Inspection Monitoring Aligning

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CPC
H05K2203/16

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/16Inspection Monitoring Aligning

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package geometries to enable visual inspection of solder fillets
- Patent number 12,354,918
- Issue date Jul 8, 2025
- Texas Instruments Incorporated
- LongTing Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for soldering an electronic component to a circuit board by...
- Patent number 12,349,287
- Issue date Jul 1, 2025
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board assembly with interposer circuit board and correspond...
- Patent number 12,284,760
- Issue date Apr 22, 2025
- Motorola Mobility LLC
- Wayne G Morrison
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inverter insulator apparatus and method
- Patent number 12,273,044
- Issue date Apr 8, 2025
- Rivian IP Holdings, LLC
- Young Mok Doo
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Reprint apparatus for circuit board and reprint method using the same
- Patent number 12,262,477
- Issue date Mar 25, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Do Jae Yoo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 12,262,481
- Issue date Mar 25, 2025
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembly of battery pack with compact shared PCM
- Patent number 12,243,987
- Issue date Mar 4, 2025
- Snap Inc.
- John Bernard Ardisana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for manufacturing composite board
- Patent number 12,219,715
- Issue date Feb 4, 2025
- Doosan Corporation
- Sungmoon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier structure
- Patent number 12,219,693
- Issue date Feb 4, 2025
- Siliconware Precision Industries Co., Ltd.
- Chin-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device
- Patent number 12,193,167
- Issue date Jan 7, 2025
- INNOLUX CORPORATION
- Kai Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitive compensation for vertical interconnect accesses
- Patent number 12,185,462
- Issue date Dec 31, 2024
- Achronix Semiconductor Corporation
- Hansel Desmond Dsilva
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and apparatus for flexible circuit cable attachment
- Patent number 12,185,476
- Issue date Dec 31, 2024
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods, systems, and computer program products for determining a p...
- Patent number 12,181,459
- Issue date Dec 31, 2024
- Troxler Electronic Laboratories INC.
- Robert Ernest Troxler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED circuit board structure and LED testing and packaging method
- Patent number 12,150,242
- Issue date Nov 19, 2024
- Ingentec Corporation
- Yi-Chuan Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded system module thermal installation verification
- Patent number 12,144,118
- Issue date Nov 12, 2024
- L3HARRIS TECHNOLOGIES, INC.
- Craig K. Lyon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for detecting and adjusting poor back drills in printed circ...
- Patent number 12,135,347
- Issue date Nov 5, 2024
- R&D Circuits
- Michael Caprio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interface assembly and method for manufacturing interface assembly
- Patent number 12,137,523
- Issue date Nov 5, 2024
- TACTOTEK OY
- Mikko Heikkinen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Barrier for preventing SMD components from drifting
- Patent number 12,127,350
- Issue date Oct 22, 2024
- ZKW GROUP GMBH
- Christoph Haiden
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible jumper with a mounting frame
- Patent number 12,120,821
- Issue date Oct 15, 2024
- Ennovi Industries, Inc.
- Richard Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 12,101,890
- Issue date Sep 24, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Myung Ju Gi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interface assembly and method for manufacturing interface assembly
- Patent number 12,096,562
- Issue date Sep 17, 2024
- TACTOTEK OY
- Mikko Heikkinen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of assessing ink deposition accuracy in an electronic device...
- Patent number 12,096,567
- Issue date Sep 17, 2024
- SOCOVAR SOCIÉTÉ EN COMMANDITE
- François Blanchard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of electronic device
- Patent number 12,089,345
- Issue date Sep 10, 2024
- INNOLUX CORPORATION
- Yi-Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for soldering an electronic component to a circuit board by...
- Patent number 12,028,987
- Issue date Jul 2, 2024
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Guided transport path correction
- Patent number 12,028,991
- Issue date Jul 2, 2024
- Kateeva, Inc.
- Eliyahu Vronsky
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Printed circuit board (PCB) and method of making the same
- Patent number 12,016,129
- Issue date Jun 18, 2024
- ZF CV Systems Europe BV
- Marcin Calka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interface assembly and method for manufacturing interface assembly
- Patent number 12,004,299
- Issue date Jun 4, 2024
- TACTOTEK OY
- Mikko Heikkinen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Systems for coating a substrate
- Patent number 12,004,303
- Issue date Jun 4, 2024
- Nordson Corporation
- Michel Van De Vijver
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Package substrate and method for manufacturing the same
- Patent number 11,997,798
- Issue date May 28, 2024
- Advanced Semiconductor Engineering, Inc.
- Wu Chou Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR ACCOMMODATING SUBSTRATE WARPAGE IN PRINTED CIRCUIT BOARD...
- Publication number 20250212320
- Publication date Jun 26, 2025
- Rockwell Collins, Inc.
- James B. Mayfield
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR ASSEMBLY OF BATTERY PACK WITH COMPACT SHARED PCM
- Publication number 20250201943
- Publication date Jun 19, 2025
- Snap Inc.
- John Bernard Ardisana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and Manufacturing Method thereof
- Publication number 20250183148
- Publication date Jun 5, 2025
- InnoLux Corporation
- Kuang-Ming FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR PROVIDING SHORT STRUCTURES FOR BACKDRILL VA...
- Publication number 20250181055
- Publication date Jun 5, 2025
- CIENA CORPORATION
- Vinh Ha
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SYSTEM FOR REMOVING SURFACE INSULATING LAYER OF PRINTED...
- Publication number 20250151202
- Publication date May 8, 2025
- INSTITUTE OF FORENSIC SCIENCE, MINISTRY OF PUBLIC SECURITY
- Ning ZHANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILM-TYPE CIRCUIT AND METHOD OF CONNECTING PRINTED CIRCUIT BOARDS V...
- Publication number 20250142726
- Publication date May 1, 2025
- DENSO WAVE INCORPORATED
- Natsuki SUGIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIGNAL PROCESSING CIRCUIT AND MEASUREMENT SYSTEM
- Publication number 20250132076
- Publication date Apr 24, 2025
- ROHDE &SCHWARZ GMBH & CO. KG
- Stefan SOHR
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MASKING METHOD AND MASKED PRODUCT
- Publication number 20250133661
- Publication date Apr 24, 2025
- P2i Ltd.
- Graham HUBBARD
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT COMPENSATION METHOD APPLIED TO PATTERN DISPLACEMENT AND CIR...
- Publication number 20250126722
- Publication date Apr 17, 2025
- Industrial Technology Research Institute
- Chieh-Wei Feng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARRIER STRUCTURE
- Publication number 20250126702
- Publication date Apr 17, 2025
- Siliconware Precision Industries Co., Ltd.
- Chin-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR CROSS-SECTIONING OF CIRCUIT BOARDS
- Publication number 20250124658
- Publication date Apr 17, 2025
- Dell Products L.P.
- Sandor T. FARKAS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
- Publication number 20250089178
- Publication date Mar 13, 2025
- Innolux Corporation
- Kai Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILTER COMPONENT AND METHOD FOR PRODUCING A FILTER COMPONENT
- Publication number 20250081352
- Publication date Mar 6, 2025
- TDK Electronics AG
- Karl Niklas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20250081358
- Publication date Mar 6, 2025
- Shinko Electric Industries Co., Ltd.
- Takashi NISHIYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FIELD PROGRAMMABLE SOLDER BALL GRID ARRAY WITH EMBEDDED CONTROL SYS...
- Publication number 20250048561
- Publication date Feb 6, 2025
- Tesla, Inc.
- Vijaykumar KRITHIVASAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND MECHANISMS FOR MAINTAINING AN ELECTRO-ACTIVE POLYMER IN...
- Publication number 20250016932
- Publication date Jan 9, 2025
- ElastiMed Ltd.
- Omer Zelka
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
BOARD INSPECTION DEVICE AND BOARD INSPECTION METHOD
- Publication number 20240414905
- Publication date Dec 12, 2024
- CKD CORPORATION
- Kazuyoshi Kikuchi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20240414849
- Publication date Dec 12, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Myung Ju GI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD FOR A REFLOW PROFILING PROCESS
- Publication number 20240414851
- Publication date Dec 12, 2024
- Western Digital Technologies, Inc.
- Uthayarajan A/L Rasalingam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240381540
- Publication date Nov 14, 2024
- Innolux Corporation
- Yi-Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY
- Publication number 20240373559
- Publication date Nov 7, 2024
- TactoTek Oy
- Mikko HEIKKINEN
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method for Soldering an Electronic Component to a Circuit Board by...
- Publication number 20240373563
- Publication date Nov 7, 2024
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAME
- Publication number 20240365475
- Publication date Oct 31, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Do Jae YOO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier and Method Manufacturing the Same
- Publication number 20240334613
- Publication date Oct 3, 2024
- AT&S (Chongqing) Company Limited
- JyunMin WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BGA Element Self-Alignment Structure and Alignment Method
- Publication number 20240334592
- Publication date Oct 3, 2024
- SHENZHEN SIPTORY TECHNOLOGY CO., LTD
- Dongdong Shao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GUIDED TRANSPORT PATH CORRECTION
- Publication number 20240314941
- Publication date Sep 19, 2024
- Kateeva, Inc.
- Eliyahu Vronsky
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Method For Manufacturing Electrical Devices
- Publication number 20240282517
- Publication date Aug 22, 2024
- Hutchinson Technology Incorporated
- Collin M. Grove
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY
- Publication number 20240284598
- Publication date Aug 22, 2024
- TactoTek Oy
- Mikko HEIKKINEN
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PRINTED CIRCUIT BOARD ARRANGEMENT
- Publication number 20240268028
- Publication date Aug 8, 2024
- HARTING ELECTRONICS GMBH
- Marc GENAU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EQUIPMENT AUTOMATIC ALIGNMENT METHOD AND PROCESS ROBOT DEVICE USING...
- Publication number 20240260198
- Publication date Aug 1, 2024
- United Microelectronics Corp.
- Zheng-Yang LI
- G06 - COMPUTING CALCULATING COUNTING

Inspection Monitoring Aligning

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package geometries to enable visual inspection of solder fillets

Method for soldering an electronic component to a circuit board by...

Circuit board assembly with interposer circuit board and correspond...

Inverter insulator apparatus and method

Reprint apparatus for circuit board and reprint method using the same

Electrical devices with electrodes on softening polymers and method...

Method for assembly of battery pack with compact shared PCM

System and method for manufacturing composite board

Carrier structure

Method of manufacturing an electronic device

Capacitive compensation for vertical interconnect accesses

Method and apparatus for flexible circuit cable attachment

Methods, systems, and computer program products for determining a p...

LED circuit board structure and LED testing and packaging method

Embedded system module thermal installation verification

Method for detecting and adjusting poor back drills in printed circ...

Interface assembly and method for manufacturing interface assembly

Hermetic metallized via with improved reliability

Barrier for preventing SMD components from drifting

Flexible jumper with a mounting frame

Method of manufacturing printed circuit board

Interface assembly and method for manufacturing interface assembly

Method of assessing ink deposition accuracy in an electronic device...

Manufacturing method of electronic device

Method for soldering an electronic component to a circuit board by...

Guided transport path correction

Printed circuit board (PCB) and method of making the same

Interface assembly and method for manufacturing interface assembly

Systems for coating a substrate

Package substrate and method for manufacturing the same

Patents Applicationslast 30 patents

METHOD FOR ACCOMMODATING SUBSTRATE WARPAGE IN PRINTED CIRCUIT BOARD...

METHOD FOR ASSEMBLY OF BATTERY PACK WITH COMPACT SHARED PCM

Electronic Device and Manufacturing Method thereof

METHODS AND SYSTEMS FOR PROVIDING SHORT STRUCTURES FOR BACKDRILL VA...

METHOD AND SYSTEM FOR REMOVING SURFACE INSULATING LAYER OF PRINTED...

FILM-TYPE CIRCUIT AND METHOD OF CONNECTING PRINTED CIRCUIT BOARDS V...

SIGNAL PROCESSING CIRCUIT AND MEASUREMENT SYSTEM

MASKING METHOD AND MASKED PRODUCT

CIRCUIT COMPENSATION METHOD APPLIED TO PATTERN DISPLACEMENT AND CIR...

CARRIER STRUCTURE

SYSTEMS AND METHODS FOR CROSS-SECTIONING OF CIRCUIT BOARDS

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE

FILTER COMPONENT AND METHOD FOR PRODUCING A FILTER COMPONENT

WIRING BOARD

FIELD PROGRAMMABLE SOLDER BALL GRID ARRAY WITH EMBEDDED CONTROL SYS...

METHODS AND MECHANISMS FOR MAINTAINING AN ELECTRO-ACTIVE POLYMER IN...

BOARD INSPECTION DEVICE AND BOARD INSPECTION METHOD

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD FOR A REFLOW PROFILING PROCESS

MANUFACTURING METHOD OF ELECTRONIC DEVICE

INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY

Method for Soldering an Electronic Component to a Circuit Board by...

REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAME

Component Carrier and Method Manufacturing the Same

BGA Element Self-Alignment Structure and Alignment Method

GUIDED TRANSPORT PATH CORRECTION

Method For Manufacturing Electrical Devices

INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY

PRINTED CIRCUIT BOARD ARRANGEMENT

EQUIPMENT AUTOMATIC ALIGNMENT METHOD AND PROCESS ROBOT DEVICE USING...