Indium [In] as principal constituent

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H01L2224/29409

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29409Indium [In] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Hybrid bonding structures and semiconductor devices including the same
- Patent number 11,804,462
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered transient liquid phase bonding
- Patent number 11,546,998
- Issue date Jan 3, 2023
- Skyworks Solutions, Inc.
- Bradley Paul Barber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component and antennae assembly in radio frequency identification d...
- Patent number 6,853,087
- Issue date Feb 8, 2005
- Nanopierce Technologies, Inc.
- Herbert J. Neuhaus
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High conductivity, high strength, lead-free, low cost, electrically...
- Patent number 6,238,599
- Issue date May 29, 2001
- International Business Machines Corporation
- Jeffrey Donald Gelorme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer with transient liquid phase bondable particles
- Patent number 6,199,751
- Issue date Mar 13, 2001
- International Business Machines Corporation
- Michael A. Gaynes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally conducting materials and applications for microelectronic...
- Patent number 6,114,413
- Issue date Sep 5, 2000
- International Business Machines Corporation
- Sung Kwon Kang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polymer with transient liquid phase bondable particles
- Patent number 6,087,021
- Issue date Jul 11, 2000
- International Business Machines Corporation
- Michael A. Gaynes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating coated powder materials and their use for hig...
- Patent number 6,059,952
- Issue date May 9, 2000
- International Business Machines Corporation
- Sung Kwon Kang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of producing connection electrodes
- Patent number 5,034,245
- Issue date Jul 23, 1991
- Sharp Kabushiki Kaisha
- Hiroshi Matsubara
- G02 - OPTICS
Information Patent Grant
Polymer interconnect structure
- Patent number 4,902,857
- Issue date Feb 20, 1990
- American Telephone and Telegraph Company, AT&T Bell Laboratories
- Benjamin H. Cranston
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYBRID BONDING STRUCTURES AND SEMICONDUCTOR DEVICES INCLUDING THE SAME
- Publication number 20220077100
- Publication date Mar 10, 2022
- Samsung Electronics Co., Ltd.
- Kunmo CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERED TRANSIENT LIQUID PHASE BONDING
- Publication number 20200146155
- Publication date May 7, 2020
- SKYWORKS SOLUTIONS, INC.
- Bradley Paul Barber
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, AND METHOD FOR MA...
- Publication number 20200043888
- Publication date Feb 6, 2020
- MITSUBISHI ELECTRIC CORPORATION
- Hiroaki TATSUMI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Method for assembling components and antennae in radio frequency id...
- Publication number 20020053735
- Publication date May 9, 2002
- Herbert J. Neuhaus
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRICALLY CONDUCTIVE PASTE MATERIALS AND APPLICATIONS
- Publication number 20020005247
- Publication date Jan 17, 2002
- TERESITA ORDONEZ GRAHAM
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Indium [In] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hybrid bonding structures and semiconductor devices including the same

Multilayered transient liquid phase bonding

Component and antennae assembly in radio frequency identification d...

High conductivity, high strength, lead-free, low cost, electrically...

Polymer with transient liquid phase bondable particles

Thermally conducting materials and applications for microelectronic...

Polymer with transient liquid phase bondable particles

Method of fabricating coated powder materials and their use for hig...

Method of producing connection electrodes

Polymer interconnect structure

Patents Applicationslast 30 patents

HYBRID BONDING STRUCTURES AND SEMICONDUCTOR DEVICES INCLUDING THE SAME

MULTILAYERED TRANSIENT LIQUID PHASE BONDING

SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, AND METHOD FOR MA...

Method for assembling components and antennae in radio frequency id...

ELECTRICALLY CONDUCTIVE PASTE MATERIALS AND APPLICATIONS