Infrared [IR] curing

Industry

CPC
H01L2224/83868

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83868Infrared [IR] curing

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic device and method of transferring electronic element usi...
- Patent number 12,009,339
- Issue date Jun 11, 2024
- Seoul National University R&DB Foundation
- Yongtaek Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of transferring electronic element usi...
- Patent number 11,848,303
- Issue date Dec 19, 2023
- Seoul National University R&DB Foundation
- Yongtaek Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 11,648,750
- Issue date May 16, 2023
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bonding tools for bonding machines, bonding machines for bonding se...
- Patent number 11,608,453
- Issue date Mar 21, 2023
- Kulicke and Soffa Industries, Inc.
- Urban Ernst
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Chip bonding method and bonding device
- Patent number 11,239,198
- Issue date Feb 1, 2022
- BOE Technology Group Co., Ltd.
- Lili Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 11,201,138
- Issue date Dec 14, 2021
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 10,734,353
- Issue date Aug 4, 2020
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Curing a heat-curable material in an embedded curing zone
- Patent number 10,717,236
- Issue date Jul 21, 2020
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Jeroen van den Brand
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Integrated circuit module and method of forming same
- Patent number 10,636,768
- Issue date Apr 28, 2020
- Starkey Laboratories, Inc.
- Sayed Kaysarbin Rahim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Printed assemblies of ultrathin, microscale inorganic light emittin...
- Patent number 10,546,841
- Issue date Jan 28, 2020
- The Board of Trustees of the University of Illinois
- John A. Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 10,410,991
- Issue date Sep 10, 2019
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser assisted transfer welding process
- Patent number 10,181,483
- Issue date Jan 15, 2019
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor structure
- Patent number 10,163,734
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates
- Patent number 9,929,124
- Issue date Mar 27, 2018
- EV Group E. Thallner GmbH
- Jurgen Burggraf
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chip packages and methods of manufacture thereof
- Patent number 9,735,130
- Issue date Aug 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed assemblies of ultrathin, microscale inorganic light emittin...
- Patent number 9,647,171
- Issue date May 9, 2017
- The Board of Trustees of the University of Illinois
- John A. Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabrication and testing of three-dimensional stacked int...
- Patent number 9,570,429
- Issue date Feb 14, 2017
- SHANGHAI JADIC OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Jianhong Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite substrate manufacturing method, semiconductor element man...
- Patent number 9,455,229
- Issue date Sep 27, 2016
- Namiki Seimitsu Houseki Kabushiki Kaisha
- Hideo Aida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip assembly process comprising pre-coating interconnect elem...
- Patent number 9,406,662
- Issue date Aug 2, 2016
- Commisariat A l'Energie Atomique et Aux Energies Alternatives
- François Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser assisted transfer welding process
- Patent number 9,161,448
- Issue date Oct 13, 2015
- Semprius, Inc.
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for forming 3DIC package
- Patent number 9,073,158
- Issue date Jul 7, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically bonded arrays of transfer printed active components
- Patent number 9,049,797
- Issue date Jun 2, 2015
- Semprius, Inc.
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for forming 3DIC package
- Patent number 8,609,462
- Issue date Dec 17, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for packing electric components on a substrate
- Patent number 8,241,455
- Issue date Aug 14, 2012
- Sony Chemical & Information Device Corporation
- Takashi Matsumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing an electronic component and corresponding...
- Patent number 7,834,460
- Issue date Nov 16, 2010
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for flip-chip bonding
- Patent number 7,816,179
- Issue date Oct 19, 2010
- Samsung Techwin Co., Ltd.
- Sang-cheol Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure and method for stress reduction in flip chip microelectro...
- Patent number 7,498,198
- Issue date Mar 3, 2009
- International Business Machines Corporation
- Sylvie S. Charles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for flip-chip bonding
- Patent number 7,464,850
- Issue date Dec 16, 2008
- Samsung Techwin Co., Ltd.
- Sang-cheol Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting semiconductor chip
- Patent number 7,394,163
- Issue date Jul 1, 2008
- Fujitsu Limited
- Shunji Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus incorporating small-feature-size and large-feature-size c...
- Patent number 7,214,569
- Issue date May 8, 2007
- Alien Technology Corporation
- Susan Swindlehurst
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20230191747
- Publication date Jun 22, 2023
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF TRANSFERRING ELECTRONIC ELEMENT USI...
- Publication number 20220271004
- Publication date Aug 25, 2022
- Seoul National University R&DB Foundation
- Yongtaek HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF TRANSFERRING ELECTRONIC ELEMENT USI...
- Publication number 20220059496
- Publication date Feb 24, 2022
- Seoul National University R&DB Foundation
- Yongtaek HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20200365552
- Publication date Nov 19, 2020
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...
- Publication number 20200126951
- Publication date Apr 23, 2020
- International Business Machines Corporation
- Bing DANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20190341364
- Publication date Nov 7, 2019
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Application
Printed Assemblies of Ultrathin, Microscale Inorganic Light Emittin...
- Publication number 20150132873
- Publication date May 14, 2015
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- John A. ROGERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SUBSTRATE MANUFACTURING METHOD, SEMICONDUCTOR ELEMENT MAN...
- Publication number 20150076662
- Publication date Mar 19, 2015
- NAMIKI SEIMITSU HOUSEKI KABUSHIKIKAISHA
- Hideo Aida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming 3DIC Package
- Publication number 20140091509
- Publication date Apr 3, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICALLY BONDED ARRAYS OF TRANSFER PRINTED ACTIVE COMPONENTS
- Publication number 20130153277
- Publication date Jun 20, 2013
- Etienne Menard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming 3DIC Package
- Publication number 20130095608
- Publication date Apr 18, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER ASSISTED TRANSFER WELDING PROCESS
- Publication number 20120115262
- Publication date May 10, 2012
- Semprius, Inc.
- Etienne Menard
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Printed Assemblies of Ultrathin, Microscale Inorganic Light Emittin...
- Publication number 20100317132
- Publication date Dec 16, 2010
- John A. Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PACKING ELECTRIC COMPONENTS ON A SUBSTRATE
- Publication number 20100186894
- Publication date Jul 29, 2010
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Takashi Matsumura
- B30 - PRESSES
Information Patent Application
METHOD AND APPARATUS FOR FLIP-CHIP BONDING
- Publication number 20090035891
- Publication date Feb 5, 2009
- Samsung Techwin Co., Ltd.
- Sang-cheol Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPRESSION BONDING DEVICE
- Publication number 20090014498
- Publication date Jan 15, 2009
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Takashi Matsumura
- B30 - PRESSES
Information Patent Application
STRUCTURE AND METHOD FOR STRESS REDUCTION IN FLIP CHIP MICROELECTRO...
- Publication number 20080265435
- Publication date Oct 30, 2008
- International Business Machines Corporation
- Sylvie S. Charles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CREATING RFID DEVICES USING MASKING TECHNI...
- Publication number 20080122119
- Publication date May 29, 2008
- Avery Dennison Corporation
- Kouroche Kian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITIONS FOR USE IN ELECTRONICS DEVICES
- Publication number 20080054227
- Publication date Mar 6, 2008
- National Starch and Chemical Investment Holding Corporation
- Demetrius McCormick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing an electronic component and corresponding...
- Publication number 20070290346
- Publication date Dec 20, 2007
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus incorporating small-feature-size and large-feature-size c...
- Publication number 20070117274
- Publication date May 24, 2007
- Susan Swindlehurst
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method and apparatus for flip-chip bonding
- Publication number 20070037318
- Publication date Feb 15, 2007
- Samsung Techwin Co., Ltd.
- Sang-cheol Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Compositions for use in electronics devices
- Publication number 20050247916
- Publication date Nov 10, 2005
- Demetrius McCormick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated underfill process for bumped chip assembly
- Publication number 20050028361
- Publication date Feb 10, 2005
- INDIUM CORPORATION OF AMERICA
- Wushing Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus incorporating small-feature-size and large-feature-size c...
- Publication number 20040183182
- Publication date Sep 23, 2004
- Susan Swindlehurst
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method and apparatus for flip chip device assembly by radiant heating
- Publication number 20040108600
- Publication date Jun 10, 2004
- Jimmy Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Releasable microcapsule and adhesive curing system using the same
- Publication number 20040074089
- Publication date Apr 22, 2004
- Cookson Electronics, Inc.
- Kenneth B. Gilleo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method and apparatus for flip chip device assembly by radiant heating
- Publication number 20030132528
- Publication date Jul 17, 2003
- Jimmy Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of mounting semiconductor chip
- Publication number 20020164837
- Publication date Nov 7, 2002
- FUJITSU LIMITED
- Shunji Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding method and apparatus
- Publication number 20020108707
- Publication date Aug 15, 2002
- International Business Machines Corporation
- Shigetaka Kobayashi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Infrared [IR] curing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device and method of transferring electronic element usi...

Electronic device and method of transferring electronic element usi...

Adhesive bonding composition and method of use

Bonding tools for bonding machines, bonding machines for bonding se...

Chip bonding method and bonding device

Wafer level integration including design/co-design, structure proce...

Adhesive bonding composition and method of use

Curing a heat-curable material in an embedded curing zone

Integrated circuit module and method of forming same

Printed assemblies of ultrathin, microscale inorganic light emittin...

Adhesive bonding composition and method of use

Laser assisted transfer welding process

Method for manufacturing semiconductor structure

Method for bonding substrates

Chip packages and methods of manufacture thereof

Printed assemblies of ultrathin, microscale inorganic light emittin...

Methods of fabrication and testing of three-dimensional stacked int...

Composite substrate manufacturing method, semiconductor element man...

Flip-chip assembly process comprising pre-coating interconnect elem...

Laser assisted transfer welding process

Methods for forming 3DIC package

Electrically bonded arrays of transfer printed active components

Methods for forming 3DIC package

Method for packing electric components on a substrate

Method for manufacturing an electronic component and corresponding...

Method and apparatus for flip-chip bonding

Structure and method for stress reduction in flip chip microelectro...

Method and apparatus for flip-chip bonding

Method of mounting semiconductor chip

Apparatus incorporating small-feature-size and large-feature-size c...

Patents Applicationslast 30 patents

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

ELECTRONIC DEVICE AND METHOD OF TRANSFERRING ELECTRONIC ELEMENT USI...

ELECTRONIC DEVICE AND METHOD OF TRANSFERRING ELECTRONIC ELEMENT USI...

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

Printed Assemblies of Ultrathin, Microscale Inorganic Light Emittin...

COMPOSITE SUBSTRATE MANUFACTURING METHOD, SEMICONDUCTOR ELEMENT MAN...

Methods for Forming 3DIC Package

ELECTRICALLY BONDED ARRAYS OF TRANSFER PRINTED ACTIVE COMPONENTS

Methods for Forming 3DIC Package

LASER ASSISTED TRANSFER WELDING PROCESS

Printed Assemblies of Ultrathin, Microscale Inorganic Light Emittin...

METHOD FOR PACKING ELECTRIC COMPONENTS ON A SUBSTRATE

METHOD AND APPARATUS FOR FLIP-CHIP BONDING

COMPRESSION BONDING DEVICE

STRUCTURE AND METHOD FOR STRESS REDUCTION IN FLIP CHIP MICROELECTRO...

METHOD AND APPARATUS FOR CREATING RFID DEVICES USING MASKING TECHNI...

COMPOSITIONS FOR USE IN ELECTRONICS DEVICES

Method for manufacturing an electronic component and corresponding...

Apparatus incorporating small-feature-size and large-feature-size c...

Method and apparatus for flip-chip bonding

Compositions for use in electronics devices

Integrated underfill process for bumped chip assembly

Apparatus incorporating small-feature-size and large-feature-size c...

Method and apparatus for flip chip device assembly by radiant heating

Releasable microcapsule and adhesive curing system using the same

Method and apparatus for flip chip device assembly by radiant heating

Method of mounting semiconductor chip

Bonding method and apparatus