initial plating of through-holes in metal-clad substrates

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CPC
H05K3/427

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/427initial plating of through-holes in metal-clad substrates

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming a laminate structure having a plated through-hole...
- Patent number 12,150,254
- Issue date Nov 19, 2024
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated film structure and method for manufacturing laminated fil...
- Patent number 12,069,809
- Issue date Aug 20, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kazuya Shimada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 12,058,818
- Issue date Aug 6, 2024
- Ibiden Co., Ltd.
- Satoru Kawai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Circuit board preparation method
- Patent number 11,937,377
- Issue date Mar 19, 2024
- SHENNAN CIRCUITS CO., LTD.
- Changsheng Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package component and forming method thereof
- Patent number 11,924,965
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,917,768
- Issue date Feb 27, 2024
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Laminated film structure and method for manufacturing laminated fil...
- Patent number 11,825,608
- Issue date Nov 21, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kazuya Shimada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless and electrolytic deposition process for forming traces...
- Patent number 11,653,453
- Issue date May 16, 2023
- CATLAM, LLC
- Kenneth S Bahl
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Foldable support and display device
- Patent number 11,546,986
- Issue date Jan 3, 2023
- BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
- Haoran Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Component carrier with electrically conductive layer structures hav...
- Patent number 11,452,212
- Issue date Sep 20, 2022
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 11,439,026
- Issue date Sep 6, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jung-Soo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing display substrate
- Patent number 11,417,847
- Issue date Aug 16, 2022
- BOE Technology Group Co., Ltd.
- Youngyik Ko
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,266,027
- Issue date Mar 1, 2022
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing the printed board
- Patent number 11,229,123
- Issue date Jan 18, 2022
- Nichia Corporation
- Masaaki Katsumata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing printed wiring board
- Patent number 11,197,379
- Issue date Dec 7, 2021
- Mitsubishi Gas Chemical Company, Inc.
- Kazuaki Kawashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,032,915
- Issue date Jun 8, 2021
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring board, multilayer wiring board, and method of manufacturing...
- Patent number 10,966,324
- Issue date Mar 30, 2021
- Toppan Printing Co., Ltd.
- Yasuyuki Hitsuoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed board, light emitting device, and method for manufacturing...
- Patent number 10,964,865
- Issue date Mar 30, 2021
- Nichia Corporation
- Masaaki Katsumata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed board and light emitting device
- Patent number 10,957,836
- Issue date Mar 23, 2021
- Nichia Corporation
- Masaaki Katsumata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper clad laminates and method for manufacturing a printed circui...
- Patent number 10,952,329
- Issue date Mar 16, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Youn-Gyu Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly that includes void free holes
- Patent number 10,856,424
- Issue date Dec 1, 2020
- Intel Corporation
- Sri Ranga Sai Boyapati
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process for forming traces on a catalytic laminate
- Patent number 10,849,233
- Issue date Nov 24, 2020
- CATLAM, LLC
- Kenneth S Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier substrate, package, and method of manufacture
- Patent number 10,777,457
- Issue date Sep 15, 2020
- Ubotic Company Limited
- Ming-Wa Tam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a laminate structure having a plated through-hole...
- Patent number 10,757,819
- Issue date Aug 25, 2020
- Sanmina Corporation
- Shinichi Iketani
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 10,757,820
- Issue date Aug 25, 2020
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Laminate production method
- Patent number 10,721,823
- Issue date Jul 21, 2020
- Intel Corporation
- Makoto Fujimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminate production method
- Patent number 10,716,222
- Issue date Jul 14, 2020
- Intel Corporation
- Makoto Fujimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer wiring board
- Patent number 10,609,823
- Issue date Mar 31, 2020
- Hitachi Chemical Company, Ltd.
- Nobuyuki Yoshida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed board, light emitting device, and method for manufacturing...
- Patent number 10,586,903
- Issue date Mar 10, 2020
- Nichia Corporation
- Masaaki Katsumata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a high-current printed circuit board
- Patent number 10,561,026
- Issue date Feb 11, 2020
- Avary Holding (Shenzhen) Co., Limited.
- Rih-Sin Jian
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD
- Publication number 20240292533
- Publication date Aug 29, 2024
- KYOCERA CORPORATION
- Hidetoshi YUGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE COMPONENT
- Publication number 20240215150
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEI CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Filing at least One Hole formed in a Printed Circuit Boa...
- Publication number 20230403797
- Publication date Dec 14, 2023
- ITC Intercircuit Electronic GmbH
- Hubertus Hein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED FILM STRUCTURE AND METHOD FOR MANUFACTURING LAMINATED FIL...
- Publication number 20230389189
- Publication date Nov 30, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Kazuya SHIMADA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PACKAGE COMPONENT AND FORMING METHOD THEREOF
- Publication number 20230345622
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEI CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230232544
- Publication date Jul 20, 2023
- LG Innotek Co., Ltd.
- Myung Jae KWON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED FILM STRUCTURE AND METHOD FOR MANUFACTURING LAMINATED FIL...
- Publication number 20230156924
- Publication date May 18, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Kazuya SHIMADA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Component Carrier With Partially Metallized Hole Using Anti-Plating...
- Publication number 20230119480
- Publication date Apr 20, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jiangfeng ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20230030601
- Publication date Feb 2, 2023
- IBIDEN CO., LTD.
- Satoru KAWAI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CIRCUIT BOARD PREPARATION METHOD
- Publication number 20220386472
- Publication date Dec 1, 2022
- SHENNAN CIRCUITS CO., LTD.
- CHANGSHENG TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FOLDABLE SUPPORT, FABRICATING METHOD THEREOF AND DISPLAY DEVICE
- Publication number 20210168929
- Publication date Jun 3, 2021
- BOE TECHNOLOGY GROUP CO., LTD.
- Haoran WANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Component Carrier With Electrically Conductive Layer Structures Hav...
- Publication number 20210127496
- Publication date Apr 29, 2021
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process For Forming Traces on a Catalytic Laminate
- Publication number 20210051804
- Publication date Feb 18, 2021
- CATLAM, LLC
- Kenneth S. BAHL
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD OF FORMING A LAMINATE STRUCTURE HAVING A PLATED THROUGH-HOLE...
- Publication number 20210014980
- Publication date Jan 14, 2021
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20200404796
- Publication date Dec 24, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Jung-Soo KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...
- Publication number 20200344895
- Publication date Oct 29, 2020
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...
- Publication number 20200329567
- Publication date Oct 15, 2020
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Circuit Board with Improved Thermal, Moisture Resistance, and Elect...
- Publication number 20200288569
- Publication date Sep 10, 2020
- OSI Electronics, Inc.
- Robert Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING PRINTED WIRING BOARD
- Publication number 20200015363
- Publication date Jan 9, 2020
- Mitsubishi Gas Chemical Company, Inc.
- Kazuaki KAWASHITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...
- Publication number 20190306991
- Publication date Oct 3, 2019
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIRING BOARD, MULTILAYER WIRING BOARD, AND METHOD OF MANUFACTURING...
- Publication number 20190297731
- Publication date Sep 26, 2019
- Toppan Printing Co., Ltd.
- Yasuyuki Hitsuoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING A HIGH-CURRENT PRINTED CIRCUIT BOARD
- Publication number 20190289726
- Publication date Sep 19, 2019
- Avary Holding (Shenzhen) Co., Limited.
- RIH-SIN JIAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINGLE LAMINATION BLIND AND METHOD FOR FORMING THE SAME
- Publication number 20190141840
- Publication date May 9, 2019
- R&D Circuits, Inc.
- Donald Eric Thompson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARRIER SUBSTRATE, PACKAGE, AND METHOD OF MANUFACTURE
- Publication number 20190103313
- Publication date Apr 4, 2019
- Ubotic Company Limited
- Ming-Wa TAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREGREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINAT...
- Publication number 20180098425
- Publication date Apr 5, 2018
- Akiko Kawaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE CARRIER
- Publication number 20180025956
- Publication date Jan 25, 2018
- Subtron Technology Co., Ltd.
- Chih-Hsien Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20170367191
- Publication date Dec 21, 2017
- Avary Holding (Shenzhen) Co., Limited.
- WEI-SHUO SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD FOR BACK DRILLING HOLE IN PCB AND PCB
- Publication number 20160150653
- Publication date May 26, 2016
- PEKING UNIVERSITY FOUNDER GROUP CO., LTD.
- Xiaren CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD OF MINIATURIZING THE SIZE OF A PRINTED CIRCUIT...
- Publication number 20150245467
- Publication date Aug 27, 2015
- MOTOROLA SOLUTIONS, INC.
- KHAI LOKE LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD PACKAGE STRUCTURE AND MANUFACTURING METHOD TH...
- Publication number 20150107883
- Publication date Apr 23, 2015
- TRIPOD TECHNOLOGY CORPORATION
- Bo-Shiung Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

initial plating of through-holes in metal-clad substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming a laminate structure having a plated through-hole...

Laminated film structure and method for manufacturing laminated fil...

Method for manufacturing printed wiring board

Circuit board preparation method

Package component and forming method thereof

Single-layer circuit board, multi-layer circuit board, and manufact...

Laminated film structure and method for manufacturing laminated fil...

Electroless and electrolytic deposition process for forming traces...

Foldable support and display device

Component carrier with electrically conductive layer structures hav...

Printed circuit board

Method for manufacturing display substrate

Single-layer circuit board, multi-layer circuit board, and manufact...

Method of manufacturing the printed board

Method for producing printed wiring board

Single-layer circuit board, multi-layer circuit board, and manufact...

Wiring board, multilayer wiring board, and method of manufacturing...

Printed board, light emitting device, and method for manufacturing...

Printed board and light emitting device

Copper clad laminates and method for manufacturing a printed circui...

Electronic assembly that includes void free holes

Process for forming traces on a catalytic laminate

Carrier substrate, package, and method of manufacture

Method of forming a laminate structure having a plated through-hole...

Single-layer circuit board, multi-layer circuit board, and manufact...

Laminate production method

Laminate production method

Method for manufacturing multilayer wiring board

Printed board, light emitting device, and method for manufacturing...

Method for manufacturing a high-current printed circuit board

Patents Applicationslast 30 patents

WIRING BOARD

PACKAGE COMPONENT

Method for Filing at least One Hole formed in a Printed Circuit Boa...

LAMINATED FILM STRUCTURE AND METHOD FOR MANUFACTURING LAMINATED FIL...

PACKAGE COMPONENT AND FORMING METHOD THEREOF

SEMICONDUCTOR PACKAGE

LAMINATED FILM STRUCTURE AND METHOD FOR MANUFACTURING LAMINATED FIL...

Component Carrier With Partially Metallized Hole Using Anti-Plating...

METHOD FOR MANUFACTURING PRINTED WIRING BOARD

CIRCUIT BOARD PREPARATION METHOD

FOLDABLE SUPPORT, FABRICATING METHOD THEREOF AND DISPLAY DEVICE

Component Carrier With Electrically Conductive Layer Structures Hav...

Process For Forming Traces on a Catalytic Laminate

METHOD OF FORMING A LAMINATE STRUCTURE HAVING A PLATED THROUGH-HOLE...

PRINTED CIRCUIT BOARD

SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...

SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...

Circuit Board with Improved Thermal, Moisture Resistance, and Elect...

METHOD FOR PRODUCING PRINTED WIRING BOARD

SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...

WIRING BOARD, MULTILAYER WIRING BOARD, AND METHOD OF MANUFACTURING...

METHOD FOR MANUFACTURING A HIGH-CURRENT PRINTED CIRCUIT BOARD

SINGLE LAMINATION BLIND AND METHOD FOR FORMING THE SAME

CARRIER SUBSTRATE, PACKAGE, AND METHOD OF MANUFACTURE

PREGREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINAT...

MANUFACTURING METHOD OF PACKAGE CARRIER

PRINTED CIRCUIT BOARD

MANUFACTURING METHOD FOR BACK DRILLING HOLE IN PCB AND PCB

APPARATUS AND METHOD OF MINIATURIZING THE SIZE OF A PRINTED CIRCUIT...

PRINTED CIRCUIT BOARD PACKAGE STRUCTURE AND MANUFACTURING METHOD TH...