Insulating layers on insulating parts, with or without metallisation

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H01L21/481

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/481Insulating layers on insulating parts, with or without metallisation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for laser drilling process for an integrated circuit package
- Patent number 12,368,053
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Shen Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming semiconductor package structure
- Patent number 12,362,256
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with external power sensor
- Patent number RE50485
- Issue date Jul 8, 2025
- Infineon Technologies AG
- Juergen Hoegerl
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,354,882
- Issue date Jul 8, 2025
- Mediatek Inc.
- Po-Chao Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices with backside bond pads under a memory array
- Patent number 12,354,982
- Issue date Jul 8, 2025
- Eric N. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,334,452
- Issue date Jun 17, 2025
- Siliconware Precision Industries Co., Ltd.
- Chao-Chiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure, and fabrication and packaging methods thereof
- Patent number 12,334,361
- Issue date Jun 17, 2025
- Yangtze Memory Technologies Co., Ltd.
- XinRu Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for package with interposers
- Patent number 12,322,670
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,300,573
- Issue date May 13, 2025
- Mediatek Inc.
- Bo-Jiun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die interconnect substrate, an electrical device and a method for f...
- Patent number 12,300,613
- Issue date May 13, 2025
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including shielding cover that covers molded...
- Patent number 12,293,977
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Young-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,278,189
- Issue date Apr 15, 2025
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module with injection-molded or laminated coole...
- Patent number 12,278,163
- Issue date Apr 15, 2025
- HITACHI ENERGY LTD
- Niko Pavlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with improved die pad and solder mask...
- Patent number 12,278,205
- Issue date Apr 15, 2025
- Texas Instruments Incorporated
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming a chip package having first and...
- Patent number 12,272,712
- Issue date Apr 8, 2025
- Xintec Inc.
- Tsang-Yu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer material in a redistribution structure of a semiconductor p...
- Patent number 12,265,330
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sih-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing component carrier and component carrier int...
- Patent number 12,262,482
- Issue date Mar 25, 2025
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Application of conductive via or trench for intra module EMI shielding
- Patent number 12,261,127
- Issue date Mar 25, 2025
- Skyworks Solutions, Inc.
- Anthony James LoBianco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor system, moving body, and method...
- Patent number 12,243,789
- Issue date Mar 4, 2025
- Mitsubishi Electric Corporation
- Naoki Yoshimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates for semiconductor device assemblies and systems with imp...
- Patent number 12,243,801
- Issue date Mar 4, 2025
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waferscale physiological characteristic sensor package with integra...
- Patent number 12,232,842
- Issue date Feb 25, 2025
- Medtronic MiniMed, Inc.
- Daniel Hahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and manufacturing method therefor
- Patent number 12,237,237
- Issue date Feb 25, 2025
- Fuji Electric Co., Ltd.
- Tadahiko Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency package implementing a window frame with edge plati...
- Patent number 12,224,217
- Issue date Feb 11, 2025
- MACOM Technology Solutions Holdings, Inc.
- Richard Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible hybrid electronic system processing method and flexible hy...
- Patent number 12,224,246
- Issue date Feb 11, 2025
- Peking University
- Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with pillar array
- Patent number 12,191,162
- Issue date Jan 7, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic carrier and build up carrier for light-emitting diode (LED)...
- Patent number 12,191,280
- Issue date Jan 7, 2025
- Lumileds, LLC
- Loon-Kwang Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated cooling assemblies for advanced device packaging and met...
- Patent number 12,191,234
- Issue date Jan 7, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and method for forming the same
- Patent number 12,183,714
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and methods for bonding tested wafers and t...
- Patent number 12,176,320
- Issue date Dec 24, 2024
- AP Memory Technology Corporation
- Wenliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package supports
- Patent number 12,176,223
- Issue date Dec 24, 2024
- Intel Corporation
- Kristof Kuwawi Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20250233053
- Publication date Jul 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOW ENHANCED DUMMY STRUCTURE TO ENABLE CAPILLARY FLOW BASED SIDEWA...
- Publication number 20250220818
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER HYBRID BONDING FOR COMPOSITE PACKAGES AND METHODS OF FORMIN...
- Publication number 20250218912
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Package and Manufacturing Method Thereof
- Publication number 20250210527
- Publication date Jun 26, 2025
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER MATERIAL IN A REDISTRIBUTION STRUCTURE OF A SEMICONDUCTOR P...
- Publication number 20250189889
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sih-Hao Liao
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250174502
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Liqun GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR A RADIATIVE NANOMATERIAL PACKAGE ARCHITECTURE
- Publication number 20250167069
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Radwanul Hasan SIDDIQUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING INTEGRATED LID STRUCTURE AND METHOD THE...
- Publication number 20250157862
- Publication date May 15, 2025
- NXP B.V.
- Yu Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE
- Publication number 20250140669
- Publication date May 1, 2025
- ABSOLICS INC.
- Bongyeol LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMUM MATERIAL STACKS FOR SEMICONDUCTOR CONTACTS
- Publication number 20250125157
- Publication date Apr 17, 2025
- Applied Materials, Inc.
- Michael HAVERTY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING GLASS SUBSTRATES WITH DIELECTR...
- Publication number 20250112138
- Publication date Apr 3, 2025
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Integrated Circuit Device Having A Deformable Lid, And Ass...
- Publication number 20250105071
- Publication date Mar 27, 2025
- NXP USA, Inc.
- Jinquan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-HEALING LINER FOR THROUGH GLASS VIA RELIABILITY
- Publication number 20250105119
- Publication date Mar 27, 2025
- Intel Corporation
- Yuqin LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING A PACKAGE LID HAVING A PLURALITY OF FIN...
- Publication number 20250096062
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Ping-Yin Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED THERMAL HEALING AND DOPING OF GLASS CORES FOR MICROELECTR...
- Publication number 20250096052
- Publication date Mar 20, 2025
- Intel Corporation
- Mohamed R. Saber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096068
- Publication date Mar 20, 2025
- Fuji Electric Co., Ltd.
- Naoki TAKIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250087638
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE BONDING TOOL AND SEMICONDUCTOR PACKAGE FABRIC...
- Publication number 20250079232
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- TAEJAE PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SUPPORTS
- Publication number 20250069902
- Publication date Feb 27, 2025
- Intel Corporation
- Kristof Kuwawi Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250069899
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Jakyoung Gu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
STIFFENER ASSEMBLY AND METHOD FOR MAKING A SEMICONDUCTOR ASSEMBLY
- Publication number 20250054819
- Publication date Feb 13, 2025
- Intel Corporation
- Seok Ling LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Mounting Region for Mounting a Component
- Publication number 20250054820
- Publication date Feb 13, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Lonis Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTO...
- Publication number 20250031315
- Publication date Jan 23, 2025
- DAI NIPPON PRINTING CO., LTD.
- Ryohei KASAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND MOUNTING SUBSTRATE
- Publication number 20250014979
- Publication date Jan 9, 2025
- DAI NIPPON PRINTING CO., LTD.
- Shinji MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOUSING, SEMICONDUCTOR MODULE AND METHODS FOR PRODUCING THE SAME
- Publication number 20250014952
- Publication date Jan 9, 2025
- INFINEON TECHNOLOGIES AG
- Georg Troska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250006567
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Eunsu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A LID OF A HOUSING
- Publication number 20240429181
- Publication date Dec 26, 2024
- INFINEON TECHNOLOGIES AG
- Johannes Uhlig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO PHOTOLITHOGRAPHICALLY PATTERN MATERIALS IN...
- Publication number 20240427232
- Publication date Dec 26, 2024
- Intel Corporation
- Sho Kawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED SEMICONDUCTOR DEVICE
- Publication number 20240413066
- Publication date Dec 12, 2024
- Intel Corporation
- Ranjul BALAKRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATCH INTERPOSER MOLD DESIGN FOR LIQUID METAL CARRIER ARRAY
- Publication number 20240404896
- Publication date Dec 5, 2024
- Intel Corporation
- Eric ERIKE
- H01 - BASIC ELECTRIC ELEMENTS

Insulating layers on insulating parts, with or without metallisation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for laser drilling process for an integrated circuit package

Method for forming semiconductor package structure

Semiconductor module with external power sensor

Semiconductor structure and method for forming the same

Memory devices with backside bond pads under a memory array

Electronic package and manufacturing method thereof

Substrate structure, and fabrication and packaging methods thereof

Methods and apparatus for package with interposers

Semiconductor device and manufacturing method thereof

Die interconnect substrate, an electrical device and a method for f...

Semiconductor package including shielding cover that covers molded...

Electronic package and manufacturing method thereof

Power semiconductor module with injection-molded or laminated coole...

Semiconductor device package with improved die pad and solder mask...

Chip package and method for forming a chip package having first and...

Polymer material in a redistribution structure of a semiconductor p...

Method of manufacturing component carrier and component carrier int...

Application of conductive via or trench for intra module EMI shielding

Semiconductor device, semiconductor system, moving body, and method...

Substrates for semiconductor device assemblies and systems with imp...

Waferscale physiological characteristic sensor package with integra...

Semiconductor module and manufacturing method therefor

Radio frequency package implementing a window frame with edge plati...

Flexible hybrid electronic system processing method and flexible hy...

Semiconductor device assembly with pillar array

Ceramic carrier and build up carrier for light-emitting diode (LED)...

Integrated cooling assemblies for advanced device packaging and met...

Package structures and method for forming the same

Semiconductor structure and methods for bonding tested wafers and t...

Integrated circuit package supports

Patents Applicationslast 30 patents

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

FLOW ENHANCED DUMMY STRUCTURE TO ENABLE CAPILLARY FLOW BASED SIDEWA...

POLYMER HYBRID BONDING FOR COMPOSITE PACKAGES AND METHODS OF FORMIN...

Electronic Package and Manufacturing Method Thereof

POLYMER MATERIAL IN A REDISTRIBUTION STRUCTURE OF A SEMICONDUCTOR P...

PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

SYSTEM AND METHODS FOR A RADIATIVE NANOMATERIAL PACKAGE ARCHITECTURE

SEMICONDUCTOR DEVICE HAVING INTEGRATED LID STRUCTURE AND METHOD THE...

PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE

OPTIMUM MATERIAL STACKS FOR SEMICONDUCTOR CONTACTS

MICROELECTRONIC STRUCTURES INCLUDING GLASS SUBSTRATES WITH DIELECTR...

Packaged Integrated Circuit Device Having A Deformable Lid, And Ass...

SELF-HEALING LINER FOR THROUGH GLASS VIA RELIABILITY

PACKAGE STRUCTURE INCLUDING A PACKAGE LID HAVING A PLURALITY OF FIN...

LOCALIZED THERMAL HEALING AND DOPING OF GLASS CORES FOR MICROELECTR...

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE BONDING TOOL AND SEMICONDUCTOR PACKAGE FABRIC...

INTEGRATED CIRCUIT PACKAGE SUPPORTS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

STIFFENER ASSEMBLY AND METHOD FOR MAKING A SEMICONDUCTOR ASSEMBLY

Component Carrier With Mounting Region for Mounting a Component

WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTO...

THROUGH ELECTRODE SUBSTRATE AND MOUNTING SUBSTRATE

HOUSING, SEMICONDUCTOR MODULE AND METHODS FOR PRODUCING THE SAME

SEMICONDUCTOR PACKAGE

METHOD FOR FORMING A LID OF A HOUSING

METHODS AND APPARATUS TO PHOTOLITHOGRAPHICALLY PATTERN MATERIALS IN...

EMBEDDED SEMICONDUCTOR DEVICE

PATCH INTERPOSER MOLD DESIGN FOR LIQUID METAL CARRIER ARRAY