Induction heating

Industry

CPC
H01L2224/83222

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83222Induction heating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Pressure sintering device and method for manufacturing an electroni...
- Patent number 12,046,576
- Issue date Jul 23, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Chip assembly
- Patent number 10,636,766
- Issue date Apr 28, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sinterable bonding material and semiconductor device using the same
- Patent number 10,446,518
- Issue date Oct 15, 2019
- Henkel AG & Co. KGaA
- Hajime Inoue
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of forming a chip assembly with a die attach liquid
- Patent number 9,837,381
- Issue date Dec 5, 2017
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a bond and a semiconductor module
- Patent number 9,202,800
- Issue date Dec 1, 2015
- Infineon Technologies AG
- Tao Hong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Magnetic particle-based composite materials for semiconductor packages
- Patent number 8,222,730
- Issue date Jul 17, 2012
- Intel Corporation
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding material with exothermically reactive heterostructures
- Patent number 8,177,878
- Issue date May 15, 2012
- Infineon Technologies AG
- Alexander Heinrich
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joining of parts via magnetic heating of metal-aluminum powders
- Patent number 8,172,126
- Issue date May 8, 2012
- The Trustees of Dartmouth College
- Ian Baker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic particle-based composite materials for semiconductor packages
- Patent number 7,906,376
- Issue date Mar 15, 2011
- Intel Corporation
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding a non-metal body to a metal surface using inductive heating
- Patent number 7,452,800
- Issue date Nov 18, 2008
- The Regents of the University of California
- Brian D. Sosnowchik
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for curing an anisotropic conductive compound
- Patent number 6,733,613
- Issue date May 11, 2004
- S. Kumar Khanna
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making electric circuit device
- Patent number 5,058,800
- Issue date Oct 22, 1991
- Canon Kabushiki Kaisha
- Tetsuo Yoshizawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRESSURE SINTERING DEVICE AND METHOD FOR MANUFACTURING AN ELECTRONI...
- Publication number 20220157773
- Publication date May 19, 2022
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20200219848
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME
- Publication number 20170294404
- Publication date Oct 12, 2017
- HENKEL AG & GO. KGAA
- Hajime INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING A BOND AND A SEMICONDUCTOR MODULE
- Publication number 20140013595
- Publication date Jan 16, 2014
- Tao Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTION SHEET, METHOD FOR CONNECTING TERMINALS, METH...
- Publication number 20120319268
- Publication date Dec 20, 2012
- Tomohiro Kagimoto
- B32 - LAYERED PRODUCTS
Information Patent Application
Magnetically controlled polymer nanocomposite material and methods...
- Publication number 20120249375
- Publication date Oct 4, 2012
- Nokia Corporation
- Markku T. Heino
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
BONDING MATERIAL WITH EXOTHERMICALLY REACTIVE HETEROSTRUCTURES
- Publication number 20110127314
- Publication date Jun 2, 2011
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAGNETIC PARTICLE-BASED COMPOSITE MATERIALS FOR SEMICONDUCTOR PACKAGES
- Publication number 20110127663
- Publication date Jun 2, 2011
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Joining Of Parts Via Magnetic Heating Of Metal-Aluminum Powders
- Publication number 20110079631
- Publication date Apr 7, 2011
- The Trustees of Dartmouth College
- Ian Baker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAGNETIC PARTICLE-BASED COMPOSITE MATERIALS FOR SEMICONDUCTOR PACKAGES
- Publication number 20090321923
- Publication date Dec 31, 2009
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding metals and non-metals using inductive heating
- Publication number 20070105341
- Publication date May 10, 2007
- The Regents of the University of California.
- Brian D. Sosnowchik
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Magneto-active adhesive systems
- Publication number 20050274454
- Publication date Dec 15, 2005
- Charles W. Extrand
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of curing an anisotropic conductive compound
- Publication number 20040161906
- Publication date Aug 19, 2004
- S. Kumar Khanna
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF CURING AN ANISOTROPIC CONDUCTIVE COMPOUND
- Publication number 20040016505
- Publication date Jan 29, 2004
- Shiva Consulting, Inc.
- S. Kumar Khanna
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Radio wave soldering method for semiconductor device
- Publication number 20030222124
- Publication date Dec 4, 2003
- Yu-Peng Chung
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Induction heating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Pressure sintering device and method for manufacturing an electroni...

Chip assembly

Sintering materials and attachment methods using same

Chip assembly

Sinterable bonding material and semiconductor device using the same

Method of forming a chip assembly with a die attach liquid

Methods for producing a bond and a semiconductor module

Magnetic particle-based composite materials for semiconductor packages

Bonding material with exothermically reactive heterostructures

Joining of parts via magnetic heating of metal-aluminum powders

Magnetic particle-based composite materials for semiconductor packages

Bonding a non-metal body to a metal surface using inductive heating

Method for curing an anisotropic conductive compound

Method of making electric circuit device

Patents Applicationslast 30 patents

PRESSURE SINTERING DEVICE AND METHOD FOR MANUFACTURING AN ELECTRONI...

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME

METHODS FOR PRODUCING A BOND AND A SEMICONDUCTOR MODULE

CONDUCTIVE CONNECTION SHEET, METHOD FOR CONNECTING TERMINALS, METH...

Magnetically controlled polymer nanocomposite material and methods...

BONDING MATERIAL WITH EXOTHERMICALLY REACTIVE HETEROSTRUCTURES

MAGNETIC PARTICLE-BASED COMPOSITE MATERIALS FOR SEMICONDUCTOR PACKAGES

Joining Of Parts Via Magnetic Heating Of Metal-Aluminum Powders

MAGNETIC PARTICLE-BASED COMPOSITE MATERIALS FOR SEMICONDUCTOR PACKAGES

Bonding metals and non-metals using inductive heating

Magneto-active adhesive systems

Method of curing an anisotropic conductive compound

METHOD OF CURING AN ANISOTROPIC CONDUCTIVE COMPOUND

Radio wave soldering method for semiconductor device