Indium (In) as principal constituent

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H01L2224/48709

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48709Indium (In) as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chip package and method of forming the same
- Patent number 8,945,990
- Issue date Feb 3, 2015
- Infineon Technologies AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices having metallurgies containing copper-semiconduc...
- Patent number 5,855,993
- Issue date Jan 5, 1999
- International Business Machines Corporation
- Michael John Brady
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20130277813
- Publication date Oct 24, 2013
- INFINEON TECHNOLOGIES AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for low pressure wirebond
- Publication number 20050098605
- Publication date May 12, 2005
- International Business Machines Corporation
- Daniel C. Edelstein
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR