Insulating layers on insulating parts, with or without metallisation

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CPC
H01L21/481

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/481Insulating layers on insulating parts, with or without metallisation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Radio frequency package implementing a window frame with edge plati...
- Patent number 12,224,217
- Issue date Feb 11, 2025
- MACOM Technology Solutions Holdings, Inc.
- Richard Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible hybrid electronic system processing method and flexible hy...
- Patent number 12,224,246
- Issue date Feb 11, 2025
- Peking University
- Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with pillar array
- Patent number 12,191,162
- Issue date Jan 7, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic carrier and build up carrier for light-emitting diode (LED)...
- Patent number 12,191,280
- Issue date Jan 7, 2025
- Lumileds, LLC
- Loon-Kwang Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated cooling assemblies for advanced device packaging and met...
- Patent number 12,191,234
- Issue date Jan 7, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and method for forming the same
- Patent number 12,183,714
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and methods for bonding tested wafers and t...
- Patent number 12,176,320
- Issue date Dec 24, 2024
- AP Memory Technology Corporation
- Wenliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package supports
- Patent number 12,176,223
- Issue date Dec 24, 2024
- Intel Corporation
- Kristof Kuwawi Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with embedded interposer laterally between electr...
- Patent number 12,165,964
- Issue date Dec 10, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Minwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package unit of surface mount technology includ...
- Patent number 12,148,675
- Issue date Nov 19, 2024
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Housing, semiconductor module and methods for producing the same
- Patent number 12,148,718
- Issue date Nov 19, 2024
- Infineon Technologies AG
- Johannes Uhlig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure and method of manufacturing the same, semiconducto...
- Patent number 12,144,120
- Issue date Nov 12, 2024
- Dai Nippon Printing Co., Ltd.
- Ryohei Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a conductive layer stacking with an in...
- Patent number 12,136,586
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Linchun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Minimizing package impedance discontinuity through dielectric struc...
- Patent number 12,125,777
- Issue date Oct 22, 2024
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages with internal moisture barriers
- Patent number 12,125,806
- Issue date Oct 22, 2024
- Wolfspeed, Inc.
- Arthur Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing same
- Patent number 12,119,234
- Issue date Oct 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacture of semiconductor devices having redistributi...
- Patent number 12,119,235
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate and mounting substrate
- Patent number 12,119,293
- Issue date Oct 15, 2024
- Dai Nippon Printing Co., Ltd.
- Shinji Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with protective lid
- Patent number 12,119,276
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,113,011
- Issue date Oct 8, 2024
- Fuji Electric Co., Ltd.
- Hiroto Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged RF power device with PCB routing outside protective member
- Patent number 12,100,630
- Issue date Sep 24, 2024
- MACOM Technology Solutions Holdings, Inc.
- Marvin Marbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having heat dissipation structure of curved pr...
- Patent number 12,094,836
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting electronic components to substrates
- Patent number 12,094,811
- Issue date Sep 17, 2024
- Kulicke and Soffa Industries, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an insulating sheet and a conductive fi...
- Patent number 12,080,612
- Issue date Sep 3, 2024
- Fuji Electric Co., Ltd.
- Katsumi Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB...
- Patent number 12,068,172
- Issue date Aug 20, 2024
- Intel Corporation
- Tarek A. Ibrahim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy die structures of a packaged integrated circuit device
- Patent number 12,068,222
- Issue date Aug 20, 2024
- Intel Corporation
- Mitul Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frame member with a porous material between a semiconductor module...
- Patent number 12,068,217
- Issue date Aug 20, 2024
- Mitsubishi Electric Corporation
- Takashi Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package mold flow control system and method
- Patent number 12,062,625
- Issue date Aug 13, 2024
- SanDisk Technologies, Inc.
- Hope Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming contact structures and semiconductor devices in...
- Patent number 12,057,372
- Issue date Aug 6, 2024
- Yangtze Memory Technologies Co., Ltd.
- Linchun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip encapsulation structure and encapsulation method
- Patent number 12,057,361
- Issue date Aug 6, 2024
- Epicmems (Xiamen) Co., Ltd.
- Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STIFFENER ASSEMBLY AND METHOD FOR MAKING A SEMICONDUCTOR ASSEMBLY
- Publication number 20250054819
- Publication date Feb 13, 2025
- Intel Corporation
- Seok Ling LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Mounting Region for Mounting a Component
- Publication number 20250054820
- Publication date Feb 13, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Lonis Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTO...
- Publication number 20250031315
- Publication date Jan 23, 2025
- DAI NIPPON PRINTING CO., LTD.
- Ryohei KASAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND MOUNTING SUBSTRATE
- Publication number 20250014979
- Publication date Jan 9, 2025
- DAI NIPPON PRINTING CO., LTD.
- Shinji MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOUSING, SEMICONDUCTOR MODULE AND METHODS FOR PRODUCING THE SAME
- Publication number 20250014952
- Publication date Jan 9, 2025
- INFINEON TECHNOLOGIES AG
- Georg Troska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250006567
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Eunsu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A LID OF A HOUSING
- Publication number 20240429181
- Publication date Dec 26, 2024
- INFINEON TECHNOLOGIES AG
- Johannes Uhlig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO PHOTOLITHOGRAPHICALLY PATTERN MATERIALS IN...
- Publication number 20240427232
- Publication date Dec 26, 2024
- Intel Corporation
- Sho Kawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED SEMICONDUCTOR DEVICE
- Publication number 20240413066
- Publication date Dec 12, 2024
- Intel Corporation
- Ranjul BALAKRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATCH INTERPOSER MOLD DESIGN FOR LIQUID METAL CARRIER ARRAY
- Publication number 20240404896
- Publication date Dec 5, 2024
- Intel Corporation
- Eric ERIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240387194
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH EMBEDDED ELEMENTS AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240387342
- Publication date Nov 21, 2024
- ABSOLICS INC.
- Tae Kyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20240387322
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH PROTECTIVE LID
- Publication number 20240379475
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371794
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH MULTIPLE CORE LAYERS TO PROVIDE VARIED THICKNESS CAV...
- Publication number 20240355747
- Publication date Oct 24, 2024
- QUALCOMM Incorporated
- Xia Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON FILM PACKAGE AND METHOD OF MANUFACTURING THE CHIP ON FILM P...
- Publication number 20240339376
- Publication date Oct 10, 2024
- Samsung Electronics Co., Ltd.
- Seunghyun CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL A...
- Publication number 20240332112
- Publication date Oct 3, 2024
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE PACKAGE
- Publication number 20240332274
- Publication date Oct 3, 2024
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yueh TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240321823
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Donguk Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20240312852
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES WITH BACKSIDE BOND PADS UNDER A MEMORY ARRAY
- Publication number 20240312933
- Publication date Sep 19, 2024
- Lodestar Licensing Group LLC
- Eric N. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING PACKAGING ENCLOSURE AND METHOD FOR MANUFAC...
- Publication number 20240312794
- Publication date Sep 19, 2024
- Hubei Yangtze Pilot-Line Services Co., Ltd.
- Yiqun WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERABLE AND WIRE BONDABLE PART MARKING
- Publication number 20240312926
- Publication date Sep 19, 2024
- MACOM Technology Solutions Holdings, Inc.
- Margaret Barter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSERT-MOLDED ARTICLE AND METHOD FOR MANUFACTURING INSERT-MOLDED AR...
- Publication number 20240304505
- Publication date Sep 12, 2024
- Fuji Electric Co., Ltd.
- Hisato INOKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED CONTACT OPENINGS FOR BACKSIDE THROUGH SUBSTRATE VIAS
- Publication number 20240297099
- Publication date Sep 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jeffrey Peter GAMBINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20240282685
- Publication date Aug 22, 2024
- LG Innotek Co., Ltd.
- Jae Hun JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING CONTACT STRUCTURES AND SEMICONDUCTOR DEVICES TH...
- Publication number 20240282673
- Publication date Aug 22, 2024
- Yangtze Memory Technologies Co., Ltd.
- Linchun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MEASUREMENT METHOD FOR THE PACKAGE STRUCTURE
- Publication number 20240263938
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- KUEI-SUNG CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240258193
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS

Insulating layers on insulating parts, with or without metallisation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Radio frequency package implementing a window frame with edge plati...

Flexible hybrid electronic system processing method and flexible hy...

Semiconductor device assembly with pillar array

Ceramic carrier and build up carrier for light-emitting diode (LED)...

Integrated cooling assemblies for advanced device packaging and met...

Package structures and method for forming the same

Semiconductor structure and methods for bonding tested wafers and t...

Integrated circuit package supports

Component carrier with embedded interposer laterally between electr...

Power semiconductor package unit of surface mount technology includ...

Housing, semiconductor module and methods for producing the same

Wiring structure and method of manufacturing the same, semiconducto...

Semiconductor devices having a conductive layer stacking with an in...

Minimizing package impedance discontinuity through dielectric struc...

Electronic device packages with internal moisture barriers

Semiconductor structure and method for manufacturing same

Methods of manufacture of semiconductor devices having redistributi...

Through electrode substrate and mounting substrate

Package structure with protective lid

Semiconductor device and method of manufacturing the same

Packaged RF power device with PCB routing outside protective member

Semiconductor device having heat dissipation structure of curved pr...

Connecting electronic components to substrates

Semiconductor device having an insulating sheet and a conductive fi...

Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB...

Dummy die structures of a packaged integrated circuit device

Frame member with a porous material between a semiconductor module...

Semiconductor device package mold flow control system and method

Methods for forming contact structures and semiconductor devices in...

Chip encapsulation structure and encapsulation method

Patents Applicationslast 30 patents

STIFFENER ASSEMBLY AND METHOD FOR MAKING A SEMICONDUCTOR ASSEMBLY

Component Carrier With Mounting Region for Mounting a Component

WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTO...

THROUGH ELECTRODE SUBSTRATE AND MOUNTING SUBSTRATE

HOUSING, SEMICONDUCTOR MODULE AND METHODS FOR PRODUCING THE SAME

SEMICONDUCTOR PACKAGE

METHOD FOR FORMING A LID OF A HOUSING

METHODS AND APPARATUS TO PHOTOLITHOGRAPHICALLY PATTERN MATERIALS IN...

EMBEDDED SEMICONDUCTOR DEVICE

PATCH INTERPOSER MOLD DESIGN FOR LIQUID METAL CARRIER ARRAY

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

SUBSTRATE WITH EMBEDDED ELEMENTS AND MANUFACTURING METHOD OF THE SAME

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

PACKAGE STRUCTURE WITH PROTECTIVE LID

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SUBSTRATE WITH MULTIPLE CORE LAYERS TO PROVIDE VARIED THICKNESS CAV...

CHIP ON FILM PACKAGE AND METHOD OF MANUFACTURING THE CHIP ON FILM P...

CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL A...

OPTICAL DEVICE PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

MEMORY DEVICES WITH BACKSIDE BOND PADS UNDER A MEMORY ARRAY

METHOD FOR MANUFACTURING PACKAGING ENCLOSURE AND METHOD FOR MANUFAC...

SOLDERABLE AND WIRE BONDABLE PART MARKING

INSERT-MOLDED ARTICLE AND METHOD FOR MANUFACTURING INSERT-MOLDED AR...

SELF-ALIGNED CONTACT OPENINGS FOR BACKSIDE THROUGH SUBSTRATE VIAS

CIRCUIT BOARD

METHODS FOR FORMING CONTACT STRUCTURES AND SEMICONDUCTOR DEVICES TH...

PACKAGE STRUCTURE AND MEASUREMENT METHOD FOR THE PACKAGE STRUCTURE

METHOD FOR FORMING SEMICONDUCTOR PACKAGE STRUCTURE