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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 10,978,414
- Issue date Apr 13, 2021
- ABLIC INC.
- Shinjiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 10,607,954
- Issue date Mar 31, 2020
- ABLIC INC.
- Shinjiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 10,297,562
- Issue date May 21, 2019
- ABLIC INC.
- Kaku Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure-activated electrical interconnection by micro-transfer pri...
- Patent number 10,163,735
- Issue date Dec 25, 2018
- X-CELEPRINT LIMITED
- Christopher Andrew Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure-activated electrical interconnection by micro-transfer pri...
- Patent number 10,103,069
- Issue date Oct 16, 2018
- X-CELEPRINT LIMITED
- Christopher Andrew Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,570,412
- Issue date Feb 14, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshimasa Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with improved redistribution layer design and...
- Patent number 9,293,403
- Issue date Mar 22, 2016
- Amkor Technology, Inc.
- No Sun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a structure for microelectronic device assembly
- Patent number 9,241,403
- Issue date Jan 19, 2016
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Gabriel Pares
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of arranging microspheres with liquid, microsphere arranging...
- Patent number 7,119,438
- Issue date Oct 10, 2006
- NEC Corporation
- Ichiro Hazeyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20200185343
- Publication date Jun 11, 2020
- ABLIC Inc.
- Shinjiro KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A STRUCTURE FOR MICROELECTRONIC DEVICE ASSEMBLY
- Publication number 20140144690
- Publication date May 29, 2014
- COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE. ALT.
- Gabriel Pares
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH IMPROVED REDISTRIBUTION LAYER DESIGN AND...
- Publication number 20140061900
- Publication date Mar 6, 2014
- No Sun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of arranging micro spheres with liquid, micro sphere arrangi...
- Publication number 20050040528
- Publication date Feb 24, 2005
- Ichiro Hazeyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

inside the bonding area

Industry

Parent Industries

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Patents Grantslast 30 patents

Semiconductor device and method of manufacturing a semiconductor de...

Semiconductor device and method of manufacturing a semiconductor de...

Semiconductor device and method of manufacturing a semiconductor de...

Pressure-activated electrical interconnection by micro-transfer pri...

Pressure-activated electrical interconnection by micro-transfer pri...

Semiconductor device

Semiconductor package with improved redistribution layer design and...

Method for producing a structure for microelectronic device assembly

Method of arranging microspheres with liquid, microsphere arranging...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

METHOD FOR PRODUCING A STRUCTURE FOR MICROELECTRONIC DEVICE ASSEMBLY

SEMICONDUCTOR PACKAGE WITH IMPROVED REDISTRIBUTION LAYER DESIGN AND...

Method of arranging micro spheres with liquid, micro sphere arrangi...