TREA

Indium [In] as principal constituent

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  • CPC
  • H01L2224/05809
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05809Indium [In] as principal constituent
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Hybrid low metal loading flux
    • Patent number 9,950,393
    • Issue date Apr 24, 2018
    • Intel Corporation
    • Rajen S. Sidhu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    TERMINAL AND CONNECTION METHOD
    • Publication number 20230075929
    • Publication date Mar 9, 2023
    • SONY GROUP CORPORATION
    • JO UMEZAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HYBRID LOW METAL LOADING FLUX
    • Publication number 20180236609
    • Publication date Aug 23, 2018
    • Intel Corporation
    • Rajen S. SIDHU
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HYBRID LOW METAL LOADING FLUX
    • Publication number 20130341379
    • Publication date Dec 26, 2013
    • Rajen S. Sidhu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR