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  • H01L2224/78306
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/78306inside the capillary
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Patents Grantslast 30 patents

  • Information Patent Grant

    Electronic device
    • Patent number 10,903,129
    • Issue date Jan 26, 2021
    • Rohm Co., Ltd.
    • Motoharu Haga
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Curtain airbag device mounting structure and curtain airbag deploym...
    • Patent number 10,723,306
    • Issue date Jul 28, 2020
    • Toyota Jidosha Kabushiki Kaisha
    • Takamichi Komura
    • B22 - CASTING POWDER METALLURGY
  • Information Patent Grant

    Electronic device
    • Patent number 10,332,815
    • Issue date Jun 25, 2019
    • Rohm Co., Ltd.
    • Motoharu Haga
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic device
    • Patent number 9,698,068
    • Issue date Jul 4, 2017
    • Rohm Co., Ltd.
    • Motoharu Haga
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Concave face wire bond capillary and method
    • Patent number 7,677,429
    • Issue date Mar 16, 2010
    • Micron Technology, Inc.
    • Gregory M. Chapman
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Concave face wire bond capillary and method
    • Patent number 7,416,107
    • Issue date Aug 26, 2008
    • Micron Technology, Inc.
    • Gregory M. Chapman
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding simulation
    • Patent number 7,085,699
    • Issue date Aug 1, 2006
    • Texas Instruments Incorporated
    • Manjula N. Variyam
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Concave face wire bond capillary and method
    • Patent number 6,966,480
    • Issue date Nov 22, 2005
    • Micron Technology, Inc.
    • Gregory M. Chapman
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Concave face wire bond capillary and method
    • Patent number 6,595,406
    • Issue date Jul 22, 2003
    • Micron Technology, Inc.
    • Gregory M. Chapman
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Concave face wire bond capillary
    • Patent number 6,439,450
    • Issue date Aug 27, 2002
    • Micron Technology, Inc.
    • Gregory M. Chapman
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Concave face wire bond capillary
    • Patent number 6,311,890
    • Issue date Nov 6, 2001
    • Micron Technology, Inc.
    • Gregory M. Chapman
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bond pad sealing using wire bonding
    • Patent number 6,278,191
    • Issue date Aug 21, 2001
    • National Semiconductor Corporation
    • Inderjit Singh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Concave face wire bond capillary
    • Patent number 6,158,647
    • Issue date Dec 12, 2000
    • Micron Technology, Inc.
    • Gregory M. Chapman
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding means and method
    • Patent number 4,415,115
    • Issue date Nov 15, 1983
    • Motorola, Inc.
    • Kristi L. James
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    WIRE BONDING CAPILLARY
    • Publication number 20230311239
    • Publication date Oct 5, 2023
    • CRAFTSTECH, INC.
    • Jeffrey C. Roberts
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20170271225
    • Publication date Sep 21, 2017
    • ROHM CO., LTD.
    • Motoharu HAGA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE
    • Publication number 20110058979
    • Publication date Mar 10, 2011
    • TANAKA DENSHI KOGYO K.K.
    • Hiroshi Murai
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CONCAVE FACE WIRE BOND CAPILLARY AND METHOD
    • Publication number 20080302862
    • Publication date Dec 11, 2008
    • Micron Technology, Inc.
    • Gregory M. Chapman
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRE BOND AND METHOD OF FORMING SAME
    • Publication number 20080116548
    • Publication date May 22, 2008
    • FREESCALE SEMICONDUCTOR, INC.
    • Zhe Li
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Concave face wire bond capillary and method
    • Publication number 20060032888
    • Publication date Feb 16, 2006
    • Gregory M. Chapman
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wire bonding simulation
    • Publication number 20050133566
    • Publication date Jun 23, 2005
    • Manjula N. Variyam
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Concave face wire bond capillary and method
    • Publication number 20040056072
    • Publication date Mar 25, 2004
    • Gregory M. Chapman
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Concave face wire bond capillary
    • Publication number 20020134819
    • Publication date Sep 26, 2002
    • Gregory M. Chapman
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Concave face wire bond capillary
    • Publication number 20020023943
    • Publication date Feb 28, 2002
    • Gregory M. Chapman
    • H01 - BASIC ELECTRIC ELEMENTS