TREA

Indium arsenide [InAs]

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  • CPC
  • H01L2924/10333
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/10333Indium arsenide [InAs]
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGES
    • Publication number 20240395721
    • Publication date Nov 28, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Tzu-Sung Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240321799
    • Publication date Sep 26, 2024
    • Samsung Electronics Co., Ltd.
    • Kiwon Baek
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Packages
    • Publication number 20230075602
    • Publication date Mar 9, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Tzu-Sung Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    System on Integrated Chips and Methods of Forming Same
    • Publication number 20210343680
    • Publication date Nov 4, 2021
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Sung-Feng Yeh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Device and Method for UBM/RDL Routing
    • Publication number 20210143131
    • Publication date May 13, 2021
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Meng-Tsan Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FRONT-TO-BACK BONDING WITH THROUGH-SUBSTRATE VIA (TSV)
    • Publication number 20210043547
    • Publication date Feb 11, 2021
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Jing-Cheng LIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Package and Method
    • Publication number 20210005554
    • Publication date Jan 7, 2021
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Tzu-Sung Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Packages and Methods of Forming Packages
    • Publication number 20200118987
    • Publication date Apr 16, 2020
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Device and Method for UBM/RDL Routing
    • Publication number 20190393195
    • Publication date Dec 26, 2019
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Meng-Tsan Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Packages and Methods of Forming Packages
    • Publication number 20190115332
    • Publication date Apr 18, 2019
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Package Structures and Methods of Forming the Same
    • Publication number 20190109119
    • Publication date Apr 11, 2019
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Ying-Ching Shih
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    System on Integrated Chips and Methods of Forming Same
    • Publication number 20190027465
    • Publication date Jan 24, 2019
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Sung-Feng Yeh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STRUCTURE FOR REDUCING COMPOUND SEMICONDUCTOR WAFER DISTORTION
    • Publication number 20180366417
    • Publication date Dec 20, 2018
    • WIN Semiconductors Corp.
    • Chang-Hwang HUA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FRONT-TO-BACK BONDING WITH THROUGH-SUBSTRATE VIA (TSV)
    • Publication number 20180145011
    • Publication date May 24, 2018
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Jing-Cheng LIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Device and Method for UBM/RDL Routing
    • Publication number 20170338204
    • Publication date Nov 23, 2017
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Meng-Tsan Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Devices, Multi-Die Packages, and Methods of Manufactu...
    • Publication number 20170256487
    • Publication date Sep 7, 2017
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR PERMANENTLY BONDING WAFERS
    • Publication number 20170229423
    • Publication date Aug 10, 2017
    • EV GROUP E. THALLNER GMBH
    • Thomas Plach
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGES AND METHODS OF FORMING PACKAGES
    • Publication number 20170229436
    • Publication date Aug 10, 2017
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR APPLYING A BONDING LAYER
    • Publication number 20160190092
    • Publication date Jun 30, 2016
    • EV GROUP E. THALLNER GMBH
    • Markus WIMPLINGER
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    STRUCTURE AND METHOD FOR COOLING THREE-DIMENSIONAL INTEGRATED CIRCUITS
    • Publication number 20150060039
    • Publication date Mar 5, 2015
    • Taiwan Semiconductor Manufacturing Company Limited
    • HUI-YU LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FABRICATING SEMICONDUCTOR DEVICE
    • Publication number 20140213017
    • Publication date Jul 31, 2014
    • Samsung Electronics Co., Ltd.
    • Jong-Youn KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ANTENNA USING THROUGH-SILICON VIA
    • Publication number 20140152512
    • Publication date Jun 5, 2014
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Hsiao-Tsung YEN
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    PACKAGE SYSTEMS INCLUDING PASSIVE ELECTRICAL COMPONENTS
    • Publication number 20130058049
    • Publication date Mar 7, 2013
    • TAIWAN SEMICONDUCOTR MANUFACTURING COMPANY, LTD.
    • Alan ROTH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ANTENNA USING THROUGH-SILICON VIA
    • Publication number 20120299778
    • Publication date Nov 29, 2012
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Hsiao-Tsung YEN
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    BONDING METHOD
    • Publication number 20110272092
    • Publication date Nov 10, 2011
    • THIN MATERIALS AG
    • Franz Richter
    • B32 - LAYERED PRODUCTS