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H05K2201/09454

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/09454Inner lands

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic element mounting substrate, electronic device, and elect...
- Patent number 12,144,114
- Issue date Nov 12, 2024
- Kyocera Corporation
- Kanae Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 11,882,656
- Issue date Jan 23, 2024
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sn—Bi and copper powder conductive paste in through hole of insulat...
- Patent number 11,864,317
- Issue date Jan 2, 2024
- Nichia Corporation
- Masaaki Katsumata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric device with high screen ratio
- Patent number 11,537,176
- Issue date Dec 27, 2022
- Acer Incorporated
- Tai Ju
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Inductor with embraced corner capture pad
- Patent number 10,978,240
- Issue date Apr 13, 2021
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 10,905,008
- Issue date Jan 26, 2021
- NGK Spark Plug Co., Ltd.
- Takahiro Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate, component-mounted substrate, and methods of manu...
- Patent number 10,887,988
- Issue date Jan 5, 2021
- Nichia Corporation
- Masaaki Katsumata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 10,849,226
- Issue date Nov 24, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Mi-Sun Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit to mitigate cracking at through-holes
- Patent number 10,798,819
- Issue date Oct 6, 2020
- CommScope, Inc. of North Carolina
- Brian J. Fitzpatrick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing flexible printed circuit board
- Patent number 10,791,625
- Issue date Sep 29, 2020
- Avary Holding (Shenzhen) Co., Limited.
- Xian-Qin Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for frequency shifting resonance of an unused v...
- Patent number 10,605,585
- Issue date Mar 31, 2020
- Dell Products L.P.
- Bhyrav M. Mutnury
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via and skip via structures
- Patent number 10,485,111
- Issue date Nov 19, 2019
- GLOBALFOUNDRIES Inc.
- Shao Beng Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered substrate and method for manufacturing the same
- Patent number 10,455,708
- Issue date Oct 22, 2019
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seok-Hwan Ahn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board, printed circuit board structure and...
- Patent number 10,321,561
- Issue date Jun 11, 2019
- Avary Holding (Shenzhen) Co., Limited.
- Xian-Qin Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for impedance compensation in printed circuit boards
- Patent number 10,154,581
- Issue date Dec 11, 2018
- Cray Inc.
- Andy Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for frequency shifting resonance of an unused v...
- Patent number 10,126,110
- Issue date Nov 13, 2018
- Dell Products L.P.
- Bhyrav M. Mutnury
- G01 - MEASURING TESTING
Information Patent Grant
Electronic component, method for manufacturing the electronic compo...
- Patent number 9,854,685
- Issue date Dec 26, 2017
- Murata Manufacturing Co., Ltd.
- Nobuo Ikemoto
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method and apparatus for printed circuit board with stiffener
- Patent number 9,767,241
- Issue date Sep 19, 2017
- Digi International Inc.
- Norman L. Rogers
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High-frequency signal line and method for producing base layer with...
- Patent number 9,627,734
- Issue date Apr 18, 2017
- Murata Manufacturing Co., Ltd.
- Noboru Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backdrill reliability anchors
- Patent number 9,560,742
- Issue date Jan 31, 2017
- Alcatel Lucent
- Paul J. Brown
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed wiring board, semiconductor package, and printed circuit board
- Patent number 9,192,044
- Issue date Nov 17, 2015
- Canon Kabushiki Kaisha
- Seiji Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 9,155,196
- Issue date Oct 6, 2015
- Ibiden Co., Ltd.
- Haruhiko Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Construction of reliable stacked via in electronic substrates—verti...
- Patent number 9,099,458
- Issue date Aug 4, 2015
- International Business Machines Corporation
- Karan Kacker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board
- Patent number 9,040,843
- Issue date May 26, 2015
- Ibiden Co., Ltd.
- Yukihiko Toyoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resonant elements designed vertically in a multilayer board and fil...
- Patent number 8,994,480
- Issue date Mar 31, 2015
- NEC Corporation
- Taras Kushta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radio frequency interconnect circuits and techniques
- Patent number 8,981,869
- Issue date Mar 17, 2015
- Raytheon Company
- Angelo M. Puzella
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Filter based on a combined via structure
- Patent number 8,970,327
- Issue date Mar 3, 2015
- NEC Corporation
- Taras Kushta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Construction of reliable stacked via in electronic substrates—verti...
- Patent number 8,866,026
- Issue date Oct 21, 2014
- International Business Machines Corporation
- Karan Kacker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and manufacturing method thereof
- Patent number 8,800,143
- Issue date Aug 12, 2014
- Ibiden Co., Ltd.
- Youhong Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Blind via capture pad structure fabrication method
- Patent number 8,671,565
- Issue date Mar 18, 2014
- Amkor Technology, Inc.
- Bob Shih-Wei Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240251504
- Publication date Jul 25, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED BOARD
- Publication number 20230232530
- Publication date Jul 20, 2023
- NIDEC SANKYO CORPORATION
- Junro TAKEUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20220418098
- Publication date Dec 29, 2022
- KYOCERA CORPORATION
- Hidetoshi YUGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ELEMENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, AND ELECT...
- Publication number 20220361333
- Publication date Nov 10, 2022
- KYOCERA CORPORATION
- Kanae HORIUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20220338347
- Publication date Oct 20, 2022
- IBIDEN CO., LTD.
- Takema ADACHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF MANUFACTURING CIRCUIT SUBSTRATE AND COMPONENT-MOUNTED SU...
- Publication number 20210084763
- Publication date Mar 18, 2021
- Nichia Corporation.
- Masaaki KATSUMATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC DEVICE WITH HIGH SCREEN RATIO
- Publication number 20200348733
- Publication date Nov 5, 2020
- ACER INCORPORATED
- Tai JU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200178392
- Publication date Jun 4, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Mi-Sun HWANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20190373727
- Publication date Dec 5, 2019
- NGK Spark Plug Co., Ltd.
- Takahiro HAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT TO MITIGATE CRACKING AT THROUGH-HOLES
- Publication number 20190297728
- Publication date Sep 26, 2019
- CommScope, Inc. of North Carolina
- Brian J. FITZPATRICK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR FREQUENCY SHIFTING RESONANCE OF AN UNUSED V...
- Publication number 20190041184
- Publication date Feb 7, 2019
- Dell Products L.P.
- Bhyrav M. Mutnury
- G01 - MEASURING TESTING
Information Patent Application
VIA AND SKIP VIA STRUCTURES
- Publication number 20190021176
- Publication date Jan 17, 2019
- GLOBALFOUNDRIES INC.
- Shao Beng Law
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INDUCTOR WITH EMBRACED CORNER CAPTURE PAD
- Publication number 20180315540
- Publication date Nov 1, 2018
- QUALCOMM Incorporated
- Daeik Daniel KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180242464
- Publication date Aug 23, 2018
- Denso Corporation
- Kenichiro HASEGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYERED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180070458
- Publication date Mar 8, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Seok-Hwan AHN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR FREQUENCY SHIFTING RESONANCE OF AN UNUSED V...
- Publication number 20150211837
- Publication date Jul 30, 2015
- Dell Products L.P.
- Bhyrav M. Mutnury
- G01 - MEASURING TESTING
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150014027
- Publication date Jan 15, 2015
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20140353022
- Publication date Dec 4, 2014
- IBIDEN CO., LTD.
- Haruhiko MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR FORMING A MICROVIA IN A PRINTED CIRCUIT BOARD
- Publication number 20140268610
- Publication date Sep 18, 2014
- Gregory HALVORSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR FREQUENCY SHIFTING RESONANCE OF AN UNUSED V...
- Publication number 20140238733
- Publication date Aug 28, 2014
- Dell Products L.P.
- Bhyrav M. Mutnury
- G01 - MEASURING TESTING
Information Patent Application
PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND PRINTED CIRCUIT BOARD
- Publication number 20130279134
- Publication date Oct 24, 2013
- Canon Kabushiki Kaisha
- Seiji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PRINTED WIRING BOARD
- Publication number 20130008701
- Publication date Jan 10, 2013
- IBIDEN CO., LTD.
- Yukihiko TOYODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONSTRUCTION OF RELIABLE STACKED VIA IN ELECTRONIC SUBSTRATES - VER...
- Publication number 20120299195
- Publication date Nov 29, 2012
- International Business Machines Corporation
- Karan Kacker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONSTRUCTION OF RELIABLE STACKED VIA IN ELECTRONIC SUBSTRATES - VER...
- Publication number 20120267158
- Publication date Oct 25, 2012
- International Business Machines Corporation
- Karan Kacker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURI...
- Publication number 20120256320
- Publication date Oct 11, 2012
- SHINKO ELECTRIC ELECTRIC INDUSTRIES CO., LTD.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120168220
- Publication date Jul 5, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Han Ul Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESONANT ELEMENTS DESIGNED VERTICALLY IN A MULTILAYER BOARD AND FIL...
- Publication number 20120119853
- Publication date May 17, 2012
- Taras Kushta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board and method of manufacturing the same
- Publication number 20120043128
- Publication date Feb 23, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Kyoung Ro Yoon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electromagnetic bandgap structure and printed circuit board
- Publication number 20110303452
- Publication date Dec 15, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Han Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND MANUFACTURING METHOD OF PRINTED WIRING BOARD
- Publication number 20110290544
- Publication date Dec 1, 2011
- IBIDEN CO., LTD.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Inner lands

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic element mounting substrate, electronic device, and elect...

Wiring substrate and method for manufacturing wiring substrate

Sn—Bi and copper powder conductive paste in through hole of insulat...

Electric device with high screen ratio

Inductor with embraced corner capture pad

Wiring board

Circuit substrate, component-mounted substrate, and methods of manu...

Printed circuit board and method of manufacturing the same

Flexible printed circuit to mitigate cracking at through-holes

Method for manufacturing flexible printed circuit board

Systems and methods for frequency shifting resonance of an unused v...

Via and skip via structures

Multilayered substrate and method for manufacturing the same

Flexible printed circuit board, printed circuit board structure and...

Method for impedance compensation in printed circuit boards

Systems and methods for frequency shifting resonance of an unused v...

Electronic component, method for manufacturing the electronic compo...

Method and apparatus for printed circuit board with stiffener

High-frequency signal line and method for producing base layer with...

Backdrill reliability anchors

Printed wiring board, semiconductor package, and printed circuit board

Wiring board

Construction of reliable stacked via in electronic substrates—verti...

Multilayer printed wiring board

Resonant elements designed vertically in a multilayer board and fil...

Radio frequency interconnect circuits and techniques

Filter based on a combined via structure

Construction of reliable stacked via in electronic substrates—verti...

Multilayer printed wiring board and manufacturing method thereof

Blind via capture pad structure fabrication method

Patents Applicationslast 30 patents

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

PRINTED BOARD

WIRING BOARD

ELECTRONIC ELEMENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, AND ELECT...

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

METHODS OF MANUFACTURING CIRCUIT SUBSTRATE AND COMPONENT-MOUNTED SU...

ELECTRIC DEVICE WITH HIGH SCREEN RATIO

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

WIRING BOARD

FLEXIBLE PRINTED CIRCUIT TO MITIGATE CRACKING AT THROUGH-HOLES

SYSTEMS AND METHODS FOR FREQUENCY SHIFTING RESONANCE OF AN UNUSED V...

VIA AND SKIP VIA STRUCTURES

INDUCTOR WITH EMBRACED CORNER CAPTURE PAD

MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

MULTI-LAYERED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

SYSTEMS AND METHODS FOR FREQUENCY SHIFTING RESONANCE OF AN UNUSED V...

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD

METHOD AND SYSTEM FOR FORMING A MICROVIA IN A PRINTED CIRCUIT BOARD

SYSTEMS AND METHODS FOR FREQUENCY SHIFTING RESONANCE OF AN UNUSED V...

PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND PRINTED CIRCUIT BOARD

MULTILAYER PRINTED WIRING BOARD

CONSTRUCTION OF RELIABLE STACKED VIA IN ELECTRONIC SUBSTRATES - VER...

CONSTRUCTION OF RELIABLE STACKED VIA IN ELECTRONIC SUBSTRATES - VER...

WIRING BOARD MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURI...

MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

RESONANT ELEMENTS DESIGNED VERTICALLY IN A MULTILAYER BOARD AND FIL...

Printed circuit board and method of manufacturing the same

Electromagnetic bandgap structure and printed circuit board

PRINTED WIRING BOARD AND MANUFACTURING METHOD OF PRINTED WIRING BOARD