Indium gallium arsenide [InGaAs]

Industry

CPC
H01L2924/10337

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/10337Indium gallium arsenide [InGaAs]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and power amplifier module
- Patent number 11,621,678
- Issue date Apr 4, 2023
- Murata Manufacturing Co., Ltd.
- Isao Obu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,532,736
- Issue date Dec 20, 2022
- Murata Manufacturing Co., Ltd.
- Yasunari Umemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,495,563
- Issue date Nov 8, 2022
- Murata Manufacturing Co., Ltd.
- Masao Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 11,472,171
- Issue date Oct 18, 2022
- X Display Company Technology Limited
- Christopher Bower
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Structures for bonding a group III-V device to a substrate by stack...
- Patent number 11,158,593
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhih-Bin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,158,592
- Issue date Oct 26, 2021
- Murata Manufacturing Co., Ltd.
- Masahiro Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,978,579
- Issue date Apr 13, 2021
- Murata Manufacturing Co., Ltd.
- Yasunari Umemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photodiode device monolithically integrating waveguide element with...
- Patent number 10,921,516
- Issue date Feb 16, 2021
- Sumitomo Electric Device Innovations, Inc.
- Yoshihiro Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and power amplifier module
- Patent number 10,903,803
- Issue date Jan 26, 2021
- Murata Manufacturing Co., Ltd.
- Isao Obu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Dummy metal with zigzagged edges
- Patent number 10,867,900
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip high speed components with underfill
- Patent number 10,811,279
- Issue date Oct 20, 2020
- Ciena Corporation
- Francois Pelletier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with thermal-electrical-mechanical chips and...
- Patent number 10,720,409
- Issue date Jul 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with thermal-electrical-mechanical chips and...
- Patent number 10,672,741
- Issue date Jun 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for bonding a group III-V device to a substrate by stack...
- Patent number 10,643,964
- Issue date May 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jhih-Bin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and power amplifier module
- Patent number 10,594,271
- Issue date Mar 17, 2020
- Murata Manufacturing Co., Ltd.
- Isao Obu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Photodiode device monolithically integrating waveguide element with...
- Patent number 10,585,239
- Issue date Mar 10, 2020
- Sumitomo Electric Device Innovations, Inc.
- Yoshihiro Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy metal with zigzagged edges
- Patent number 10,510,654
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,388,623
- Issue date Aug 20, 2019
- Murata Manufacturing Co., Ltd.
- Yasunari Umemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and power amplifier module
- Patent number 10,361,666
- Issue date Jul 23, 2019
- Murata Manufacturing Co., Ltd.
- Isao Obu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 10,252,514
- Issue date Apr 9, 2019
- X-CELEPRINT LIMITED
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Dummy metal with zigzagged edges
- Patent number 10,157,825
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,153,266
- Issue date Dec 11, 2018
- Infineon Technologies AG
- Thomas Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,991,217
- Issue date Jun 5, 2018
- Murata Manufacturing Co., Ltd.
- Yasunari Umemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Augmented capacitor structure for high quality (Q)-factor radio fre...
- Patent number 9,966,426
- Issue date May 8, 2018
- QUALCOMM Incorporated
- Niranjan Sunil Mudakatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 9,550,353
- Issue date Jan 24, 2017
- X-CELEPRINT LIMITED
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Package systems including passive electrical components
- Patent number 9,530,761
- Issue date Dec 27, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Alan Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device, and semiconductor...
- Patent number 9,524,940
- Issue date Dec 20, 2016
- Infineon Technologies AG
- Thomas Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,508,669
- Issue date Nov 29, 2016
- Murata Manufacturing Co., Ltd.
- Yasunari Umemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 9,434,150
- Issue date Sep 6, 2016
- X-CELEPRINT LIMITED
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 9,358,775
- Issue date Jun 7, 2016
- X-CELEPRINT LIMITED
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240145413
- Publication date May 2, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Makoto NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210184022
- Publication date Jun 17, 2021
- Murata Manufacturing Co., Ltd.
- Yasunari UMEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20210143131
- Publication date May 13, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER AMPLIFIER MODULE
- Publication number 20210126591
- Publication date Apr 29, 2021
- Murata Manufacturing Co., Ltd.
- Isao OBU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210098403
- Publication date Apr 1, 2021
- Murata Manufacturing Co., Ltd.
- Masao KONDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR BONDING A GROUP III-V DEVICE TO A SUBSTRATE BY STACK...
- Publication number 20200227369
- Publication date Jul 16, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Jhih-Bin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER AMPLIFIER MODULE
- Publication number 20200177140
- Publication date Jun 4, 2020
- Murata Manufacturing Co., Ltd.
- Isao OBU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTODIODE DEVICE MONOLITHICALLY INTEGRATING WAVEGUIDE ELEMENT WITH...
- Publication number 20200158951
- Publication date May 21, 2020
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Yoshihiro Yoneda
- G02 - OPTICS
Information Patent Application
STRUCTURES FOR BONDING A GROUP III-V DEVICE TO A SUBSTRATE
- Publication number 20200006271
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Jhih-Bin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20190393195
- Publication date Dec 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190333887
- Publication date Oct 31, 2019
- Murata Manufacturing Co., Ltd.
- Yasunari UMEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages with Thermal-Electrical-Mechanical Chips and...
- Publication number 20180374824
- Publication date Dec 27, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER AMPLIFIER MODULE
- Publication number 20180309417
- Publication date Oct 25, 2018
- Murata Manufacturing Co., Ltd.
- Isao OBU
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180233475
- Publication date Aug 16, 2018
- Murata Manufacturing Co., Ltd.
- Yasunari UMEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING
- Publication number 20180001614
- Publication date Jan 4, 2018
- X-Celeprint Limited
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20170338204
- Publication date Nov 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170077054
- Publication date Mar 16, 2017
- Murata Manufacturing Co., Ltd.
- Yasunari UMEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160315060
- Publication date Oct 27, 2016
- Murata Manufacturing Co., Ltd.
- Yasunari UMEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING
- Publication number 20160020130
- Publication date Jan 21, 2016
- X-Celeprint Limited
- Christopher Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS COMPRISED OF TWO TYPES OF TRANSISTORS
- Publication number 20130321082
- Publication date Dec 5, 2013
- Fumio YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20130214404
- Publication date Aug 22, 2013
- Toyota Jidosha Kabushiki Kaisha
- Norimune ORIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SYSTEMS INCLUDING PASSIVE ELECTRICAL COMPONENTS
- Publication number 20130058049
- Publication date Mar 7, 2013
- TAIWAN SEMICONDUCOTR MANUFACTURING COMPANY, LTD.
- Alan ROTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS
- Publication number 20120068345
- Publication date Mar 22, 2012
- INFINEON TECHNOLOGIES AG
- Tobias Schmidt
- H01 - BASIC ELECTRIC ELEMENTS

Indium gallium arsenide [InGaAs]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and power amplifier module

Semiconductor device

Semiconductor device

Apparatus and methods for micro-transfer-printing

Structures for bonding a group III-V device to a substrate by stack...

Semiconductor device

Semiconductor device

Photodiode device monolithically integrating waveguide element with...

Semiconductor device and power amplifier module

Dummy metal with zigzagged edges

Flip-chip high speed components with underfill

Semiconductor packages with thermal-electrical-mechanical chips and...

Semiconductor packages with thermal-electrical-mechanical chips and...

Structures for bonding a group III-V device to a substrate by stack...

Semiconductor device and power amplifier module

Photodiode device monolithically integrating waveguide element with...

Dummy metal with zigzagged edges

Semiconductor device

Semiconductor device and power amplifier module

Apparatus and methods for micro-transfer-printing

Dummy metal with zigzagged edges

Semiconductor device

Semiconductor device

Augmented capacitor structure for high quality (Q)-factor radio fre...

Apparatus and methods for micro-transfer-printing

Package systems including passive electrical components

Method for manufacturing a semiconductor device, and semiconductor...

Semiconductor device

Apparatus and methods for micro-transfer-printing

Apparatus and methods for micro-transfer-printing

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Device and Method for UBM/RDL Routing

SEMICONDUCTOR DEVICE AND POWER AMPLIFIER MODULE

SEMICONDUCTOR DEVICE

STRUCTURES FOR BONDING A GROUP III-V DEVICE TO A SUBSTRATE BY STACK...

SEMICONDUCTOR DEVICE AND POWER AMPLIFIER MODULE

PHOTODIODE DEVICE MONOLITHICALLY INTEGRATING WAVEGUIDE ELEMENT WITH...

STRUCTURES FOR BONDING A GROUP III-V DEVICE TO A SUBSTRATE

Device and Method for UBM/RDL Routing

SEMICONDUCTOR DEVICE

Semiconductor Packages with Thermal-Electrical-Mechanical Chips and...

SEMICONDUCTOR DEVICE AND POWER AMPLIFIER MODULE

SEMICONDUCTOR DEVICE

APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING

Device and Method for UBM/RDL Routing

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING

SEMICONDUCTOR APPARATUS COMPRISED OF TWO TYPES OF TRANSISTORS

SEMICONDUCTOR MODULE

PACKAGE SYSTEMS INCLUDING PASSIVE ELECTRICAL COMPONENTS

LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS