue date Jan 2, 2018
- Intel Corporation
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, multi-die packages, and methods of manufactu...
- Patent number 9,659,863
- Issue date May 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for wafer level package and methods of form...
- Patent number 9,659,896
- Issue date May 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a bonding layer
- Patent number 9,627,349
- Issue date Apr 18, 2017
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 9,550,353
- Issue date Jan 24, 2017
- X-CELEPRINT LIMITED
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Package systems including passive electrical components
- Patent number 9,530,761
- Issue date Dec 27, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Alan Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 9,434,150
- Issue date Sep 6, 2016
- X-CELEPRINT LIMITED
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Laser die backside film removal for integrated circuit (IC) packaging
- Patent number 9,412,702
- Issue date Aug 9, 2016
- Intel Corporation
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 9,358,775
- Issue date Jun 7, 2016
- X-CELEPRINT LIMITED
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Bonding method
- Patent number 8,641,859
- Issue date Feb 4, 2014
- Thin Materials AG
- Franz Richter
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240395721
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages
- Publication number 20230075602
- Publication date Mar 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL ELEMENT AND OPTICAL CONCENTRATION MEASURING APPARATUS
- Publication number 20220268693
- Publication date Aug 25, 2022
- ASAHI KASEI MICRODEVICES CORPORATION
- Daiki YASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System on Integrated Chips and Methods of Forming Same
- Publication number 20210343680
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20210143131
- Publication date May 13, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method
- Publication number 20210005554
- Publication date Jan 7, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20190393195
- Publication date Dec 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURRENT SENSOR ISOLATION
- Publication number 20190277889
- Publication date Sep 12, 2019
- ALLEGRO MICROSYSTEMS, LLC
- Shaun D. Milano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structures and Methods of Forming the Same
- Publication number 20190109119
- Publication date Apr 11, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ching Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System on Integrated Chips and Methods of Forming Same
- Publication number 20190027465
- Publication date Jan 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING
- Publication number 20180001614
- Publication date Jan 4, 2018
- X-Celeprint Limited
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20170338204
- Publication date Nov 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices, Multi-Die Packages, and Methods of Manufactu...
- Publication number 20170256487
- Publication date Sep 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENTLY BONDING WAFERS
- Publication number 20170229423
- Publication date Aug 10, 2017
- EV GROUP E. THALLNER GMBH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURRENT SENSOR ISOLATION
- Publication number 20160282388
- Publication date Sep 29, 2016
- Allegro Microsystems, LLC
- Shaun D. Milano
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR APPLYING A BONDING LAYER
- Publication number 20160190092
- Publication date Jun 30, 2016
- EV GROUP E. THALLNER GMBH
- Markus WIMPLINGER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING
- Publication number 20160020130
- Publication date Jan 21, 2016
- X-Celeprint Limited
- Christopher Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING
- Publication number 20140264951
- Publication date Sep 18, 2014
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20140213017
- Publication date Jul 31, 2014
- Samsung Electronics Co., Ltd.
- Jong-Youn KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SYSTEMS INCLUDING PASSIVE ELECTRICAL COMPONENTS
- Publication number 20130058049
- Publication date Mar 7, 2013
- TAIWAN SEMICONDUCOTR MANUFACTURING COMPANY, LTD.
- Alan ROTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Metal for Hybridization and Related Methods
- Publication number 20120273951
- Publication date Nov 1, 2012
- Raytheon Company
- Jonathan Getty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD
- Publication number 20110272092
- Publication date Nov 10, 2011
- THIN MATERIALS AG
- Franz Richter
- B32 - LAYERED PRODUCTS

Indium antimonide [InSb]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages

System on integrated chips and methods of forming same

Semiconductor package and method

Apparatus and methods for micro-transfer-printing

System on integrated chips and methods of forming same

Package structures and methods of forming the same

Method for permanently bonding wafers

Semiconductor package and method

Current sensor isolation

System on integrated chips and methods of forming same

Package structures and methods of forming the same

Method for applying a bonding layer

Current sensor isolation

Apparatus and methods for micro-transfer-printing

Semiconductor arrangement, semiconductor system and method of formi...

Semiconductor devices, multi-die packages, and methods of manufacur...

Pattern generator having stacked chips

Laser die backside film removal for integrated circuit (IC) packaging

Semiconductor devices, multi-die packages, and methods of manufactu...

Interconnect structures for wafer level package and methods of form...

Method for applying a bonding layer

Apparatus and methods for micro-transfer-printing

Package systems including passive electrical components

Apparatus and methods for micro-transfer-printing

Laser die backside film removal for integrated circuit (IC) packaging

Apparatus and methods for micro-transfer-printing

Bonding method

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES

Semiconductor Packages

OPTICAL ELEMENT AND OPTICAL CONCENTRATION MEASURING APPARATUS

System on Integrated Chips and Methods of Forming Same

Device and Method for UBM/RDL Routing

Semiconductor Package and Method

Device and Method for UBM/RDL Routing

CURRENT SENSOR ISOLATION

Package Structures and Methods of Forming the Same

System on Integrated Chips and Methods of Forming Same

APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING

Device and Method for UBM/RDL Routing

Semiconductor Devices, Multi-Die Packages, and Methods of Manufactu...

METHOD FOR PERMANENTLY BONDING WAFERS

CURRENT SENSOR ISOLATION

METHOD FOR APPLYING A BONDING LAYER

APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING

LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING

METHOD OF FABRICATING SEMICONDUCTOR DEVICE

PACKAGE SYSTEMS INCLUDING PASSIVE ELECTRICAL COMPONENTS

Contact Metal for Hybridization and Related Methods

BONDING METHOD