Inspection Monitoring Aligning

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CPC
H05K2203/16

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/16Inspection Monitoring Aligning

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing an electronic device
- Patent number 12,193,167
- Issue date Jan 7, 2025
- INNOLUX CORPORATION
- Kai Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitive compensation for vertical interconnect accesses
- Patent number 12,185,462
- Issue date Dec 31, 2024
- Achronix Semiconductor Corporation
- Hansel Desmond Dsilva
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and apparatus for flexible circuit cable attachment
- Patent number 12,185,476
- Issue date Dec 31, 2024
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods, systems, and computer program products for determining a p...
- Patent number 12,181,459
- Issue date Dec 31, 2024
- Troxler Electronic Laboratories INC.
- Robert Ernest Troxler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED circuit board structure and LED testing and packaging method
- Patent number 12,150,242
- Issue date Nov 19, 2024
- Ingentec Corporation
- Yi-Chuan Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded system module thermal installation verification
- Patent number 12,144,118
- Issue date Nov 12, 2024
- L3HARRIS TECHNOLOGIES, INC.
- Craig K. Lyon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for detecting and adjusting poor back drills in printed circ...
- Patent number 12,135,347
- Issue date Nov 5, 2024
- R&D Circuits
- Michael Caprio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interface assembly and method for manufacturing interface assembly
- Patent number 12,137,523
- Issue date Nov 5, 2024
- TACTOTEK OY
- Mikko Heikkinen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Barrier for preventing SMD components from drifting
- Patent number 12,127,350
- Issue date Oct 22, 2024
- ZKW GROUP GMBH
- Christoph Haiden
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible jumper with a mounting frame
- Patent number 12,120,821
- Issue date Oct 15, 2024
- Ennovi Industries, Inc.
- Richard Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 12,101,890
- Issue date Sep 24, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Myung Ju Gi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interface assembly and method for manufacturing interface assembly
- Patent number 12,096,562
- Issue date Sep 17, 2024
- TACTOTEK OY
- Mikko Heikkinen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of assessing ink deposition accuracy in an electronic device...
- Patent number 12,096,567
- Issue date Sep 17, 2024
- SOCOVAR SOCIÉTÉ EN COMMANDITE
- François Blanchard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of electronic device
- Patent number 12,089,345
- Issue date Sep 10, 2024
- INNOLUX CORPORATION
- Yi-Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for soldering an electronic component to a circuit board by...
- Patent number 12,028,987
- Issue date Jul 2, 2024
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Guided transport path correction
- Patent number 12,028,991
- Issue date Jul 2, 2024
- Kateeva, Inc.
- Eliyahu Vronsky
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Printed circuit board (PCB) and method of making the same
- Patent number 12,016,129
- Issue date Jun 18, 2024
- ZF CV Systems Europe BV
- Marcin Calka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interface assembly and method for manufacturing interface assembly
- Patent number 12,004,299
- Issue date Jun 4, 2024
- TACTOTEK OY
- Mikko Heikkinen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Systems for coating a substrate
- Patent number 12,004,303
- Issue date Jun 4, 2024
- Nordson Corporation
- Michel Van De Vijver
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Package substrate and method for manufacturing the same
- Patent number 11,997,798
- Issue date May 28, 2024
- Advanced Semiconductor Engineering, Inc.
- Wu Chou Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 11,991,836
- Issue date May 21, 2024
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and method of mounting integrated circuit using the...
- Patent number 11,967,597
- Issue date Apr 23, 2024
- Samsung Display Co., Ltd.
- Dae Geun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking arrays and separator bodies during processing of component...
- Patent number 11,943,874
- Issue date Mar 26, 2024
- AT&S (Chongqing) Company Limited
- Amin Nickkolgh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Automatically controlling a liquid spray pattern
- Patent number 11,938,498
- Issue date Mar 26, 2024
- Precision Valve & Automation, Inc.
- Jason Schoen
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Traceability of subsequent layer structure manufacturing of main bo...
- Patent number 11,937,369
- Issue date Mar 19, 2024
- AT&S(China) Co. Ltd.
- Seok Kim Tay
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board and component fabrication apparatus
- Patent number 11,919,227
- Issue date Mar 5, 2024
- DST INNOVATIONS, LTD.
- Anthony Miles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of interconnecting printed circuit boards
- Patent number 11,901,654
- Issue date Feb 13, 2024
- Amphenol Corporation
- Michael A. Hoyack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, electric device including the same
- Patent number 11,877,485
- Issue date Jan 16, 2024
- Samsung Display Co., Ltd.
- Chung-seok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Feature casting for manufacture observation
- Patent number 11,872,729
- Issue date Jan 16, 2024
- International Business Machines Corporation
- Sarah K. Czaplewski
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND MECHANISMS FOR MAINTAINING AN ELECTRO-ACTIVE POLYMER IN...
- Publication number 20250016932
- Publication date Jan 9, 2025
- ElastiMed Ltd.
- Omer Zelka
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
BOARD INSPECTION DEVICE AND BOARD INSPECTION METHOD
- Publication number 20240414905
- Publication date Dec 12, 2024
- CKD CORPORATION
- Kazuyoshi Kikuchi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20240414849
- Publication date Dec 12, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Myung Ju GI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD FOR A REFLOW PROFILING PROCESS
- Publication number 20240414851
- Publication date Dec 12, 2024
- Western Digital Technologies, Inc.
- Uthayarajan A/L Rasalingam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240381540
- Publication date Nov 14, 2024
- Innolux Corporation
- Yi-Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY
- Publication number 20240373559
- Publication date Nov 7, 2024
- TactoTek Oy
- Mikko HEIKKINEN
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method for Soldering an Electronic Component to a Circuit Board by...
- Publication number 20240373563
- Publication date Nov 7, 2024
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAME
- Publication number 20240365475
- Publication date Oct 31, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Do Jae YOO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier and Method Manufacturing the Same
- Publication number 20240334613
- Publication date Oct 3, 2024
- AT&S (Chongqing) Company Limited
- JyunMin WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BGA Element Self-Alignment Structure and Alignment Method
- Publication number 20240334592
- Publication date Oct 3, 2024
- SHENZHEN SIPTORY TECHNOLOGY CO., LTD
- Dongdong Shao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GUIDED TRANSPORT PATH CORRECTION
- Publication number 20240314941
- Publication date Sep 19, 2024
- Kateeva, Inc.
- Eliyahu Vronsky
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Method For Manufacturing Electrical Devices
- Publication number 20240282517
- Publication date Aug 22, 2024
- Hutchinson Technology Incorporated
- Collin M. Grove
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY
- Publication number 20240284598
- Publication date Aug 22, 2024
- TactoTek Oy
- Mikko HEIKKINEN
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PRINTED CIRCUIT BOARD ARRANGEMENT
- Publication number 20240268028
- Publication date Aug 8, 2024
- HARTING ELECTRONICS GMBH
- Marc GENAU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EQUIPMENT AUTOMATIC ALIGNMENT METHOD AND PROCESS ROBOT DEVICE USING...
- Publication number 20240260198
- Publication date Aug 1, 2024
- United Microelectronics Corp.
- Zheng-Yang LI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE...
- Publication number 20240234443
- Publication date Jul 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- Dae Geun LEE
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
DEVICE FOR PRODUCING MULTI-LAYER CIRCUIT BOARDS AND USE THEREOF IN...
- Publication number 20240224433
- Publication date Jul 4, 2024
- Ulrich Rotte Anlagenbau und Foerdertechnik GmbH
- Ulrich ROTTE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING MULTI-LAYER CIRCUIT BOARDS
- Publication number 20240224434
- Publication date Jul 4, 2024
- Ulrich Rotte Anlagenbau und Foerdertechnik GmbH
- Ulrich ROTTE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS METHOD FOR LASER REMOVAL OF SUBSTRATE SOLDER MASK
- Publication number 20240196544
- Publication date Jun 13, 2024
- Trillion Harvest Limited
- Pei-Chung PANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...
- Publication number 20240188224
- Publication date Jun 6, 2024
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR PRODUCING CIRCUIT BOARDS WITH PERFORATED SHAP...
- Publication number 20240164023
- Publication date May 16, 2024
- JUMATECH GMBH
- Markus WÖLFEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240164026
- Publication date May 16, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jung Soo KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL SYSTEM FOR MEASURING THE DEPTH OF AN INNER LAYER OF A PRINT...
- Publication number 20240159517
- Publication date May 16, 2024
- NANJING TALIANG TECHNOLOGY CO., LTD.
- Chen-Chi CHIEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240121889
- Publication date Apr 11, 2024
- Innolux Corporation
- Chi-Liang Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR ADDITIVE MANUFACTURING ELECTRONICS AND A PRINTING SUPPOR...
- Publication number 20240107681
- Publication date Mar 28, 2024
- HENSOLDT Sensors GmbH
- Jörg Sander
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAME
- Publication number 20240074065
- Publication date Feb 29, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Do Jae YOO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL FEED CONNECTOR SYSTEM AND METHOD FOR LIGHT EMITTING DIOD...
- Publication number 20240072461
- Publication date Feb 29, 2024
- LuxTech, LLC
- Brad KOERNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Board Assembly with Interposer Circuit Board and Correspond...
- Publication number 20240064899
- Publication date Feb 22, 2024
- Motorola Mobility LLC
- Wayne G Morrison
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
- Publication number 20240057264
- Publication date Feb 15, 2024
- Innolux Corporation
- Kai Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARRIER STRUCTURE
- Publication number 20240049382
- Publication date Feb 8, 2024
- Siliconware Precision Industries Co., Ltd.
- Chin-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Inspection Monitoring Aligning

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing an electronic device

Capacitive compensation for vertical interconnect accesses

Method and apparatus for flexible circuit cable attachment

Methods, systems, and computer program products for determining a p...

LED circuit board structure and LED testing and packaging method

Embedded system module thermal installation verification

Method for detecting and adjusting poor back drills in printed circ...

Interface assembly and method for manufacturing interface assembly

Hermetic metallized via with improved reliability

Barrier for preventing SMD components from drifting

Flexible jumper with a mounting frame

Method of manufacturing printed circuit board

Interface assembly and method for manufacturing interface assembly

Method of assessing ink deposition accuracy in an electronic device...

Manufacturing method of electronic device

Method for soldering an electronic component to a circuit board by...

Guided transport path correction

Printed circuit board (PCB) and method of making the same

Interface assembly and method for manufacturing interface assembly

Systems for coating a substrate

Package substrate and method for manufacturing the same

Electrical devices with electrodes on softening polymers and method...

Array substrate and method of mounting integrated circuit using the...

Stacking arrays and separator bodies during processing of component...

Automatically controlling a liquid spray pattern

Traceability of subsequent layer structure manufacturing of main bo...

Circuit board and component fabrication apparatus

Method of interconnecting printed circuit boards

Electronic component, electric device including the same

Feature casting for manufacture observation

Patents Applicationslast 30 patents

METHODS AND MECHANISMS FOR MAINTAINING AN ELECTRO-ACTIVE POLYMER IN...

BOARD INSPECTION DEVICE AND BOARD INSPECTION METHOD

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD FOR A REFLOW PROFILING PROCESS

MANUFACTURING METHOD OF ELECTRONIC DEVICE

INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY

Method for Soldering an Electronic Component to a Circuit Board by...

REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAME

Component Carrier and Method Manufacturing the Same

BGA Element Self-Alignment Structure and Alignment Method

GUIDED TRANSPORT PATH CORRECTION

Method For Manufacturing Electrical Devices

INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY

PRINTED CIRCUIT BOARD ARRANGEMENT

EQUIPMENT AUTOMATIC ALIGNMENT METHOD AND PROCESS ROBOT DEVICE USING...

ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE...

DEVICE FOR PRODUCING MULTI-LAYER CIRCUIT BOARDS AND USE THEREOF IN...

METHOD FOR PRODUCING MULTI-LAYER CIRCUIT BOARDS

PROCESS METHOD FOR LASER REMOVAL OF SUBSTRATE SOLDER MASK

ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...

METHOD AND SYSTEM FOR PRODUCING CIRCUIT BOARDS WITH PERFORATED SHAP...

PRINTED CIRCUIT BOARD

OPTICAL SYSTEM FOR MEASURING THE DEPTH OF AN INNER LAYER OF A PRINT...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

METHOD FOR ADDITIVE MANUFACTURING ELECTRONICS AND A PRINTING SUPPOR...

REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAME

ELECTRICAL FEED CONNECTOR SYSTEM AND METHOD FOR LIGHT EMITTING DIOD...

Circuit Board Assembly with Interposer Circuit Board and Correspond...

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE

CARRIER STRUCTURE