Inductive energy

Industry

CPC
C23C14/358

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

CCHEMISTRY METALLURGY C23Surface treatment C23CCOATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material

Current Industry

C23C14/358Inductive energy

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Top magnets for decreased non-uniformity in PVD
- Patent number 12,112,890
- Issue date Oct 8, 2024
- Applied Materials, Inc.
- Borui Xia
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device, method and machine of manufacture
- Patent number 11,851,749
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Chun Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device, method and machine of manufacture
- Patent number 11,345,991
- Issue date May 31, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Chun Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing apparatus
- Patent number 10,984,993
- Issue date Apr 20, 2021
- BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
- Peng Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Movable structure and film forming apparatus
- Patent number 10,847,399
- Issue date Nov 24, 2020
- Tokyo Electron Limited
- Manabu Nakagawasai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ionized physical vapor deposition (IPVD) apparatus and method for a...
- Patent number 10,672,596
- Issue date Jun 2, 2020
- Tokyo Electron Limited
- Jozef Brcka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Patent number 10,047,430
- Issue date Aug 14, 2018
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing a magnetic film having high coercivity for...
- Patent number 9,805,743
- Issue date Oct 31, 2017
- Headway Technologies, Inc.
- Shengyuan Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper wiring structure forming method
- Patent number 9,368,418
- Issue date Jun 14, 2016
- Tokyo Electron Limited
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Mounting table structure and plasma film forming apparatus
- Patent number 9,324,600
- Issue date Apr 26, 2016
- Tokyo Electron Limited
- Toshiaki Fujisato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming copper wiring
- Patent number 9,313,895
- Issue date Apr 12, 2016
- Tokyo Electron Limited
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thin-film forming sputtering system
- Patent number 8,916,034
- Issue date Dec 23, 2014
- EMD Corporation
- Yuichi Setsuhara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electromagnet array in a sputter reactor
- Patent number 8,871,064
- Issue date Oct 28, 2014
- Applied Materials, Inc.
- Tza-Jing Gung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputtering apparatus and sputtering method
- Patent number 8,834,685
- Issue date Sep 16, 2014
- ULVAC, Inc.
- Naoki Morimoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Patent number 8,696,875
- Issue date Apr 15, 2014
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Patent number 8,668,816
- Issue date Mar 11, 2014
- Applied Materials Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for improved high power impulse magnetron sput...
- Patent number 8,574,410
- Issue date Nov 5, 2013
- The Regents of the University of California
- Andre Anders
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Physical vapor deposition plasma reactor with RF source power appli...
- Patent number 8,562,798
- Issue date Oct 22, 2013
- Applied Materials, Inc.
- Karl M. Brown
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of performing physical vapor deposition with RF plasma sourc...
- Patent number 8,512,526
- Issue date Aug 20, 2013
- Applied Materials, Inc.
- Karl M. Brown
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputtering apparatus
- Patent number 8,377,269
- Issue date Feb 19, 2013
- ULVAC, Inc.
- Naoki Morimoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Systems and methods for magnetron deposition
- Patent number 8,308,915
- Issue date Nov 13, 2012
- 4D-S Pty Ltd.
- Makoto Nagashima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for plasma-enhanced physical vapor deposition of copper with...
- Patent number 8,062,484
- Issue date Nov 22, 2011
- Applied Materials, Inc.
- Karl M. Brown
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputtering apparatus and method, and sputtering control program
- Patent number 7,935,232
- Issue date May 3, 2011
- Shibaura Mechatronics Corporation
- Shunji Kuroiwa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Pulsed magnetron sputtering deposition with preionization
- Patent number 7,927,466
- Issue date Apr 19, 2011
- Material Nova ASBL
- Mihai Ganciu-Petcu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for plasma-enhanced physical vapor deposition of copper w...
- Patent number 7,820,020
- Issue date Oct 26, 2010
- Applied Materials, Inc.
- Karl M. Brown
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Physical vapor deposition plasma reactor with arcing suppression
- Patent number 7,804,040
- Issue date Sep 28, 2010
- Applied Materials, Inc.
- Karl M. Brown
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ionized PVD with sequential deposition and etching
- Patent number 7,744,735
- Issue date Jun 29, 2010
- Tokyo Electron Limited
- Rodney Lee Robison
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for a metallic dry-filling process
- Patent number 7,700,484
- Issue date Apr 20, 2010
- Tokyo Electron Limited
- Frank M. Cerio, Jr.
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chemical vapor deposition plasma reactor having plural ion shower g...
- Patent number 7,695,590
- Issue date Apr 13, 2010
- Applied Materials, Inc.
- Hiroji Hanawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-step process for forming a metal barrier in a sputter reactor
- Patent number 7,686,926
- Issue date Mar 30, 2010
- Applied Materials, Inc.
- Tza-Jing Gung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device, Method and Machine of Manufacture
- Publication number 20240093357
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jen-Chun Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TOP MAGNETS FOR DECREASED NON-UNIFORMITY IN PVD
- Publication number 20230088552
- Publication date Mar 23, 2023
- Applied Materials, Inc.
- Borui Xia
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APPARATUS FOR USE IN GENERATING PLASMA
- Publication number 20230028207
- Publication date Jan 26, 2023
- Dyson Technology Limited
- Sean Michael CARLEY
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor Device, Method and Machine of Manufacture
- Publication number 20220290291
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jen-Chun Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20180327893
- Publication date Nov 15, 2018
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MOVABLE STRUCTURE AND FILM FORMING APPARATUS
- Publication number 20180294176
- Publication date Oct 11, 2018
- TOKYO ELECTRON LIMITED
- Manabu NAKAGAWASAI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20140305802
- Publication date Oct 16, 2014
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THIN-FILM FORMATION SPUTTERING DEVICE
- Publication number 20140216928
- Publication date Aug 7, 2014
- EMD CORPORATION
- Yuichi Setsuhara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ANTENNA FOR PLASMA PROCESSING DEVICE, AND PLASMA PROCESSING DEVICE...
- Publication number 20140210337
- Publication date Jul 31, 2014
- EMD CORPORATION
- Yuichi Setsuhara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FORMING COPPER WIRING
- Publication number 20140161992
- Publication date Jun 12, 2014
- TOKYO ELECTRON LIMITED
- Tadahiro ISHIZAKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20130256129
- Publication date Oct 3, 2013
- Beijing NMC Co., Ltd.
- Peng Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MOUNTING TABLE STRUCTURE AND PLASMA FILM FORMING APPARATUS
- Publication number 20130001076
- Publication date Jan 3, 2013
- TOKYO ELECTRON LIMITED
- Toshiaki Fujisato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CREATION OF MAGNETIC FIELD (VECTOR POTENTIAL) WELL FOR IMPROVED PLA...
- Publication number 20120228125
- Publication date Sep 13, 2012
- Liqi Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GAP FILL IMPROVEMENT METHODS FOR PHASE-CHANGE MATERIALS
- Publication number 20120175245
- Publication date Jul 12, 2012
- Mengqi Ye
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SPUTTERING APPARATUS AND SPUTTERING METHOD
- Publication number 20110247928
- Publication date Oct 13, 2011
- Naoki Morimnoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THIN-FILM FORMING SPUTTERING SYSTEM
- Publication number 20110203922
- Publication date Aug 25, 2011
- EMD CORPORATION
- Yuichi Setsuhara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APPARATUS FOR IMPROVED HIGH POWER IMPULSE MAGNETRON SPUT...
- Publication number 20110089024
- Publication date Apr 21, 2011
- Andre Anders
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SPUTTERING APPARATUS
- Publication number 20110062019
- Publication date Mar 17, 2011
- Naoki Morimoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electromagnet array in a sputter reactor
- Publication number 20100155223
- Publication date Jun 24, 2010
- Applied Materials, Inc.
- Tza-Jing GUNG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GAP FILL IMPROVEMENT METHODS FOR PHASE-CHANGE MATERIALS
- Publication number 20100096255
- Publication date Apr 22, 2010
- APPLIED MATERIALS, INC.
- MENGQI YE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Confining Magnets In Sputtering Chamber
- Publication number 20100080928
- Publication date Apr 1, 2010
- TANGO SYSTEMS, INC.
- Ravi Mullapudi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF DEPOSITING METAL-CONTAINING FILMS BY INDUCTIVELY COUPLED...
- Publication number 20090242385
- Publication date Oct 1, 2009
- TOKYO ELECTRON LIMITED
- Rodney L. Robison
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20090233438
- Publication date Sep 17, 2009
- Applied Materials, Inc.
- Peijun DING
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHALCOGENIDE TARGET AND METHOD
- Publication number 20090107834
- Publication date Apr 30, 2009
- APPLIED MATERIALS, INC.
- Mengqi Ye
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RESPUTTERED COPPER SEED LAYER
- Publication number 20080190760
- Publication date Aug 14, 2008
- Applied Materials, Inc.
- XIANMIN TANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20080110747
- Publication date May 15, 2008
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Systems and methods for magnetron deposition
- Publication number 20080067063
- Publication date Mar 20, 2008
- Makoto Nagashima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Sputtering Apparatus and Method, and Sputtering Control Program
- Publication number 20080023318
- Publication date Jan 31, 2008
- Shunji Kuroiwa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Physical vapor deposition plasma reactor with arcing suppression
- Publication number 20070193982
- Publication date Aug 23, 2007
- APPLIED MATERIALS, INC.
- Karl M. Brown
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Sputtering system providing large area sputtering and plasma-assist...
- Publication number 20070181421
- Publication date Aug 9, 2007
- Industrial Technology Research Institute
- Hung-Wen Wei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Inductive energy

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Top magnets for decreased non-uniformity in PVD

Semiconductor device, method and machine of manufacture

Semiconductor device, method and machine of manufacture

Plasma processing apparatus

Movable structure and film forming apparatus

Ionized physical vapor deposition (IPVD) apparatus and method for a...

Self-ionized and inductively-coupled plasma for sputtering and resp...

Method of manufacturing a magnetic film having high coercivity for...

Copper wiring structure forming method

Mounting table structure and plasma film forming apparatus

Method for forming copper wiring

Thin-film forming sputtering system

Electromagnet array in a sputter reactor

Sputtering apparatus and sputtering method

Self-ionized and inductively-coupled plasma for sputtering and resp...

Self-ionized and inductively-coupled plasma for sputtering and resp...

Method and apparatus for improved high power impulse magnetron sput...

Physical vapor deposition plasma reactor with RF source power appli...

Method of performing physical vapor deposition with RF plasma sourc...

Sputtering apparatus

Systems and methods for magnetron deposition

Method for plasma-enhanced physical vapor deposition of copper with...

Sputtering apparatus and method, and sputtering control program

Pulsed magnetron sputtering deposition with preionization

Apparatus for plasma-enhanced physical vapor deposition of copper w...

Physical vapor deposition plasma reactor with arcing suppression

Ionized PVD with sequential deposition and etching

Method and apparatus for a metallic dry-filling process

Chemical vapor deposition plasma reactor having plural ion shower g...

Multi-step process for forming a metal barrier in a sputter reactor

Patents Applicationslast 30 patents

Semiconductor Device, Method and Machine of Manufacture

TOP MAGNETS FOR DECREASED NON-UNIFORMITY IN PVD

METHOD AND APPARATUS FOR USE IN GENERATING PLASMA

Semiconductor Device, Method and Machine of Manufacture

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

MOVABLE STRUCTURE AND FILM FORMING APPARATUS

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

THIN-FILM FORMATION SPUTTERING DEVICE

ANTENNA FOR PLASMA PROCESSING DEVICE, AND PLASMA PROCESSING DEVICE...

METHOD FOR FORMING COPPER WIRING

PLASMA PROCESSING APPARATUS

MOUNTING TABLE STRUCTURE AND PLASMA FILM FORMING APPARATUS

CREATION OF MAGNETIC FIELD (VECTOR POTENTIAL) WELL FOR IMPROVED PLA...

GAP FILL IMPROVEMENT METHODS FOR PHASE-CHANGE MATERIALS

SPUTTERING APPARATUS AND SPUTTERING METHOD

THIN-FILM FORMING SPUTTERING SYSTEM

METHOD AND APPARATUS FOR IMPROVED HIGH POWER IMPULSE MAGNETRON SPUT...

SPUTTERING APPARATUS

Electromagnet array in a sputter reactor

GAP FILL IMPROVEMENT METHODS FOR PHASE-CHANGE MATERIALS

Confining Magnets In Sputtering Chamber

METHOD OF DEPOSITING METAL-CONTAINING FILMS BY INDUCTIVELY COUPLED...

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

CHALCOGENIDE TARGET AND METHOD

RESPUTTERED COPPER SEED LAYER

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

Systems and methods for magnetron deposition

Sputtering Apparatus and Method, and Sputtering Control Program

Physical vapor deposition plasma reactor with arcing suppression

Sputtering system providing large area sputtering and plasma-assist...