Membership
Tour
Register
Log in
Insulating or insulated parts
Follow
Industry
CPC
H01L21/4803
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Current Industry
H01L21/4803
Insulating or insulated parts
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Heat dissipation sheet, manufacturing method of heat dissipation sh...
Patent number
11,967,539
Issue date
Apr 23, 2024
Fujitsu Limited
Shinichi Hirose
B32 - LAYERED PRODUCTS
Information
Patent Grant
Method for manufacturing a semiconductor substrate and device by bo...
Patent number
11,961,765
Issue date
Apr 16, 2024
Mitsubishi Electric Corporation
Shuichi Hiza
C30 - CRYSTAL GROWTH
Information
Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
11,942,408
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Shuo-Mao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die attached leveling control by metal stopper bumps
Patent number
11,923,331
Issue date
Mar 5, 2024
Wei-Jhih Mao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package with a substrate comprising an embedded capacitor with side...
Patent number
11,876,085
Issue date
Jan 16, 2024
QUALCOMM Incorporated
Abinash Roy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal transfer structures for semiconductor die assemblies
Patent number
11,862,611
Issue date
Jan 2, 2024
Micron Technology, Inc.
Ed A. Schrock
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Radio-frequency device comprising semiconductor device and waveguid...
Patent number
11,854,917
Issue date
Dec 26, 2023
Infineon Technologies AG
Ernst Seler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip-chip package with reduced underfill area
Patent number
11,837,476
Issue date
Dec 5, 2023
Western Digital Technologies, Inc.
Yazhou Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical connector assembly and pick-up cap
Patent number
11,830,780
Issue date
Nov 28, 2023
FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
Shan-Yong Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing a microelectronic device
Patent number
11,830,777
Issue date
Nov 28, 2023
STMicroelectronics (Rousset) SAS
Romeric Gay
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Production of optoelectronic components
Patent number
11,784,062
Issue date
Oct 10, 2023
OSRAM OLED GmbH
Thomas Schwarz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal packaging with fan out wafer level processing
Patent number
11,756,861
Issue date
Sep 12, 2023
Cisco Technology, Inc.
Ashley J. M. Erickson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Maskless etching of electronic substrates via precision dispense pr...
Patent number
11,749,539
Issue date
Sep 5, 2023
Rockwell Collins, Inc.
Richard Korneisel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Silicon heat-dissipation package for compact electronic devices
Patent number
11,742,255
Issue date
Aug 29, 2023
Gerald Ho Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of mechanical separation for a double layer transfer
Patent number
11,742,233
Issue date
Aug 29, 2023
Soitec
Marcel Broekaart
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate structure, package structure and method for manufacturing...
Patent number
11,735,433
Issue date
Aug 22, 2023
Advanced Semiconductor Engineering, Inc.
You-Lung Yen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power device embedded driver board assemblies with cooling structur...
Patent number
11,728,241
Issue date
Aug 15, 2023
Toyota Motor Engineering & Manufacturing North America, Inc.
Feng Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposer frame and method of manufacturing the same
Patent number
11,699,691
Issue date
Jul 11, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Techniques for joining dissimilar materials in microelectronics
Patent number
11,664,357
Issue date
May 30, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Gaius Gillman Fountain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out packages and methods of forming the same
Patent number
11,664,300
Issue date
May 30, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Chih-Chiang Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High resistivity wafer with heat dissipation structure and method o...
Patent number
11,658,087
Issue date
May 23, 2023
United Microelectronics Corp.
Purakh Raj Verma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High resistivity wafer with heat dissipation structure and method o...
Patent number
11,652,017
Issue date
May 16, 2023
United Microelectronics Corp.
Purakh Raj Verma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and corresponding method
Patent number
11,626,355
Issue date
Apr 11, 2023
STMicroelectronics S.r.l.
Fulvio Vittorio Fontana
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package with isolated semiconductor die and el...
Patent number
11,621,215
Issue date
Apr 4, 2023
Texas Instruments Incorporated
Enis Tuncer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ultrasonic tank and methods for uniform glass substrate etching
Patent number
11,610,783
Issue date
Mar 21, 2023
Corning Incorporated
John Tyler Keech
C03 - GLASS MINERAL OR SLAG WOOL
Information
Patent Grant
Foil-based package with distance compensation
Patent number
11,574,858
Issue date
Feb 7, 2023
Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
Erwin Yacoub-George
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip package with extended frame
Patent number
11,527,467
Issue date
Dec 13, 2022
Intel Corporation
Bok Eng Cheah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Housing for an optoelectronic device, and method for producing same...
Patent number
11,515,221
Issue date
Nov 29, 2022
Schott AG
Robert Hettler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposer for hybrid interconnect geometry
Patent number
11,508,650
Issue date
Nov 22, 2022
Intel Corporation
Jenny Shio Yin Ong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor module, method for manufacturing semiconductor module...
Patent number
11,501,980
Issue date
Nov 15, 2022
Fuji Electric Co., Ltd.
Kazunaga Onishi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STR...
Publication number
20240113005
Publication date
Apr 4, 2024
Intel Corporation
Jeremy Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor module having a double-sided heat dissipation structu...
Publication number
20240096720
Publication date
Mar 21, 2024
LX Semicon Co., Ltd.
Deog Soo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, AND METHOD OF FABRICA...
Publication number
20240047337
Publication date
Feb 8, 2024
Samsung Electronics Co., Ltd.
Beoungjun Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
Publication number
20240021567
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Jhih Mao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MECHANICAL SEPARATION FOR A DOUBLE LAYER TRANSFER
Publication number
20240021461
Publication date
Jan 18, 2024
SOITEC
Marcel Broekaart
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH SCREEN-PRINTED EPOXY SPACERS A...
Publication number
20240014083
Publication date
Jan 11, 2024
Micron Technology, Inc.
Hem P. Takiar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH EXTENDED STIFFENER
Publication number
20240006341
Publication date
Jan 4, 2024
Intel Corporation
Bok Eng CHEAH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20230369370
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Yi-Jung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RESIST UNDERLAYER FILM-FORMING COMPOSITION
Publication number
20230359123
Publication date
Nov 9, 2023
NISSAN CHEMICAL CORPORATION
Hikaru TOKUNAGA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIAMOND-METAL COMPOSITE HIGH POWER DEVICE PACKAGES
Publication number
20230352360
Publication date
Nov 2, 2023
MACOM Technology Solutions Holdings, Inc.
Quinn Don Martin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HETEROEPITAXIAL STRUCTURE WITH A DIAMOND HEAT SINK
Publication number
20230307249
Publication date
Sep 28, 2023
Maksim Leonidovich ZANAVESKIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGES HAVING REDUCED Z-HEIGHT
Publication number
20230300975
Publication date
Sep 21, 2023
Intel Corporation
Jan Proschwitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERPOSER FRAME AND METHOD OF MANUFACTURING THE SAME
Publication number
20230290761
Publication date
Sep 14, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Jiun Yi WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TECHNIQUES FOR JOINING DISSIMILAR MATERIALS IN MICROELECTRONICS
Publication number
20230253383
Publication date
Aug 10, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Gaius Gillman Fountain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRAL HEAT SLUG
Publication number
20230245942
Publication date
Aug 3, 2023
TEXAS INSTRUMENTS INCORPORATED
Kwang-Soo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH ISOLATED SEMICONDUCTOR DIE AND EL...
Publication number
20230245957
Publication date
Aug 3, 2023
TEXAS INSTRUMENTS INCORPORATED
Enis Tuncer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package, Semiconductor Die and Method for Forming a S...
Publication number
20230197644
Publication date
Jun 22, 2023
Intel Corporation
Wolfgang MOLZER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Housing, Semiconductor Module Comprising a Housing and Method for P...
Publication number
20230187291
Publication date
Jun 15, 2023
INFINEON TECHNOLOGIES AG
Ulrich Nolten
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRODE STRUCTURE INCLUDING METAL AND HEAT DISSIPATION LAYER AND...
Publication number
20230178453
Publication date
Jun 8, 2023
INDUSTRY FOUNDATION OF CHONNAM NATIONAL UNIVERSITY
Sang Hyun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE, ELECTRONIC DEVICE, AND MANUFACTURE METHOD...
Publication number
20230163043
Publication date
May 25, 2023
Huawei Technologies Co., Ltd
Ran HE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING ELECTRICAL PACKAGE
Publication number
20230106612
Publication date
Apr 6, 2023
Advanced Semiconductor Engineering, Inc.
Wen-Pin HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NITRIDE SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING NITRIDE S...
Publication number
20230083507
Publication date
Mar 16, 2023
Mitsubishi Electric Corporation
Yuki TAKIGUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE...
Publication number
20230046160
Publication date
Feb 16, 2023
Fuji Electric Co., Ltd.
Kazunaga ONISHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ASSEMBLY INCLUDING A PACKAGE LID HAVING A STEP REGION AND M...
Publication number
20230011493
Publication date
Jan 12, 2023
Taiwan Semiconductor Manufacturing Company Limited
Ping-Yin HSIEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE WITH A SUBSTRATE COMPRISING AN EMBEDDED CAPACITOR WITH SIDE...
Publication number
20220415868
Publication date
Dec 29, 2022
QUALCOMM Incorporated
Abinash ROY
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HOUSING FOR AN OPTOELECTRONIC DEVICE,AND METHOD FOR PRODUCING SAME,...
Publication number
20220384282
Publication date
Dec 1, 2022
SCHOTT AG
Robert Hettler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THIN-FILM TRANSISTOR MEMORY WITH GLASS SUPPORT AT THE BACK
Publication number
20220375939
Publication date
Nov 24, 2022
Intel Corporation
Abhishek A. Sharma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH A SCRATCH PROTECTION LAYER AND METHOD OF...
Publication number
20220359432
Publication date
Nov 10, 2022
Frank Singer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Fan-Out Packages and Methods of Forming the Same
Publication number
20220359356
Publication date
Nov 10, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Chiang Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20220328383
Publication date
Oct 13, 2022
Mitsubishi Electric Corporation
Yasutaka SHIMIZU
H01 - BASIC ELECTRIC ELEMENTS