Induction heating

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CPC
H01L2224/85212

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/85212Induction heating

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Patents Grantslast 30 patents

Information Patent Grant
Method for bonding a wire and bonding apparatus
- Patent number 4,821,944
- Issue date Apr 18, 1989
- Mitsubishi Denki Kabushiki Kaisha
- Kiyoaki Tsumura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents