Indium gallium arsenide phosphide [InGaAsP]

Industry

CPC
H01L2924/10351

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/10351Indium gallium arsenide phosphide [InGaAsP]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Dummy metal with zigzagged edges
- Patent number 10,867,900
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy metal with zigzagged edges
- Patent number 10,510,654
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy metal with zigzagged edges
- Patent number 10,157,825
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package systems including passive electrical components
- Patent number 9,530,761
- Issue date Dec 27, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Alan Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices having a glass subst...
- Patent number 8,865,522
- Issue date Oct 21, 2014
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices having a glass subst...
- Patent number 8,803,312
- Issue date Aug 12, 2014
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices having a glass subst...
- Patent number 8,546,934
- Issue date Oct 1, 2013
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices having a glass subst...
- Patent number 8,202,786
- Issue date Jun 19, 2012
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20210143131
- Publication date May 13, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20190393195
- Publication date Dec 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20170338204
- Publication date Nov 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBST...
- Publication number 20130328183
- Publication date Dec 12, 2013
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBST...
- Publication number 20130228905
- Publication date Sep 5, 2013
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SYSTEMS INCLUDING PASSIVE ELECTRICAL COMPONENTS
- Publication number 20130058049
- Publication date Mar 7, 2013
- TAIWAN SEMICONDUCOTR MANUFACTURING COMPANY, LTD.
- Alan ROTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS...
- Publication number 20120248631
- Publication date Oct 4, 2012
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS...
- Publication number 20120012994
- Publication date Jan 19, 2012
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS

Indium gallium arsenide phosphide [InGaAsP]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Dummy metal with zigzagged edges

Dummy metal with zigzagged edges

Dummy metal with zigzagged edges

Package systems including passive electrical components

Method for manufacturing semiconductor devices having a glass subst...

Method for manufacturing semiconductor devices having a glass subst...

Method for manufacturing semiconductor devices having a glass subst...

Method for manufacturing semiconductor devices having a glass subst...

Patents Applicationslast 30 patents

Device and Method for UBM/RDL Routing

Device and Method for UBM/RDL Routing

Device and Method for UBM/RDL Routing

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBST...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBST...

PACKAGE SYSTEMS INCLUDING PASSIVE ELECTRICAL COMPONENTS

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS...