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Indium [In] as principal constituent
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CPC
H01L2224/80409
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/80409
Indium [In] as principal constituent
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last 30 patents
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Patent Grant
Method of liquid assisted micro cold binding
Patent number
10,672,736
Issue date
Jun 2, 2020
MIKRO MESA TECHNOLOGY CO., LTD.
Li-Yi Chen
H01 - BASIC ELECTRIC ELEMENTS