Insulating or insulated parts

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CPC
H01L21/4803

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/4803Insulating or insulated parts

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Heat dissipating substrate comprising diamond and semiconductor int...
- Patent number 12,191,227
- Issue date Jan 7, 2025
- Electronics and Telecommunications Research Institute
- Hyung Seok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensor package and method of making an optical sensor package
- Patent number 12,176,220
- Issue date Dec 24, 2024
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Incorporating semiconductors on a polycrystalline diamond substrate
- Patent number 12,176,221
- Issue date Dec 24, 2024
- Texas State University
- Raju Ahmed
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of mechanical separation for a double layer transfer
- Patent number 12,165,900
- Issue date Dec 10, 2024
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seamless interconnect thresholds using dielectric fluid channels
- Patent number 12,154,837
- Issue date Nov 26, 2024
- Sciperio, Inc.
- Jason Benoit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, method for manufacturing semiconductor module...
- Patent number 12,148,631
- Issue date Nov 19, 2024
- Fuji Electric Co., Ltd.
- Kazunaga Onishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electronic device with flexible and stretchable substrate
- Patent number 12,096,553
- Issue date Sep 17, 2024
- Carnegie Mellon University
- Gary K. Fedder
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Metal substrates with structures formed therein and methods of maki...
- Patent number 12,087,670
- Issue date Sep 10, 2024
- LUX SEMICONDUCTORS, INC.
- Chad B. Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,062,639
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Jaekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including plurality of recesses and molding m...
- Patent number 12,057,357
- Issue date Aug 6, 2024
- Samsung Electronics Co, Ltd.
- Kyong Hwan Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded semiconductor packages and methods thereof
- Patent number 12,027,453
- Issue date Jul 2, 2024
- Georgia Tech Research Corporation
- Nobuo Ogura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,015,023
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film package and display device including film package
- Patent number 12,002,744
- Issue date Jun 4, 2024
- Samsung Display Co., Ltd.
- Myong-Soo Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplets with connection posts
- Patent number 11,990,438
- Issue date May 21, 2024
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation sheet, manufacturing method of heat dissipation sh...
- Patent number 11,967,539
- Issue date Apr 23, 2024
- Fujitsu Limited
- Shinichi Hirose
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for manufacturing a semiconductor substrate and device by bo...
- Patent number 11,961,765
- Issue date Apr 16, 2024
- Mitsubishi Electric Corporation
- Shuichi Hiza
- C30 - CRYSTAL GROWTH
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,942,408
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attached leveling control by metal stopper bumps
- Patent number 11,923,331
- Issue date Mar 5, 2024
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with a substrate comprising an embedded capacitor with side...
- Patent number 11,876,085
- Issue date Jan 16, 2024
- QUALCOMM Incorporated
- Abinash Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal transfer structures for semiconductor die assemblies
- Patent number 11,862,611
- Issue date Jan 2, 2024
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency device comprising semiconductor device and waveguid...
- Patent number 11,854,917
- Issue date Dec 26, 2023
- Infineon Technologies AG
- Ernst Seler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip package with reduced underfill area
- Patent number 11,837,476
- Issue date Dec 5, 2023
- Western Digital Technologies, Inc.
- Yazhou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector assembly and pick-up cap
- Patent number 11,830,780
- Issue date Nov 28, 2023
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- Shan-Yong Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a microelectronic device
- Patent number 11,830,777
- Issue date Nov 28, 2023
- STMicroelectronics (Rousset) SAS
- Romeric Gay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Production of optoelectronic components
- Patent number 11,784,062
- Issue date Oct 10, 2023
- OSRAM OLED GmbH
- Thomas Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal packaging with fan out wafer level processing
- Patent number 11,756,861
- Issue date Sep 12, 2023
- Cisco Technology, Inc.
- Ashley J. M. Erickson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Maskless etching of electronic substrates via precision dispense pr...
- Patent number 11,749,539
- Issue date Sep 5, 2023
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon heat-dissipation package for compact electronic devices
- Patent number 11,742,255
- Issue date Aug 29, 2023
- Gerald Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mechanical separation for a double layer transfer
- Patent number 11,742,233
- Issue date Aug 29, 2023
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure, package structure and method for manufacturing...
- Patent number 11,735,433
- Issue date Aug 22, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Customized heat dissipation from different types of integrated circ...
- Publication number 20250029888
- Publication date Jan 23, 2025
- Marvell Asia Pte Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Topside Cooling for Semiconductor Device
- Publication number 20240429120
- Publication date Dec 26, 2024
- Wolfspeed, Inc.
- Michael Lee Schuette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING METAL SUBSTRATES WITH STRUCTURES FORMED THEREIN
- Publication number 20240404922
- Publication date Dec 5, 2024
- LUX SEMICONDUCTORS, INC.
- Chad B. MOORE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-CERAMIC BONDED SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240395679
- Publication date Nov 28, 2024
- DOWA METALTECH CO., LTD.
- Ayumu OZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER FRAME AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240379638
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID DIAMOND BASED HEAT SPREADERS
- Publication number 20240363476
- Publication date Oct 31, 2024
- Phononics Ltd
- Shye Shapira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20240363515
- Publication date Oct 31, 2024
- STATS CHIPPAC SEMICONDUCTOR (JIANGYIN) CO., LTD.
- Jeonghan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240347401
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- KYONG HWAN KOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED SEMICONDUCTOR PACKAGES AND METHODS THEREOF
- Publication number 20240321703
- Publication date Sep 26, 2024
- Georgia Tech Research Corporation
- Novuo Ogura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240297166
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CIRCUIT PART AND METHOD OF MANUFACTURING THREE-DI...
- Publication number 20240282588
- Publication date Aug 22, 2024
- MAXELL, LTD.
- Akiko KITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERRACED SUPPORT STRUCTURE TO MITIGATE STACKED DIE OVERHANG DEFLECTION
- Publication number 20240274580
- Publication date Aug 15, 2024
- Micron Technology, Inc.
- Faxing CHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240219655
- Publication date Jul 4, 2024
- Intel Corporation
- Haobo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240203856
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SHUO-MAO CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETERO-JUNCTION BIPOLAR TRANSISTOR AND METHOD OF MANUFACTURING THE...
- Publication number 20240194561
- Publication date Jun 13, 2024
- Nippon Telegraph and Telephone Corporation
- Yuta Shiratori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240178125
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPLETS WITH CONNECTION POSTS
- Publication number 20240170430
- Publication date May 23, 2024
- X Display Company Technology Limited
- Carl Prevatte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
- Publication number 20240162183
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH ELECTRICAL INSULATION FEATURES AND ASSOC...
- Publication number 20240153885
- Publication date May 9, 2024
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STR...
- Publication number 20240113005
- Publication date Apr 4, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module having a double-sided heat dissipation structu...
- Publication number 20240096720
- Publication date Mar 21, 2024
- LX Semicon Co., Ltd.
- Deog Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, AND METHOD OF FABRICA...
- Publication number 20240047337
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Beoungjun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
- Publication number 20240021567
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MECHANICAL SEPARATION FOR A DOUBLE LAYER TRANSFER
- Publication number 20240021461
- Publication date Jan 18, 2024
- SOITEC
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH SCREEN-PRINTED EPOXY SPACERS A...
- Publication number 20240014083
- Publication date Jan 11, 2024
- Micron Technology, Inc.
- Hem P. Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH EXTENDED STIFFENER
- Publication number 20240006341
- Publication date Jan 4, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230369370
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIST UNDERLAYER FILM-FORMING COMPOSITION
- Publication number 20230359123
- Publication date Nov 9, 2023
- NISSAN CHEMICAL CORPORATION
- Hikaru TOKUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIAMOND-METAL COMPOSITE HIGH POWER DEVICE PACKAGES
- Publication number 20230352360
- Publication date Nov 2, 2023
- MACOM Technology Solutions Holdings, Inc.
- Quinn Don Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROEPITAXIAL STRUCTURE WITH A DIAMOND HEAT SINK
- Publication number 20230307249
- Publication date Sep 28, 2023
- Maksim Leonidovich ZANAVESKIN
- H01 - BASIC ELECTRIC ELEMENTS

Insulating or insulated parts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Heat dissipating substrate comprising diamond and semiconductor int...

Optical sensor package and method of making an optical sensor package

Incorporating semiconductors on a polycrystalline diamond substrate

Method of mechanical separation for a double layer transfer

Seamless interconnect thresholds using dielectric fluid channels

Semiconductor module, method for manufacturing semiconductor module...

Integrated electronic device with flexible and stretchable substrate

Metal substrates with structures formed therein and methods of maki...

Semiconductor package and method of fabricating the same

Semiconductor package including plurality of recesses and molding m...

Embedded semiconductor packages and methods thereof

Integrated circuit package and method of forming same

Film package and display device including film package

Chiplets with connection posts

Heat dissipation sheet, manufacturing method of heat dissipation sh...

Method for manufacturing a semiconductor substrate and device by bo...

Semiconductor structure and manufacturing method thereof

Die attached leveling control by metal stopper bumps

Package with a substrate comprising an embedded capacitor with side...

Thermal transfer structures for semiconductor die assemblies

Radio-frequency device comprising semiconductor device and waveguid...

Flip-chip package with reduced underfill area

Electrical connector assembly and pick-up cap

Method for manufacturing a microelectronic device

Production of optoelectronic components

Thermal packaging with fan out wafer level processing

Maskless etching of electronic substrates via precision dispense pr...

Silicon heat-dissipation package for compact electronic devices

Method of mechanical separation for a double layer transfer

Substrate structure, package structure and method for manufacturing...

Patents Applicationslast 30 patents

Customized heat dissipation from different types of integrated circ...

Topside Cooling for Semiconductor Device

METHOD OF MAKING METAL SUBSTRATES WITH STRUCTURES FORMED THEREIN

METAL-CERAMIC BONDED SUBSTRATE AND MANUFACTURING METHOD THEREOF

INTERPOSER FRAME AND METHOD OF MANUFACTURING THE SAME

HYBRID DIAMOND BASED HEAT SPREADERS

SEMICONDUCTOR PACKAGE STRUCTURE AND FORMING METHOD THEREOF

SEMICONDUCTOR PACKAGE

EMBEDDED SEMICONDUCTOR PACKAGES AND METHODS THEREOF

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

THREE-DIMENSIONAL CIRCUIT PART AND METHOD OF MANUFACTURING THREE-DI...

TERRACED SUPPORT STRUCTURE TO MITIGATE STACKED DIE OVERHANG DEFLECTION

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

HETERO-JUNCTION BIPOLAR TRANSISTOR AND METHOD OF MANUFACTURING THE...

WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE

CHIPLETS WITH CONNECTION POSTS

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

SEMICONDUCTOR DEVICES WITH ELECTRICAL INSULATION FEATURES AND ASSOC...

HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STR...

Semiconductor module having a double-sided heat dissipation structu...

PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, AND METHOD OF FABRICA...

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

METHOD OF MECHANICAL SEPARATION FOR A DOUBLE LAYER TRANSFER

SEMICONDUCTOR DEVICE ASSEMBLIES WITH SCREEN-PRINTED EPOXY SPACERS A...

SEMICONDUCTOR PACKAGE WITH EXTENDED STIFFENER

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

RESIST UNDERLAYER FILM-FORMING COMPOSITION

DIAMOND-METAL COMPOSITE HIGH POWER DEVICE PACKAGES

HETEROEPITAXIAL STRUCTURE WITH A DIAMOND HEAT SINK