Insulating foil under component

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CPC
H05K2201/10575

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10575Insulating foil under component

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic component with two substrates enclosing functional eleme...
- Patent number 10,659,003
- Issue date May 19, 2020
- Taiyo Yuden Co., Ltd.
- Hidetaro Nakazawa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Coating for limiting substrate damage due to discrete failure
- Patent number 10,492,289
- Issue date Nov 26, 2019
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coating for limiting substrate damage due to discrete failure
- Patent number 10,470,290
- Issue date Nov 5, 2019
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED module and lighting assembly
- Patent number 9,349,930
- Issue date May 24, 2016
- Chung Hoon Lee
- F21 - LIGHTING
Information Patent Grant
Circuit board with holding mechanism for holding wired electronic c...
- Patent number 8,631,569
- Issue date Jan 21, 2014
- Endress + Hauser GmbH + Co. KG
- Dietmer Birgel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical power substrate
- Patent number 8,441,796
- Issue date May 14, 2013
- Keronite International Limited
- Robert Morse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Underfill film having thermally conductive sheet
- Patent number 8,269,339
- Issue date Sep 18, 2012
- International Business Machines Corporation
- Keiji Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Underfill film having thermally conductive sheet
- Patent number 7,943,435
- Issue date May 17, 2011
- International Business Machines Corporation
- Keiji Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-volatile memory with reduced mobile ion diffusion
- Patent number 7,944,029
- Issue date May 17, 2011
- SanDisk Corporation
- Xiaoyu Yang
- G11 - INFORMATION STORAGE
Information Patent Grant
Illuminating device
- Patent number 7,868,339
- Issue date Jan 11, 2011
- Osram Gesellschaft mit Beschränkter Haftung
- Harald Stoyan
- F21 - LIGHTING
Information Patent Grant
Housing for a power module
- Patent number 7,821,791
- Issue date Oct 26, 2010
- Semikron Elektronik GmbH & Co. KG
- Rainer Popp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical transceiver with frame ground and signal ground isolated wi...
- Patent number 7,708,473
- Issue date May 4, 2010
- Sumitomo Electric Industries Ltd.
- Keiji Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Underfill film having thermally conductive sheet
- Patent number 7,416,923
- Issue date Aug 26, 2008
- International Business Machines Corporation
- Keiji Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, and electronic device with an electronic part mounted...
- Patent number 7,273,988
- Issue date Sep 25, 2007
- NEC Corporation
- Yuki Momokawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display of operational instructions
- Patent number 7,108,172
- Issue date Sep 19, 2006
- The Chamberlain Group, Inc.
- Walter Parsadayan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wiring board, and electronic device with an electronic part mounted...
- Patent number 6,878,884
- Issue date Apr 12, 2005
- NEC Corporation
- Yuki Momokawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector with solder plate and pegs for PC board mounting
- Patent number 6,716,060
- Issue date Apr 6, 2004
- ITT Manufacturing Enterprises, Inc.
- Martin Gollhofer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low cost, large scale RF hybrid package for simple assembly onto mi...
- Patent number 6,417,747
- Issue date Jul 9, 2002
- Raytheon Company
- Timothy E. Dearden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting board, process for producing the board, and proc...
- Patent number 6,165,595
- Issue date Dec 26, 2000
- Matsushita Electric Industrial Co., Ltd.
- Koichi Kumagai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming a microelectronic assembly
- Patent number 5,848,466
- Issue date Dec 15, 1998
- Motorola, Inc.
- Daniel Joseph Viza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rubber contact switch
- Patent number 5,659,161
- Issue date Aug 19, 1997
- Yazaki Corporation
- Daisuke Takanohashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removable VLSI assembly
- Patent number 5,164,818
- Issue date Nov 17, 1992
- International Business Machines Corporation
- Arnold Blum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the construction and application of a circuit-board inte...
- Patent number 5,107,587
- Issue date Apr 28, 1992
- CROUZET S.P.A.
- Claude Thepault
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Molded circuit board
- Patent number 4,914,259
- Issue date Apr 3, 1990
- The Furukawa Electric Co., Ltd.
- Kenzo Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting electric part onto a substrate
- Patent number 4,506,443
- Issue date Mar 26, 1985
- Clarion Co., Ltd.
- Tsukasa Itoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic circuit boards
- Patent number 4,211,890
- Issue date Jul 8, 1980
- Shin-Etsu Polymer Co., Ltd.
- Ryoichi Sado
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photoflash unit with secured insulator
- Patent number 4,152,751
- Issue date May 1, 1979
- GTE Sylvania Incorporated
- Ronald E. Sindlinger
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
3702953
- Patent number 3,702,953
- Issue date Nov 14, 1972
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
3263023
- Patent number 3,263,023
- Issue date Jul 26, 1966
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3019283
- Patent number 3,019,283
- Issue date Jan 30, 1962
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220190805
- Publication date Jun 16, 2022
- KYOCERA CORPORATION
- Akira OIKAWA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MULTI-LAYER INTERCONNECTED ELECTRO-THERMAL SYSTEM HAVING A THERMALL...
- Publication number 20190387615
- Publication date Dec 19, 2019
- Microsoft Technology Licensing, LLC
- Michael NIKKHOO
- G01 - MEASURING TESTING
Information Patent Application
LED MODULE AND LIGHTING ASSEMBLY
- Publication number 20130307016
- Publication date Nov 21, 2013
- Chung Hoon Lee
- F21 - LIGHTING
Information Patent Application
AT LEAST PARTIALLY REDUNDANT INTERCONNECTS BETWEEN COMPONENT AND PR...
- Publication number 20120282787
- Publication date Nov 8, 2012
- Honeywell International Inc.
- Jay Stanke
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Underfill film having thermally conductive sheet
- Publication number 20110155425
- Publication date Jun 30, 2011
- Keiji Matsumoto
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
NON-VOLATILE MEMORY WITH REDUCED MOBILE ION DIFFUSION
- Publication number 20110062563
- Publication date Mar 17, 2011
- Xiaoyu Yang
- G11 - INFORMATION STORAGE
Information Patent Application
Optical transceiver with frame ground and signal ground isolated wi...
- Publication number 20090123116
- Publication date May 14, 2009
- Keiji Tanaka
- G02 - OPTICS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20090102048
- Publication date Apr 23, 2009
- Eiji Hori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Housing for a power module
- Publication number 20090021922
- Publication date Jan 22, 2009
- SEMIKRON Elektronik GmbH & Co. KG
- Rainer Popp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Underfill film having thermally conductive sheet
- Publication number 20080261353
- Publication date Oct 23, 2008
- Keiji Matsumoto
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electrical Power Substrate
- Publication number 20080257585
- Publication date Oct 23, 2008
- THERMASTRATE LIMITED
- Robert Morse
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Illuminating device
- Publication number 20080135865
- Publication date Jun 12, 2008
- Patent-Treuhand-Gesellschaft fur elektrische Gluhlampen mbH
- Harald Stoyan
- F21 - LIGHTING
Information Patent Application
Underfill film having thermally conductive sheet
- Publication number 20080067670
- Publication date Mar 20, 2008
- Keiji Matsumoto
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Printed circuit board and method for manufacturing a solderless ele...
- Publication number 20080003892
- Publication date Jan 3, 2008
- Reinhard Fassel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board With Holding Mechanism For Holding Wired Electronic C...
- Publication number 20070212901
- Publication date Sep 13, 2007
- Endress + Hauser GmbH + Co.KG
- Dietmar Birgel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Underfill film having thermally conductive sheet
- Publication number 20070132078
- Publication date Jun 14, 2007
- Keiji Matsumoto
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Display of operational instructions
- Publication number 20050274787
- Publication date Dec 15, 2005
- The Chamberlain Group, Inc.
- Walter Parsadayan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Wiring board, and electronic device with an electronic part mounted...
- Publication number 20050230147
- Publication date Oct 20, 2005
- NEC Corporation
- Yuki Momokawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board, and electronic device with an electronic part mounted...
- Publication number 20050146019
- Publication date Jul 7, 2005
- NEC Corporation
- Yuki Momokawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Assembly of ICs with blocking capacitors and printed circuit boards
- Publication number 20040125516
- Publication date Jul 1, 2004
- Uwe Brand
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Wiring board, and electronic device with an electronic part mounted...
- Publication number 20030196831
- Publication date Oct 23, 2003
- NEC Corporation
- Yuki Momokawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical connector for mounting on PC board
- Publication number 20030040218
- Publication date Feb 27, 2003
- Martin Gollhofer
- H01 - BASIC ELECTRIC ELEMENTS

Insulating foil under component

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic component with two substrates enclosing functional eleme...

Coating for limiting substrate damage due to discrete failure

Coating for limiting substrate damage due to discrete failure

LED module and lighting assembly

Circuit board with holding mechanism for holding wired electronic c...

Electrical power substrate

Underfill film having thermally conductive sheet

Underfill film having thermally conductive sheet

Non-volatile memory with reduced mobile ion diffusion

Illuminating device

Housing for a power module

Optical transceiver with frame ground and signal ground isolated wi...

Underfill film having thermally conductive sheet

Wiring board, and electronic device with an electronic part mounted...

Display of operational instructions

Wiring board, and electronic device with an electronic part mounted...

Electrical connector with solder plate and pegs for PC board mounting

Low cost, large scale RF hybrid package for simple assembly onto mi...

Component mounting board, process for producing the board, and proc...

Method for forming a microelectronic assembly

Rubber contact switch

Removable VLSI assembly

Method for the construction and application of a circuit-board inte...

Molded circuit board

Method of mounting electric part onto a substrate

Electronic circuit boards

Photoflash unit with secured insulator

3702953

3263023

3019283

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

MULTI-LAYER INTERCONNECTED ELECTRO-THERMAL SYSTEM HAVING A THERMALL...

LED MODULE AND LIGHTING ASSEMBLY

AT LEAST PARTIALLY REDUNDANT INTERCONNECTS BETWEEN COMPONENT AND PR...

Underfill film having thermally conductive sheet

NON-VOLATILE MEMORY WITH REDUCED MOBILE ION DIFFUSION

Optical transceiver with frame ground and signal ground isolated wi...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

Housing for a power module

Underfill film having thermally conductive sheet

Electrical Power Substrate

Illuminating device

Underfill film having thermally conductive sheet

Printed circuit board and method for manufacturing a solderless ele...

Circuit Board With Holding Mechanism For Holding Wired Electronic C...

Underfill film having thermally conductive sheet

Display of operational instructions

Wiring board, and electronic device with an electronic part mounted...

Wiring board, and electronic device with an electronic part mounted...

Assembly of ICs with blocking capacitors and printed circuit boards

Wiring board, and electronic device with an electronic part mounted...

Electrical connector for mounting on PC board