3263023

Information

• Patent Grant
• 3263023

• References
• Source

• Patent Number

  3,263,023

• Date Filed

  Not available

• Date Issued

  Tuesday, July 26, 1966
  58 years ago

• CPC

  • H05K1/036 - Multilayers with layers of different types
  • H05K3/306 - Lead-in-hole components
  • H05K1/0272 - Adaptations for fluid transport
  • H05K1/189 - characterised by the use of a flexible or folded printed circuit
  • H05K3/0058 - Laminating printed circuit boards onto other substrates
  • H05K3/3447 - Lead-in-hole components
  • H05K2201/09063 - Holes or slots in insulating substrate not used for electrical connections
  • H05K2201/09609 - Via grid
  • H05K2201/09945 - Universal aspects
  • H05K2201/10575 - Insulating foil under component
  • H05K2203/1189 - Pressing leads, bumps or a die through an insulating layer
  • Y10T428/24149 - Honeycomb-like

• US Classifications

  • 174 - Electricity: conductors and insulators
  • 428 - Stock material or miscellaneous articles
  • 439 - Electrical connectors