Indium [In] as principal constituent

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CPC
H01L2224/83409

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83409Indium [In] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Structure for bonding and electrical contact for direct bond hybrid...
- Patent number 11,508,684
- Issue date Nov 22, 2022
- Raytheon Company
- Jonathan Getty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-bonding structure and method of forming the same
- Patent number 10,388,627
- Issue date Aug 20, 2019
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible integrated heat spreader
- Patent number 10,177,066
- Issue date Jan 8, 2019
- Intel Corporation
- Ameya Limaye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-transfer printing with volatile adhesive layer
- Patent number 10,157,880
- Issue date Dec 18, 2018
- X-CELEPRINT LIMITED
- Salvatore Bonafede
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame construct for lead-free solder connections
- Patent number 9,520,347
- Issue date Dec 13, 2016
- Honeywell International Inc.
- Jianxing Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding of semiconductor component to a substrate
- Patent number 8,377,797
- Issue date Feb 19, 2013
- Science Research Laboratory, Inc.
- Aland K. Chin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURE FOR BONDING AND ELECTRICAL CONTACT FOR DIRECT BOND HYBRID...
- Publication number 20210210455
- Publication date Jul 8, 2021
- Raytheon Company
- Jonathan Getty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
- Publication number 20210167035
- Publication date Jun 3, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE INTEGRATED HEAT SPREADER
- Publication number 20180254234
- Publication date Sep 6, 2018
- Intel Corporation
- Ameya Limaye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-TRANSFER PRINTING WITH VOLATILE ADHESIVE LAYER
- Publication number 20180096964
- Publication date Apr 5, 2018
- X-Celeprint Limited
- Salvatore Bonafede
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT BONDING METHOD
- Publication number 20140263581
- Publication date Sep 18, 2014
- ALPHA DESIGN CO., LTD.
- Toshiyuki SHIRATORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING METHOD AND DIE BONDING STRUCTURE OF LIGHT EMITTING DIOD...
- Publication number 20140175495
- Publication date Jun 26, 2014
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODES AND METHODS OF FABRICATING THE SAME
- Publication number 20140124799
- Publication date May 8, 2014
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Doo Hyeb YOUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE STABILIZATION POST
- Publication number 20140084482
- Publication date Mar 27, 2014
- LUXVUE TECHNOLOGY CORPORATION
- Hsin-Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS

Indium [In] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Structure for bonding and electrical contact for direct bond hybrid...

Method and apparatus for creating a bond between objects based on f...

Micro-bonding structure and method of forming the same

Flexible integrated heat spreader

Micro-transfer printing with volatile adhesive layer

Lead frame construct for lead-free solder connections

Method for bonding of semiconductor component to a substrate

Patents Applicationslast 30 patents

STRUCTURE FOR BONDING AND ELECTRICAL CONTACT FOR DIRECT BOND HYBRID...

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

FLEXIBLE INTEGRATED HEAT SPREADER

MICRO-TRANSFER PRINTING WITH VOLATILE ADHESIVE LAYER

ELECTRONIC COMPONENT BONDING METHOD

DIE BONDING METHOD AND DIE BONDING STRUCTURE OF LIGHT EMITTING DIOD...

LIGHT EMITTING DIODES AND METHODS OF FABRICATING THE SAME

MICRO DEVICE STABILIZATION POST