Induction heating

Industry

CPC
H01L2224/81222

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81222Induction heating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Magnetic induced heating for solder interconnects
- Patent number 12,040,307
- Issue date Jul 16, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip bonder with induction coils and a heating element
- Patent number 9,875,985
- Issue date Jan 23, 2018
- International Business Machines Corporation
- Jae-woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic intermetallic compound interconnect
- Patent number 9,847,308
- Issue date Dec 19, 2017
- Intel Corporation
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump reflow by induction heating
- Patent number 9,190,375
- Issue date Nov 17, 2015
- GLOBALFOUNDRIES, INC.
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic attachment structure
- Patent number 9,010,618
- Issue date Apr 21, 2015
- Intel Corporation
- Aleksandar Aleksov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reactive bonding of a flip chip package
- Patent number 8,987,130
- Issue date Mar 24, 2015
- International Business Machines Corporation
- Gregory M. Fritz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic attachment structure
- Patent number 8,434,668
- Issue date May 7, 2013
- Intel Corporation
- Aleksandar Aleksov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coil and semiconductor apparatus having the same
- Patent number 8,420,989
- Issue date Apr 16, 2013
- Samsung Electronics Co., Ltd.
- Minill Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting substrate
- Patent number 8,254,140
- Issue date Aug 28, 2012
- Samsung Electronics Co., Ltd.
- Kwang-Yong Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for rapid thermal processing and bonding of ma...
- Patent number 8,207,478
- Issue date Jun 26, 2012
- Yonglai Tian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Attachment using magnetic particle based solder composites
- Patent number 7,902,060
- Issue date Mar 8, 2011
- Intel Corporation
- Rajasekaran Swaminathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly packaging using induction heating
- Patent number 7,880,124
- Issue date Feb 1, 2011
- Intel Corporation
- Thomas Joseph DeBonis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting method, component mounting apparatus, and ultras...
- Patent number 7,861,908
- Issue date Jan 4, 2011
- Panasonic Corporation
- Shozo Minamitani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding metallic terminals by using elastic contact
- Patent number 7,810,701
- Issue date Oct 12, 2010
- Alps Electric Co., Ltd.
- Shinichi Nagano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and a method of soldering a part to a board
- Patent number 7,649,159
- Issue date Jan 19, 2010
- Toyota Jidosha Kabushiki Kaisha
- Masanari Matsuura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making electronic packages
- Patent number 7,575,955
- Issue date Aug 18, 2009
- Ismat Corporation
- Abbas Ismail Attarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for rapid thermal processing and bonding of ma...
- Patent number 7,569,800
- Issue date Aug 4, 2009
- Yonglai Tian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for separating electronic component from organic board
- Patent number 7,234,218
- Issue date Jun 26, 2007
- International Business Machines Corporation
- Mukta G. Farooq
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting method and apparatus and ultrasonic b...
- Patent number 7,229,854
- Issue date Jun 12, 2007
- Matsushita Electric Industrial Co., Ltd.
- Shozo Minamitani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly packaging using induction heating
- Patent number 7,161,122
- Issue date Jan 9, 2007
- Intel Corporation
- Thomas Joseph DeBonis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package and method
- Patent number 7,105,931
- Issue date Sep 12, 2006
- Abbas Ismail Attarwala
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEVICES WITH CONDUCTIVE OR MAGNETIC NANOWIRES FOR LOCALIZED HEATING...
- Publication number 20230223324
- Publication date Jul 13, 2023
- Regents of the University of Minnesota
- Bethanie J Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC INDUCED HEATING FOR SOLDER INTERCONNECTS
- Publication number 20210375820
- Publication date Dec 2, 2021
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP REFLOW BY INDUCTION HEATING
- Publication number 20150294948
- Publication date Oct 15, 2015
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Metal Bump Die Assembly
- Publication number 20140193952
- Publication date Jul 10, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REACTIVE BONDING OF A FLIP CHIP PACKAGE
- Publication number 20130320529
- Publication date Dec 5, 2013
- International Business Machines Corporation
- Gregory M. Fritz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING APPARATUS
- Publication number 20130248114
- Publication date Sep 26, 2013
- Samsung Electronics Co., Ltd.
- Seung Dae SEOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC ATTACHMENT STRUCTURE
- Publication number 20130224444
- Publication date Aug 29, 2013
- Aleksandar Aleksov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP BONDING APPARATUS AND CHIP BONDING METHOD USING THE SAME
- Publication number 20130139380
- Publication date Jun 6, 2013
- Samsung Electronics Co., Ltd.
- Byung Joon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC PARTICLE ATTACHMENT MATERIAL
- Publication number 20110278351
- Publication date Nov 17, 2011
- Aleksandar Aleksov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAGNETIC ATTACHMENT STRUCTURE
- Publication number 20110278044
- Publication date Nov 17, 2011
- Aleksandar Aleksov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR RAPID THERMAL PROCESSING AND BONDING OF MA...
- Publication number 20110278284
- Publication date Nov 17, 2011
- Yonglai Tian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ATTACHMENT USING MAGNETIC PARTICLE BASED SOLDER COMPOSITES
- Publication number 20100159692
- Publication date Jun 24, 2010
- Rajasekaran SWAMINATHAN
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
COIL AND SEMICONDUCTOR APPARATUS HAVING THE SAME
- Publication number 20100117213
- Publication date May 13, 2010
- Samsung Electronics Co., Ltd.
- Minill KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR RAPID THERMAL PROCESSING AND BONDING OF MA...
- Publication number 20090255926
- Publication date Oct 15, 2009
- Yonglai Tian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR BONDING METALLIC TERMINALS BY USING ELASTIC CONTACT
- Publication number 20090250154
- Publication date Oct 8, 2009
- Alps Electric Co., Ltd.
- Shinichi Nagano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING SUBSTRATE
- Publication number 20090188704
- Publication date Jul 30, 2009
- Samsung Electronics Co., Ltd.
- Kwang-Yong LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component mounting method, component mounting apparatus, and ultras...
- Publication number 20070187457
- Publication date Aug 16, 2007
- Matsushita Electric Industrial Co., Ltd.
- Shozo Minamitani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for rapid thermal processing and bonding of ma...
- Publication number 20070108195
- Publication date May 17, 2007
- Yonglai Tian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Assembly packaging using induction heating
- Publication number 20070084856
- Publication date Apr 19, 2007
- Thomas Joseph DeBonis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and a method of soldering a part to a board
- Publication number 20070023486
- Publication date Feb 1, 2007
- Masanari Matsuura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL WIRING DESIGN FOR MODULE REMOVAL AND REPLACEMENT FROM OR...
- Publication number 20060200965
- Publication date Sep 14, 2006
- International Business Machines Corporation
- Mukta G. Farooq
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for making electronic packages
- Publication number 20060084254
- Publication date Apr 20, 2006
- Abbas Ismail Attarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assembly packaging using induction heating
- Publication number 20050284863
- Publication date Dec 29, 2005
- Thomas Joseph DeBonis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component mounting method and apparatus and ultrasondic...
- Publication number 20050227429
- Publication date Oct 13, 2005
- Shozo Minamitani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic package and method
- Publication number 20040195701
- Publication date Oct 7, 2004
- Abbas Ismail Attarwala
- H01 - BASIC ELECTRIC ELEMENTS

Induction heating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Magnetic induced heating for solder interconnects

Flip-chip bonder with induction coils and a heating element

Magnetic intermetallic compound interconnect

Solder bump reflow by induction heating

Magnetic attachment structure

Reactive bonding of a flip chip package

Magnetic attachment structure

Coil and semiconductor apparatus having the same

Mounting substrate

Method and apparatus for rapid thermal processing and bonding of ma...

Attachment using magnetic particle based solder composites

Assembly packaging using induction heating

Component mounting method, component mounting apparatus, and ultras...

Method for bonding metallic terminals by using elastic contact

Apparatus and a method of soldering a part to a board

Method for making electronic packages

Method and apparatus for rapid thermal processing and bonding of ma...

Method for separating electronic component from organic board

Electronic component mounting method and apparatus and ultrasonic b...

Assembly packaging using induction heating

Electronic package and method

Patents Applicationslast 30 patents

DEVICES WITH CONDUCTIVE OR MAGNETIC NANOWIRES FOR LOCALIZED HEATING...

MAGNETIC INDUCED HEATING FOR SOLDER INTERCONNECTS

SOLDER BUMP REFLOW BY INDUCTION HEATING

Methods for Metal Bump Die Assembly

REACTIVE BONDING OF A FLIP CHIP PACKAGE

CHIP BONDING APPARATUS

MAGNETIC ATTACHMENT STRUCTURE

CHIP BONDING APPARATUS AND CHIP BONDING METHOD USING THE SAME

MAGNETIC PARTICLE ATTACHMENT MATERIAL

MAGNETIC ATTACHMENT STRUCTURE

METHOD AND APPARATUS FOR RAPID THERMAL PROCESSING AND BONDING OF MA...

ATTACHMENT USING MAGNETIC PARTICLE BASED SOLDER COMPOSITES

COIL AND SEMICONDUCTOR APPARATUS HAVING THE SAME

METHOD AND APPARATUS FOR RAPID THERMAL PROCESSING AND BONDING OF MA...

METHOD FOR BONDING METALLIC TERMINALS BY USING ELASTIC CONTACT

MOUNTING SUBSTRATE

Component mounting method, component mounting apparatus, and ultras...

Method and apparatus for rapid thermal processing and bonding of ma...

Assembly packaging using induction heating

Apparatus and a method of soldering a part to a board

ELECTRICAL WIRING DESIGN FOR MODULE REMOVAL AND REPLACEMENT FROM OR...

Method for making electronic packages

Assembly packaging using induction heating

Electronic component mounting method and apparatus and ultrasondic...

Electronic package and method