Insulating resist or coating with special shaped edges

Industry

CPC
H05K2203/0594

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0594Insulating resist or coating with special shaped edges

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Through-hole electrode substrate
- Patent number 12,080,637
- Issue date Sep 3, 2024
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 11,362,028
- Issue date Jun 14, 2022
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin substrate and method for producing resin substrate
- Patent number 11,277,919
- Issue date Mar 15, 2022
- Murata Manufacturing Co., Ltd.
- Shinichi Araki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-hole electrode substrate
- Patent number 10,790,221
- Issue date Sep 29, 2020
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 10,580,727
- Issue date Mar 3, 2020
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate and semiconductor device using thr...
- Patent number 10,256,176
- Issue date Apr 9, 2019
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing multilayer substrate for having BGA-type c...
- Patent number 9,930,790
- Issue date Mar 27, 2018
- Denso Corporation
- Hirokazu Saitoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic circuit unit and method of manufacturing electronic circ...
- Patent number 9,735,055
- Issue date Aug 15, 2017
- Alps Elctric Co., Ltd.
- Ryo Iwasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board, method for manufacturing printed wiring board...
- Patent number 9,572,256
- Issue date Feb 14, 2017
- Ibiden Co., Ltd.
- Kazuhiro Yoshikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board having an opening with an angled surface
- Patent number 9,538,650
- Issue date Jan 3, 2017
- NGK Spark Plug Co., Ltd.
- Tomohiro Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for manufacturing same
- Patent number 9,516,751
- Issue date Dec 6, 2016
- NGK Spark Plug Co., Ltd.
- Takahiro Hayashi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Light emitting module and surface lighting device having the same
- Patent number 9,482,410
- Issue date Nov 1, 2016
- Samsung Electronics Co., Ltd.
- Ki Un Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of metal structure of flexible multi-layer sub...
- Patent number 9,398,704
- Issue date Jul 19, 2016
- PRINCO MIDDLE EAST FZE
- Chih-Kuang Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible electronic device
- Patent number 9,338,893
- Issue date May 10, 2016
- AU Optronics Corp.
- Annie Tzu-yu Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 9,210,807
- Issue date Dec 8, 2015
- Shinko Electric Industries Co., Ltd.
- Kei Imafuji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for producing wiring substrate
- Patent number 9,131,621
- Issue date Sep 8, 2015
- NGK Spark Plug Co., Ltd.
- Takahiro Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 9,035,191
- Issue date May 19, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Woon Chul Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 8,901,431
- Issue date Dec 2, 2014
- Ibiden Co., Ltd.
- Hiroyuki Nishioka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 8,756,804
- Issue date Jun 24, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Hyung Jin Jeon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board for flip-chip mounting, mounting structure of electron...
- Patent number 8,659,168
- Issue date Feb 25, 2014
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board with crossing wiring pattern
- Patent number 8,629,550
- Issue date Jan 14, 2014
- Ibiden Co., Ltd.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive interconnects
- Patent number 8,604,604
- Issue date Dec 10, 2013
- Hewlett-Packard Development Company, L.P.
- John Christopher Rudin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin sheet for circuit board and production process therefor
- Patent number 8,535,782
- Issue date Sep 17, 2013
- Sumitomo Bakelite Co., Ltd.
- Haruo Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit connecting material, film-form circuit connecting material...
- Patent number 8,501,045
- Issue date Aug 6, 2013
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Direct IMS (injection molded solder) without a mask for forming sol...
- Patent number 8,492,262
- Issue date Jul 23, 2013
- International Business Machines Corporation
- Peter A. Gruber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal structure of flexible multi-layer substrate and manufacturing...
- Patent number 8,373,070
- Issue date Feb 12, 2013
- Princo Middle East FZE
- Chih-Kuang Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 8,309,856
- Issue date Nov 13, 2012
- Ibiden Co., Ltd.
- Nobuhisa Kuroda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit connecting material, film-form circuit connecting material...
- Patent number 8,202,622
- Issue date Jun 19, 2012
- Hitachi Chemical Co., Ltd.
- Motohiro Arifuku
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit board surface structure and fabrication method thereof
- Patent number 8,164,003
- Issue date Apr 24, 2012
- Unimicron Technology Corp.
- Sao-Hsia Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit connecting method
- Patent number 8,132,319
- Issue date Mar 13, 2012
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20240404934
- Publication date Dec 5, 2024
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN SUBSTRATE AND METHOD FOR PRODUCING RESIN SUBSTRATE
- Publication number 20210120678
- Publication date Apr 22, 2021
- Murata Manufacturing Co., Ltd.
- Shinichi ARAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DRY FILM, LAYERED STRUCTURE, PRINTED WIRING BOARD, AND PROCESS FOR...
- Publication number 20140374143
- Publication date Dec 25, 2014
- TAIYO INK MFG. CO., LTD.
- Daichi Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR PRODUCING WIRING SUBSTRATE
- Publication number 20140318846
- Publication date Oct 30, 2014
- NGK SPARK PLUG CO., LTD.
- Takahiro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20140284081
- Publication date Sep 25, 2014
- Tomohiro Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140251657
- Publication date Sep 11, 2014
- Samsung Electro-mechanics Co., Ltd.
- Hyung Jin JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING MODULE AND SURFACE LIGHTING DEVICE HAVING THE SAME
- Publication number 20140160754
- Publication date Jun 12, 2014
- Samsung Electronics Co., Ltd.
- Ki Un LEE
- F21 - LIGHTING
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140151089
- Publication date Jun 5, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Woon Chul CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20140138134
- Publication date May 22, 2014
- Shinko Electric Industries Co., Ltd.
- Kei Imafuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRED CIRCUIT BOARD
- Publication number 20140048311
- Publication date Feb 20, 2014
- Jun ISHII
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20140042122
- Publication date Feb 13, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jae Mok Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURI...
- Publication number 20130329391
- Publication date Dec 12, 2013
- NEC Corporation
- Naomi ISHIZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF METAL STRUCTURE OF FLEXIBLE MULTI-LAYER SUB...
- Publication number 20120270158
- Publication date Oct 25, 2012
- Princo Corp.
- Chih-kuang Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD SURFACE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20120175265
- Publication date Jul 12, 2012
- Unimicron Technology Corp.
- Sao-Hsia Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20120152600
- Publication date Jun 21, 2012
- IBIDEN CO., LTD.
- Hiroyuki NISHIOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120073870
- Publication date Mar 29, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hyung Jin Jeon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120031658
- Publication date Feb 9, 2012
- Samsung Electro-Mechanics CO., LTD.
- Jun-Hyung SON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND MANUFACTURING METHOD OF PRINTED WIRING BOARD
- Publication number 20110290544
- Publication date Dec 1, 2011
- IBIDEN CO., LTD.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT CONNECTING MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL...
- Publication number 20110247870
- Publication date Oct 13, 2011
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT CONNECTION MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL...
- Publication number 20110247757
- Publication date Oct 13, 2011
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Direct IMS (Injection Molded Solder) Without a Mask for Forming Sol...
- Publication number 20110201194
- Publication date Aug 18, 2011
- International Business Machines Corporation
- Peter A. Gruber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL STRUCTURE OF FLEXIBLE MULTI-LAYER SUBSTRATE AND MANUFACTURING...
- Publication number 20110088929
- Publication date Apr 21, 2011
- PRINCO CORP.
- Chih-kuang Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURI...
- Publication number 20100319974
- Publication date Dec 23, 2010
- Naomi Ishizuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT CONNECTING METHOD
- Publication number 20100263208
- Publication date Oct 21, 2010
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN SHEET FOR CIRCUIT BOARD AND PRODUCTION PROCESS THEREFOR
- Publication number 20100183849
- Publication date Jul 22, 2010
- SUMITOMO BAKELITE CO., LTD.
- Haruo Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT CONNECTING MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL...
- Publication number 20090321116
- Publication date Dec 31, 2009
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND MANUFACTURING METHOD OF PRINTED WIRING BOARD
- Publication number 20090159327
- Publication date Jun 25, 2009
- IBIDEN CO., LTD.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive Interconnects
- Publication number 20090146193
- Publication date Jun 11, 2009
- Hewlett-Packard Development Company, L.P.
- John Christopher Rudin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20090114431
- Publication date May 7, 2009
- IBIDEN CO., LTD.
- Nobuhisa Kuroda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board and manufacturing method thereof
- Publication number 20090027864
- Publication date Jan 29, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Chung-Woo Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Insulating resist or coating with special shaped edges

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Through-hole electrode substrate

Through-hole electrode substrate

Resin substrate and method for producing resin substrate

Through-hole electrode substrate

Through-hole electrode substrate

Through-hole electrode substrate and semiconductor device using thr...

Method for manufacturing multilayer substrate for having BGA-type c...

Electronic circuit unit and method of manufacturing electronic circ...

Printed wiring board, method for manufacturing printed wiring board...

Wiring board having an opening with an angled surface

Wiring board and method for manufacturing same

Light emitting module and surface lighting device having the same

Manufacturing method of metal structure of flexible multi-layer sub...

Flexible electronic device

Wiring substrate

Wiring substrate and method for producing wiring substrate

Printed circuit board and method for manufacturing the same

Printed wiring board and method for manufacturing printed wiring board

Method of manufacturing printed circuit board

Wiring board for flip-chip mounting, mounting structure of electron...

Printed wiring board with crossing wiring pattern

Conductive interconnects

Resin sheet for circuit board and production process therefor

Circuit connecting material, film-form circuit connecting material...

Direct IMS (injection molded solder) without a mask for forming sol...

Metal structure of flexible multi-layer substrate and manufacturing...

Circuit board and manufacturing method thereof

Circuit connecting material, film-form circuit connecting material...

Circuit board surface structure and fabrication method thereof

Circuit connecting method

Patents Applicationslast 30 patents

THROUGH-HOLE ELECTRODE SUBSTRATE

RESIN SUBSTRATE AND METHOD FOR PRODUCING RESIN SUBSTRATE

DRY FILM, LAYERED STRUCTURE, PRINTED WIRING BOARD, AND PROCESS FOR...

WIRING SUBSTRATE AND METHOD FOR PRODUCING WIRING SUBSTRATE

WIRING SUBSTRATE

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

LIGHT EMITTING MODULE AND SURFACE LIGHTING DEVICE HAVING THE SAME

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING SUBSTRATE

WIRED CIRCUIT BOARD

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURI...

MANUFACTURING METHOD OF METAL STRUCTURE OF FLEXIBLE MULTI-LAYER SUB...

CIRCUIT BOARD SURFACE STRUCTURE AND FABRICATION METHOD THEREOF

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD AND MANUFACTURING METHOD OF PRINTED WIRING BOARD

CIRCUIT CONNECTING MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL...

CIRCUIT CONNECTION MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL...

Direct IMS (Injection Molded Solder) Without a Mask for Forming Sol...

METAL STRUCTURE OF FLEXIBLE MULTI-LAYER SUBSTRATE AND MANUFACTURING...

PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURI...

CIRCUIT CONNECTING METHOD

RESIN SHEET FOR CIRCUIT BOARD AND PRODUCTION PROCESS THEREFOR

CIRCUIT CONNECTING MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL...

PRINTED WIRING BOARD AND MANUFACTURING METHOD OF PRINTED WIRING BOARD

Conductive Interconnects

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Printed circuit board and manufacturing method thereof