TREA

Indium (In) as principal constituent

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  • CPC
  • H01L2224/48609
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48609Indium (In) as principal constituent
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    CHIP PACKAGE AND METHOD OF FORMING THE SAME
    • Publication number 20130277813
    • Publication date Oct 24, 2013
    • INFINEON TECHNOLOGIES AG
    • Holger Torwesten
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER AND SEMICONDUCTOR PACKAGE
    • Publication number 20100007004
    • Publication date Jan 14, 2010
    • Advanced Semiconductor Engineering, Inc.
    • Hsiao Chuan CHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Apparatus and method for low pressure wirebond
    • Publication number 20050098605
    • Publication date May 12, 2005
    • International Business Machines Corporation
    • Daniel C. Edelstein
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR