Indium gallium phosphide [InGaP]

Industry

CPC
H01L2924/10338

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/10338Indium gallium phosphide [InGaP]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Front-to-back bonding with through-substrate via (TSV)
- Patent number 11,791,241
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,715,788
- Issue date Aug 1, 2023
- Murata Manufacturing Co., Ltd.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on integrated chips and methods of forming same
- Patent number 11,658,150
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,532,736
- Issue date Dec 20, 2022
- Murata Manufacturing Co., Ltd.
- Yasunari Umemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 11,472,171
- Issue date Oct 18, 2022
- X Display Company Technology Limited
- Christopher Bower
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Semiconductor device
- Patent number 11,158,592
- Issue date Oct 26, 2021
- Murata Manufacturing Co., Ltd.
- Masahiro Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on integrated chips and methods of forming same
- Patent number 11,069,658
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,978,579
- Issue date Apr 13, 2021
- Murata Manufacturing Co., Ltd.
- Yasunari Umemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy metal with zigzagged edges
- Patent number 10,867,900
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front-to-back bonding with through-substrate via (TSV)
- Patent number 10,847,443
- Issue date Nov 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on integrated chips and methods of forming same
- Patent number 10,541,227
- Issue date Jan 21, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy metal with zigzagged edges
- Patent number 10,510,654
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,388,623
- Issue date Aug 20, 2019
- Murata Manufacturing Co., Ltd.
- Yasunari Umemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 10,252,514
- Issue date Apr 9, 2019
- X-CELEPRINT LIMITED
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Dummy metal with zigzagged edges
- Patent number 10,157,825
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for wafer dicing
- Patent number 10,014,269
- Issue date Jul 3, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yueh-Chuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,991,217
- Issue date Jun 5, 2018
- Murata Manufacturing Co., Ltd.
- Yasunari Umemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming three-dimensional integrated circuit (3DIC)...
- Patent number 9,929,050
- Issue date Mar 27, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front-to-back bonding with through-substrate via (TSV)
- Patent number 9,831,156
- Issue date Nov 28, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer structure and method for wafer dicing
- Patent number 9,748,187
- Issue date Aug 29, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yueh-Chuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 9,550,353
- Issue date Jan 24, 2017
- X-CELEPRINT LIMITED
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Semiconductor device
- Patent number 9,508,669
- Issue date Nov 29, 2016
- Murata Manufacturing Co., Ltd.
- Yasunari Umemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 9,434,150
- Issue date Sep 6, 2016
- X-CELEPRINT LIMITED
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 9,358,775
- Issue date Jun 7, 2016
- X-CELEPRINT LIMITED
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
High voltage semiconductor devices including electric arc suppressi...
- Patent number 9,343,383
- Issue date May 17, 2016
- Cree, Inc.
- Van Mieczkowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front-to-back bonding with through-substrate via (TSV)
- Patent number 9,299,640
- Issue date Mar 29, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices having a glass subst...
- Patent number 8,865,522
- Issue date Oct 21, 2014
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices having a glass subst...
- Patent number 8,803,312
- Issue date Aug 12, 2014
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale semiconductor die packaging method
- Patent number 8,703,540
- Issue date Apr 22, 2014
- Semtech Corporation
- Andrew J. Bonthron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices having a glass subst...
- Patent number 8,546,934
- Issue date Oct 1, 2013
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240339425
- Publication date Oct 10, 2024
- Murata Manufacturing Co., Ltd.
- Mari SAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIPOLAR TRANSISTOR AND SEMICONDUCTOR
- Publication number 20240321975
- Publication date Sep 26, 2024
- Murata Manufacturing Co., Ltd.
- Kenji SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220093775
- Publication date Mar 24, 2022
- Murata Manufacturing Co., Ltd.
- Kenji SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System on Integrated Chips and Methods of Forming Same
- Publication number 20210343680
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210184022
- Publication date Jun 17, 2021
- Murata Manufacturing Co., Ltd.
- Yasunari UMEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20210143131
- Publication date May 13, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT-TO-BACK BONDING WITH THROUGH-SUBSTRATE VIA (TSV)
- Publication number 20210043547
- Publication date Feb 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Metal with Zigzagged Edges
- Publication number 20200083156
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20190393195
- Publication date Dec 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190333887
- Publication date Oct 31, 2019
- Murata Manufacturing Co., Ltd.
- Yasunari UMEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System on Integrated Chips and Methods of Forming Same
- Publication number 20190027465
- Publication date Jan 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180233475
- Publication date Aug 16, 2018
- Murata Manufacturing Co., Ltd.
- Yasunari UMEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT-TO-BACK BONDING WITH THROUGH-SUBSTRATE VIA (TSV)
- Publication number 20180145011
- Publication date May 24, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING
- Publication number 20180001614
- Publication date Jan 4, 2018
- X-Celeprint Limited
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20170338204
- Publication date Nov 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR WAFER DICING
- Publication number 20170317043
- Publication date Nov 2, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yueh-Chuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170077054
- Publication date Mar 16, 2017
- Murata Manufacturing Co., Ltd.
- Yasunari UMEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160315060
- Publication date Oct 27, 2016
- Murata Manufacturing Co., Ltd.
- Yasunari UMEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STRUCTURE AND METHOD FOR WAFER DICING
- Publication number 20160181213
- Publication date Jun 23, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yueh-Chuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING
- Publication number 20160020130
- Publication date Jan 21, 2016
- X-Celeprint Limited
- Christopher Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBST...
- Publication number 20130328183
- Publication date Dec 12, 2013
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE SEMICONDUCTOR DEVICES INCLUDING ELECTRIC ARC SUPPRESSI...
- Publication number 20130228796
- Publication date Sep 5, 2013
- Cree, Inc.
- Van Mieczkowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBST...
- Publication number 20130228905
- Publication date Sep 5, 2013
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SCALE SEMICONDUCTOR DIE PACKAGING METHOD
- Publication number 20130130441
- Publication date May 23, 2013
- SEMTECH CORPORATION
- Andrew J. BONTHRON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS...
- Publication number 20120248631
- Publication date Oct 4, 2012
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SCALE SEMICONDUCTOR DIE PACKAGING METHOD
- Publication number 20120115279
- Publication date May 10, 2012
- SEMTECH CORPORATION
- Andrew J. BONTHRON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INDUCTOR AND FLIP-CHIP
- Publication number 20120018892
- Publication date Jan 26, 2012
- MEHDI FREDERIK SOLTAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS...
- Publication number 20120012994
- Publication date Jan 19, 2012
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING MATERIAL, SINTERED BOND AND METHOD FOR PRODUCING A SINTER...
- Publication number 20120003465
- Publication date Jan 5, 2012
- Martin Rittner
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CHIP ASSEMBLY WITH CHIP-SCALE PACKAGING
- Publication number 20110140260
- Publication date Jun 16, 2011
- Sierra Monolithics, Inc.
- Andrew J. Bonthron
- H01 - BASIC ELECTRIC ELEMENTS

Indium gallium phosphide [InGaP]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Front-to-back bonding with through-substrate via (TSV)

Semiconductor device

System on integrated chips and methods of forming same

Semiconductor device

Apparatus and methods for micro-transfer-printing

Semiconductor device

System on integrated chips and methods of forming same

Semiconductor device

Dummy metal with zigzagged edges

Front-to-back bonding with through-substrate via (TSV)

System on integrated chips and methods of forming same

Dummy metal with zigzagged edges

Semiconductor device

Apparatus and methods for micro-transfer-printing

Dummy metal with zigzagged edges

Method for wafer dicing

Semiconductor device

Mechanisms for forming three-dimensional integrated circuit (3DIC)...

Front-to-back bonding with through-substrate via (TSV)

Wafer structure and method for wafer dicing

Apparatus and methods for micro-transfer-printing

Semiconductor device

Apparatus and methods for micro-transfer-printing

Apparatus and methods for micro-transfer-printing

High voltage semiconductor devices including electric arc suppressi...

Front-to-back bonding with through-substrate via (TSV)

Method for manufacturing semiconductor devices having a glass subst...

Method for manufacturing semiconductor devices having a glass subst...

Chip-scale semiconductor die packaging method

Method for manufacturing semiconductor devices having a glass subst...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

BIPOLAR TRANSISTOR AND SEMICONDUCTOR

SEMICONDUCTOR DEVICE

System on Integrated Chips and Methods of Forming Same

SEMICONDUCTOR DEVICE

Device and Method for UBM/RDL Routing

FRONT-TO-BACK BONDING WITH THROUGH-SUBSTRATE VIA (TSV)

Dummy Metal with Zigzagged Edges

Device and Method for UBM/RDL Routing

SEMICONDUCTOR DEVICE

System on Integrated Chips and Methods of Forming Same

SEMICONDUCTOR DEVICE

FRONT-TO-BACK BONDING WITH THROUGH-SUBSTRATE VIA (TSV)

APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING

Device and Method for UBM/RDL Routing

METHOD FOR WAFER DICING

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

WAFER STRUCTURE AND METHOD FOR WAFER DICING

APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBST...

HIGH VOLTAGE SEMICONDUCTOR DEVICES INCLUDING ELECTRIC ARC SUPPRESSI...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBST...

CHIP-SCALE SEMICONDUCTOR DIE PACKAGING METHOD

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS...

CHIP-SCALE SEMICONDUCTOR DIE PACKAGING METHOD

SEMICONDUCTOR DEVICE WITH INDUCTOR AND FLIP-CHIP

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS...

SINTERING MATERIAL, SINTERED BOND AND METHOD FOR PRODUCING A SINTER...

CHIP ASSEMBLY WITH CHIP-SCALE PACKAGING