Inorganic, non-metallic layer

Industry

CPC
H05K2201/0175

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0175Inorganic, non-metallic layer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Low dielectric substrate for high-speed millimeter-wave communication
- Patent number 11,974,389
- Issue date Apr 30, 2024
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shear wave methods, systems, and gyroscope
- Patent number 11,898,844
- Issue date Feb 13, 2024
- Cornell University
- Amit Lal
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package and semiconductor device
- Patent number 11,837,554
- Issue date Dec 5, 2023
- Kioxia Corporation
- Ryujiro Bando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive board
- Patent number 11,778,739
- Issue date Oct 3, 2023
- Polytronics Technology Corp.
- Kuo Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered diamond-like carbon coating for electronic components
- Patent number 11,729,909
- Issue date Aug 15, 2023
- Honeywell Federal Manufacturing & Technologies, LLC
- Thomas Matthew Selter
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing method of carrier structure
- Patent number 11,690,180
- Issue date Jun 27, 2023
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low dielectric substrate for high-speed millimeter-wave communication
- Patent number 11,678,432
- Issue date Jun 13, 2023
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera module having a soldering portion coupling a driving device...
- Patent number 11,671,690
- Issue date Jun 6, 2023
- LG Innotek Co., Ltd
- Jong Ho Chung
- G02 - OPTICS
Information Patent Grant
Ceramic copper circuit board and method for manufacturing the same
- Patent number 11,653,447
- Issue date May 16, 2023
- Kabushiki Kaisha Toshiba
- Hiromasa Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Passive component adapter for downhole application
- Patent number 11,523,513
- Issue date Dec 6, 2022
- Schlumberger Technology Corporation
- Swapna Arun Kumar
- E21 - EARTH DRILLING MINING
Information Patent Grant
Ceramic and polymer composite, methods of making, and uses thereof
- Patent number 11,490,510
- Issue date Nov 1, 2022
- Corning Incorporated
- Weiguo Miao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bus bar connection and coating technology
- Patent number 11,454,440
- Issue date Sep 27, 2022
- Cardinal CG Company
- Kari B. Myli
- E06 - DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL LADDERS
Information Patent Grant
Electronic component
- Patent number 11,357,110
- Issue date Jun 7, 2022
- TDK Corporation
- Takeshi Oohashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic wiring board and method for producing the same
- Patent number 11,350,523
- Issue date May 31, 2022
- Murata Manufacturing Co., Ltd.
- Takahiro Sumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera module having a reinforcing portion coupling a surface of a...
- Patent number 11,303,787
- Issue date Apr 12, 2022
- LG Innotek Co., Ltd
- Jong Ho Chung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Ceramic copper circuit board and method for manufacturing the same
- Patent number 11,277,911
- Issue date Mar 15, 2022
- Kabushiki Kaisha Toshiba
- Hiromasa Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modulated inductance module
- Patent number 11,201,007
- Issue date Dec 14, 2021
- L. Pierre de Rochemont
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Colored thin covering film and manufacturing method
- Patent number 11,116,074
- Issue date Sep 7, 2021
- ASIA ELECTRONIC MATERIAL CO., LTD.
- Wei-Chih Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,039,533
- Issue date Jun 15, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroaki Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass-free dielectric layers for printed circuit boards
- Patent number 10,982,060
- Issue date Apr 20, 2021
- International Business Machines Corporation
- Joseph Kuczynski
- B32 - LAYERED PRODUCTS
Information Patent Grant
Flexible display device
- Patent number 10,962,814
- Issue date Mar 30, 2021
- SAMSUNG DISPLAY CO., LTD.
- Jun Namkung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module having a soldering portion coupling a driving device...
- Patent number 10,958,813
- Issue date Mar 23, 2021
- LG Innotek Co., Ltd
- Jong Ho Chung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Flame retardant structure for component carrier
- Patent number 10,939,563
- Issue date Mar 2, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jonathan Silvano De Sousa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier structure and manufacturing method thereof
- Patent number 10,925,172
- Issue date Feb 16, 2021
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, method for manufacturing circuit board, and electron...
- Patent number 10,896,871
- Issue date Jan 19, 2021
- Fujitsu Limited
- Tomoyuki Akahoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate
- Patent number 10,856,412
- Issue date Dec 1, 2020
- TDK ELECTRONICS AG
- Thomas Feichtinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, electronic device, and wiring board manufacturing method
- Patent number 10,770,386
- Issue date Sep 8, 2020
- FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
- Toshiki Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, electronic device, and wiring board manufacturing method
- Patent number 10,734,316
- Issue date Aug 4, 2020
- FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
- Toshiki Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filter circuit, multiplexer, and module
- Patent number 10,700,666
- Issue date Jun 30, 2020
- Taiyo Yuden Co., Ltd.
- Sachiko Tanaka
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Surface-treated copper foil, method for producing same, copper-clad...
- Patent number 10,645,809
- Issue date May 5, 2020
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...
- Publication number 20240064907
- Publication date Feb 22, 2024
- FICT LIMITED
- Taiji Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF PRODUCTION THEREFOR
- Publication number 20240064895
- Publication date Feb 22, 2024
- DENKA COMPANY LIMITED
- Kenji MIYATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20240040694
- Publication date Feb 1, 2024
- Murata Manufacturing Co., Ltd.
- Tomoki YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYERED DIAMOND-LIKE CARBON COATING FOR ELECTRONIC COMPONENTS
- Publication number 20230309213
- Publication date Sep 28, 2023
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Thomas Matthew Selter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20230309217
- Publication date Sep 28, 2023
- TORAY INDUSTRIES, INC.
- Ryutaro IKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW DIELECTRIC SUBSTRATE FOR HIGH-SPEED MILLIMETER-WAVE COMMUNICATION
- Publication number 20230247759
- Publication date Aug 3, 2023
- Shin-Etsu Chemical Co., Ltd.
- Toshio SHIOBARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20230071257
- Publication date Mar 9, 2023
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYERED DIAMOND-LIKE CARBON COATING FOR ELECTRONIC COMPONENTS
- Publication number 20230025748
- Publication date Jan 26, 2023
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Thomas Matthew Selter
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD
- Publication number 20230022285
- Publication date Jan 26, 2023
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED SHEET FOR METAL-CLAD LAMINATE, METHOD OF MANUFACTURING LA...
- Publication number 20230013404
- Publication date Jan 19, 2023
- FUJIFILM CORPORATION
- Takahiko ICHIKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PACKAGING STRUCTURE FOR CIRCUIT UNITS
- Publication number 20220408549
- Publication date Dec 22, 2022
- WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
- Haisheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW DIELECTRIC SUBSTRATE FOR HIGH-SPEED MILLIMETER-WAVE COMMUNICATION
- Publication number 20220248526
- Publication date Aug 4, 2022
- Shin-Etsu Chemical Co., Ltd.
- Toshio SHIOBARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY CONDUCTIVE BOARD
- Publication number 20220201856
- Publication date Jun 23, 2022
- POLYTRONICS TECHNOLOGY CORP.
- KUO HSUN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE AND METHOD OF MANUFACTURING MULTILAYER SUBSTRATE
- Publication number 20220141965
- Publication date May 5, 2022
- Murata Manufacturing Co., Ltd.
- Yusuke KAMITSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ceramic Copper Circuit Board And Method For Manufacturing The Same
- Publication number 20220104350
- Publication date Mar 31, 2022
- Kabushiki Kaisha Toshiba
- Hiromasa KATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ceramic Copper Circuit Board And Method For Manufacturing The Same
- Publication number 20220104351
- Publication date Mar 31, 2022
- Kabushiki Kaisha Toshiba
- Hiromasa KATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHEAR WAVE METHODS, SYSTEMS, AND GYROSCOPE
- Publication number 20210293541
- Publication date Sep 23, 2021
- Cornell University
- Amit Lal
- G01 - MEASURING TESTING
Information Patent Application
LAMINATED SHEET
- Publication number 20210259111
- Publication date Aug 19, 2021
- Nitto Denko Corporation
- Keisuke OKUMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20210204406
- Publication date Jul 1, 2021
- TDK Corporation
- Takeshi OOHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CARRIER STRUCTURE
- Publication number 20210136931
- Publication date May 6, 2021
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PASSIVE COMPONENT ADAPTER FOR DOWNHOLE APPLICATION
- Publication number 20210112663
- Publication date Apr 15, 2021
- SCHLUMBERGER TECHNOLOGY CORPORATION
- Swapna Arun Kumar
- E21 - EARTH DRILLING MINING
Information Patent Application
CERAMIC COPPER CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210068253
- Publication date Mar 4, 2021
- Kabushiki Kaisha Toshiba
- Hiromasa KATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate
- Publication number 20200296829
- Publication date Sep 17, 2020
- TDK Electronics AG
- Thomas Feichtinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20200205286
- Publication date Jun 25, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- Hiroaki TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGHLY CONDUCTIVE TRANSPARENT GLASS-BASED CIRCUIT BOARD
- Publication number 20190327839
- Publication date Oct 24, 2019
- WUHAN HUASHANG GREEN TECHNOLOGY CO., LTD.
- Lianjia LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS-FREE DIELECTRIC LAYERS FOR PRINTED CIRCUIT BOARDS
- Publication number 20190248970
- Publication date Aug 15, 2019
- International Business Machines Corporation
- JOSEPH KUCZYNSKI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Flame Retardant Structure For Component Carrier
- Publication number 20190223298
- Publication date Jul 18, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jonathan Silvano De Sousa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD WITH A SUBSTRATE MADE OF SILICON
- Publication number 20190191556
- Publication date Jun 20, 2019
- WEN YAO CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20190191572
- Publication date Jun 20, 2019
- Shinko Electric Industries Co., Ltd.
- Yuji KUNIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC ELECTRONIC COMPONENT
- Publication number 20190166690
- Publication date May 30, 2019
- MURATA MANUFACTURING CO., LTD.
- Issei YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Inorganic, non-metallic layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low dielectric substrate for high-speed millimeter-wave communication

Shear wave methods, systems, and gyroscope

Semiconductor package and semiconductor device

Thermally conductive board

Multi-layered diamond-like carbon coating for electronic components

Manufacturing method of carrier structure

Low dielectric substrate for high-speed millimeter-wave communication

Camera module having a soldering portion coupling a driving device...

Ceramic copper circuit board and method for manufacturing the same

Passive component adapter for downhole application

Ceramic and polymer composite, methods of making, and uses thereof

Bus bar connection and coating technology

Electronic component

Ceramic wiring board and method for producing the same

Camera module having a reinforcing portion coupling a surface of a...

Ceramic copper circuit board and method for manufacturing the same

Modulated inductance module

Colored thin covering film and manufacturing method

Printed wiring board and method for manufacturing printed wiring board

Glass-free dielectric layers for printed circuit boards

Flexible display device

Camera module having a soldering portion coupling a driving device...

Flame retardant structure for component carrier

Carrier structure and manufacturing method thereof

Circuit board, method for manufacturing circuit board, and electron...

Substrate

Wiring board, electronic device, and wiring board manufacturing method

Wiring board, electronic device, and wiring board manufacturing method

Filter circuit, multiplexer, and module

Surface-treated copper foil, method for producing same, copper-clad...

Patents Applicationslast 30 patents

CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...

CIRCUIT BOARD AND METHOD OF PRODUCTION THEREFOR

WIRING BOARD

MULTI-LAYERED DIAMOND-LIKE CARBON COATING FOR ELECTRONIC COMPONENTS

WIRING BOARD

LOW DIELECTRIC SUBSTRATE FOR HIGH-SPEED MILLIMETER-WAVE COMMUNICATION

PRINTED WIRING BOARD

MULTI-LAYERED DIAMOND-LIKE CARBON COATING FOR ELECTRONIC COMPONENTS

COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD

LAMINATED SHEET FOR METAL-CLAD LAMINATE, METHOD OF MANUFACTURING LA...

PACKAGING STRUCTURE FOR CIRCUIT UNITS

LOW DIELECTRIC SUBSTRATE FOR HIGH-SPEED MILLIMETER-WAVE COMMUNICATION

THERMALLY CONDUCTIVE BOARD

MULTILAYER SUBSTRATE AND METHOD OF MANUFACTURING MULTILAYER SUBSTRATE

Ceramic Copper Circuit Board And Method For Manufacturing The Same

Ceramic Copper Circuit Board And Method For Manufacturing The Same

SHEAR WAVE METHODS, SYSTEMS, AND GYROSCOPE

LAMINATED SHEET

ELECTRONIC COMPONENT

MANUFACTURING METHOD OF CARRIER STRUCTURE

PASSIVE COMPONENT ADAPTER FOR DOWNHOLE APPLICATION

CERAMIC COPPER CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

Substrate

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

HIGHLY CONDUCTIVE TRANSPARENT GLASS-BASED CIRCUIT BOARD

GLASS-FREE DIELECTRIC LAYERS FOR PRINTED CIRCUIT BOARDS

Flame Retardant Structure For Component Carrier

CIRCUIT BOARD WITH A SUBSTRATE MADE OF SILICON

WIRING BOARD

CERAMIC ELECTRONIC COMPONENT