TREA

Infrared [IR] curing

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Industry

  • CPC
  • H01L2224/81868
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81868Infrared [IR] curing
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Patents Grantslast 30 patents

  • Information Patent Grant

    Method of manufacturing circuit module
    • Patent number 5,829,125
    • Issue date Nov 3, 1998
    • Taiyo Yuden Co., Ltd.
    • Masayuki Fujimoto
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR