Insulated gate bipolar transistor [IGBT]

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H01L2924/13055

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/13055Insulated gate bipolar transistor [IGBT]

Industries

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Patents Grantslast 30 patents

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- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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Thermal performance improvement and stress reduction in semiconduct...
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- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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- ZF Friedrichshafen AG
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- H01 - BASIC ELECTRIC ELEMENTS

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HEAT DISSIPATION SUBSTRATE FOR A POWER SEMICONDUCTOR MODULE, A POWE...
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- Min Yup JANG
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- Publication number 20250112562
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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SEMICONDUCTOR MODULE
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SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
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SEMICONDUCTOR MODULE
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- Publication date Feb 13, 2025
- Fuji Electric Co., Ltd.
- Yuta TAMAI
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Semiconductor Chip Package and Manufacturing Method Thereof
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- DIODES INCORPORATED
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- Publication date Jan 30, 2025
- Fuji Electric Co., Ltd.
- Yushi SATO
- H01 - BASIC ELECTRIC ELEMENTS

Insulated gate bipolar transistor [IGBT]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power module semiconductor device and inverter equipment, and fabri...

Switching device and electronic circuit

Power semiconductor device

Semiconductor package system and related methods

Solder material

Semiconductor device

Semiconductor module and method for manufacturing semiconductor module

Semiconductor device and method for manufacturing the same

Semiconductor module

Semiconductor device

Clip design and method of controlling clip position

Semiconductor power module

Leadframe spacer for double-sided power module

Voltage-controlled switching device with resistive path

Embedded package with electrically isolating dielectric liner

Electronic device with multi-layer contact and system

Multi-typed integrated passive device (IPD) components and devices...

Semiconductor device and method of forming micro interconnect struc...

Chip assembling on adhesion layer or dielectric layer, extending be...

Semiconductor device with improved performance in operation and imp...

Semiconductor device and method of manufacturing the same

Transient liquid phase bonding compositions and power electronics a...

Packaging structure of power semiconductor module

Silicon nitride circuit board and electronic component module

Semiconductor device including surface pressure absorbing member fo...

Semiconductor device and manufacturing method of semiconductor device

Thermal performance improvement and stress reduction in semiconduct...

Method of producing a multi-chip assembly

Method for producing conductive tracks, and electronic module

Half-bridge module for an inverter of an electric drive of an elect...

Patents Applicationslast 30 patents

POWER CONVERSION DEVICE

SEMICONDUCTOR DEVICE

COMPONENT AND METHOD OF MANUFACTURING A COMPONENT USING AN ULTRATHI...

SEMICONDUCTOR DEVICE AND METHOD OF MOUNTING SEMICONDUCTOR DEVICE

POWER ELECTRONICS PACKAGE HAVING SIGNAL CONNECTIONS FOR MULTIPLE PO...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

POWER MODULE WITH A CIRCUIT CARRIER

PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES

INTELLIGENT POWER MODULE ARRANGEMENT

HEAT DISSIPATION SUBSTRATE FOR A POWER SEMICONDUCTOR MODULE, A POWE...

SEMICONDUCTOR DEVICE

Semiconductor Package and Method for Manufacturing Semiconductor Pa...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

POWER MODULE STRUCTURE WITH CLIP SUBSTRATE MEMBER

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

THERMAL PERFORMANCE IMPROVEMENT AND STRESS REDUCTION IN SEMICONDUCT...

SEMICONDUCTOR DEVICE

POWER DEVICE CELL AND POWER ELECTRONICS ASSEMBLY INCLUDING THE POWE...

PACKAGE WITH TRANSISTOR CHIP BETWEEN CARRIER AND CONDUCTIVE STRUCTU...

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SUBSTRATE AND METHOD OF PRODUCING A SUBSTRATE

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

METHOD FOR FABRICATING TOPSIDE COOLED SEMICONDUCTOR PACKAGES BY FIL...

SEMICONDUCTOR MODULE

Semiconductor Chip Package and Manufacturing Method Thereof

SEMICONDUCTOR DEVICE